Abstract: An apparatus for cryostorage and manipulation of a plurality of container units includes a cryochamber having a cryo-access port. The cryochamber is electrically cooled at cryogenic temperatures. A unit holder is located inside the cryochamber and is configured to hold a plurality of container units. A user access area is provided for selectively permitting access to a chosen container unit by an authenticated user who has been authenticated by the apparatus. A motive grasper is provided for selectively removing the chosen container unit from the cryochamber through the cryo-access port, and selectively placing the chosen container unit into the user access area.

Abstract: A word line regulator provides a write word line voltage for an asserted word line and includes a write replica circuit, a reference current path, and a regulator circuit. The write replica circuit is a replica of a write path for writing from a low to high resistance value of a resistive memory element of a memory cell. The word line regulator regulates the word line voltage at a value during the write operation of a low to high resistance value such that a select transistor of the memory cell is used as a source follower to regulate a first node of a resistive element of the memory cell being written. The first node is at a higher write voltage than a second node of the resistive element during the write operation, and the first node is located in a write path between the select transistor and the second node.

Abstract: A method of forming a flash memory cell includes forming a first hard mask and a second hard mask on a substrate. A select gate is formed as a spacer around the first hard mask. A charge storage layer is formed over the first and second hard masks and the select gate. A control gate is formed as a spacer around the second hard mask. A recess in the control gate is filled with a dielectric material. The recess is formed between a curved sidewall of the control gate and a sidewall of the charge storage layer directly adjacent the curved sidewall of the control gate.

Abstract: A method of forming a flash memory cell includes forming a first hard mask and a second hard mask on a substrate. A select gate is formed as a spacer around the first hard mask. A charge storage layer is formed over the first and second hard masks and the select gate. A control gate is formed as a spacer around the second hard mask. A recess in the control gate is filled with a dielectric material. The recess is formed between a curved sidewall of the control gate and a sidewall of the charge storage layer directly adjacent the curved sidewall of the control gate.

Abstract: A method of forming a flash memory cell includes forming a first hard mask and a second hard mask on a substrate. A select gate is formed as a spacer around the first hard mask. A charge storage layer is formed over the first and second hard masks and the select gate. A control gate is formed as a spacer around the second hard mask. A recess in the control gate is filled with a dielectric material. The recess is formed between a curved sidewall of the control gate and a sidewall of the charge storage layer directly adjacent the curved sidewall of the control gate.

Abstract: An output circuit, between a first power supply terminal and a second power supply terminal, receives a first logic signal that switches between a first logic state based on a voltage at the first power supply terminal and a second logic state based on a voltage at the second power supply terminal and provides a second logic signal, complementary to the first logic signal. A level translator is in a second power supply domain configured to have a second voltage differential between a third power supply terminal and a fourth power supply terminal, wherein the second voltage differential is greater than the first voltage differential. The level translator is designed so that it may be implemented using a subset of the transistors that have the shortest channel length and narrowest channel width.

Abstract: An output circuit, between a first power supply terminal and a second power supply terminal, receives a first logic signal that switches between a first logic state based on a voltage at the first power supply terminal and a second logic state based on a voltage at the second power supply terminal and provides a second logic signal, complementary to the first logic signal. A level translator is in a second power supply domain configured to have a second voltage differential between a third power supply terminal and a fourth power supply terminal, wherein the second voltage differential is greater than the first voltage differential. The level translator is designed so that it may be implemented using a subset of the transistors that have the shortest channel length and narrowest channel width.

Abstract: A method of forming a flash memory cell includes forming a first hard mask and a second hard mask on a substrate. A select gate is formed as a spacer around the first hard mask. A charge storage layer is formed over the first and second hard masks and the select gate. A control gate is formed as a spacer around the second hard mask. A recess in the control gate is filled with a dielectric material. The recess is formed between a curved sidewall of the control gate and a sidewall of the charge storage layer directly adjacent the curved sidewall of the control gate.

Abstract: A compensated hysteresis circuit comprises a hysteresis circuit including an output node and a first control transistor. The first control transistor provides feedback to the hysteresis circuit. A temperature and voltage compensation circuit includes a self-biasing threshold control circuit including an input coupled to the output node of the hysteresis circuit, and a first trim transistor coupled between the first control transistor of the hysteresis circuit and the self-biasing threshold control circuit.

Abstract: A compensated hysteresis circuit comprises a hysteresis circuit including an output node and a first control transistor. The first control transistor provides feedback to the hysteresis circuit. A temperature and voltage compensation circuit includes a self-biasing threshold control circuit including an input coupled to the output node of the hysteresis circuit, and a first trim transistor coupled between the first control transistor of the hysteresis circuit and the self-biasing threshold control circuit.