Abstract: An embodiment method for classifying objects around a vehicle includes generating a dynamic occupancy grid map including a plurality of cells including point data corresponding to each of a plurality of objects located around the vehicle and velocity vector information of the point data, based on LiDAR data received from a LiDAR sensor of the vehicle and information related to movement of the vehicle, determining a cluster corresponding to each of the plurality of objects on the dynamic occupancy grid map using a clustering technique, and classifying an object corresponding to the cluster into a static object or a dynamic object, based on a region size of the cluster and velocity vector information included in cells belonging to the cluster.

Abstract: A mode conversion apparatus includes a first freeform-surface mirror to reflect incident light provided from a front-end optical system and output the reflected light in a first direction, and a second freeform-surface mirror to reflect the reflected light and output mode-converted light in a second direction where surface shapes of the first and second mirrors are determined based on a freeform-surface coefficient determined by at least five optical parameters of a distance from the first mirror to a confocal point of the first mirror and the second mirror, a distance from the confocal point to the second mirror, a distance from a waist of the incident light to the first mirror, a distance from the second mirror to a waist of the mode-converted light, and an incident angle of the incident light for the first mirror and an incident angle of the reflected light for the second mirror.

Abstract: An object tracking apparatus and method are provided. The object tracking apparatus includes a sensor device that obtains surrounding information of a vehicle and a processor that tracks an object outside the vehicle based on the surrounding information obtained by the sensor device. The processor generates a grid map based on the surrounding information, deep-learns the grid map to obtain a classification object, detects an occupancy grid from the grid map and obtains a grid object based on clustering the occupancy grid, and fuses the classification object with the grid object to track the object.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50:4.20?(|Sv|)/Sz×P (%)?5.50.

Abstract: The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.

Abstract: An embodiment collision avoidance control method with an autonomous driving control system includes generating a grid map by storing vehicle information including position and velocity vectors of a vehicle and object information including position and velocity vectors of an object sensed around the vehicle in a grid cell corresponding to an area occupied by the vehicle and the object and determining, as a collision risk area, an area where a grid cell occupied by the vehicle for each reference time set based on the vehicle information overlaps a grid cell occupied by the object for each reference time predicted based on the object information, to control avoidance of the collision risk area.

Abstract: The present disclosure provides a polishing pad, which may maintain polishing performances required for a polishing process, such as a removal rate and a polishing profile, minimize defects that may occur on a wafer during the polishing process, and polish layers of different materials so as to have the same level of flatness even when the layers are polished at the same time, and a method for producing the polishing pad. In addition, according to the present disclosure, it is possible to determine a polishing pad, which shows an optimal removal rate selectivity along with excellent performance in a CMP process, through the physical property values of the polishing pad without a direct polishing test.

Abstract: The present disclosure relates to a display device, and one or more embodiments of the present disclosure provides a display device including: a first substrate provided with a main surface and a side surface that face different directions and are connected to each other; a wire disposed on the main surface of the first substrate and including a connection part; a connection conductive part including a side conductive part disposed on the side surface of the first substrate, and an inner conductive part that is connected to the side conductive part, is disposed on the main surface of the first substrate, and is electrically connected to the connection part; and a driving circuit part including a driving substrate disposed on the side conductive part, and a conductive protrusion that protrudes in a direction not parallel to a main surface of the driving substrate, wherein the protrusion is disposed on the main surface of the first substrate, disposed inside the inner conductive part, and is electrically connec

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: An embodiment method for classifying objects around a vehicle includes generating a dynamic occupancy grid map including a plurality of cells including point data corresponding to each of a plurality of objects located around the vehicle and velocity vector information of the point data, based on LiDAR data received from a LiDAR sensor of the vehicle and information related to movement of the vehicle, determining a cluster corresponding to each of the plurality of objects on the dynamic occupancy grid map using a clustering technique, and classifying an object corresponding to the cluster into a static object or a dynamic object, based on a region size of the cluster and velocity vector information included in cells belonging to the cluster.

Abstract: A method for providing contents includes receiving a selection request to view specific contents, from an electronic device; providing a plurality of items corresponding to a plurality of episodes included in the specific contents, in response to the selection request; and performing one of a first process and a second process, related to a provision of the specific episode, according to a product type of the specific episode, in response to a selection of one of the plurality of items through the electronic device.

Abstract: A display device includes including emission areas, a non-emission area. Light emitting elements are disposed on a substrate in the emission areas. A bank is disposed on the substrate in the non-emission area of the substrate and includes openings corresponding to the emission areas. Color conversion patterns are disposed in the openings of the bank and converts a wavelength band of light incident from the light emitting elements to emit light. Organic patterns are disposed on the color conversion patterns and are separated from each other. Color filters are disposed on the organic patterns. The color filters are sequentially stacked in a space between the organic patterns in the non-emission area.

Abstract: The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.

Abstract: Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.

Abstract: Provided are a polishing device including: a surface plate; a polishing pad mounted on the surface plate; a carrier for accommodating a polishing object; and a slurry supply unit including at least one nozzle, wherein the carrier performs a vibrating motion in a trajectory from the center of the surface plate to the end of the surface plate, and the slurry supply unit performs a vibrating motion at the same trajectory and speed as those of the vibrating motion of the carrier, as a polishing device which includes a slurry supply unit enabling subdivided driving in the supply of a polishing slurry, and in which the driving of the slurry supply unit has an advantage enabling optimized driving in an organic relationship between rotation and/or vibrating motion of the carrier and the surface plate and vertical pressurization conditions, etc. for the polishing surface of the carrier.