Abstract: A multilayer electronic component according to an exemplary embodiment of the present disclosure may control connectivity of an end of an internal electrode, thereby suppressing occurrence of a short circuit between the internal electrodes, reduced capacitance or lower breakdown voltage. The internal electrode may include a plurality of conductor portions and a plurality of cut-off portions.

Abstract: An embodiment collision avoidance control method with an autonomous driving control system includes generating a grid map by storing vehicle information including position and velocity vectors of a vehicle and object information including position and velocity vectors of an object sensed around the vehicle in a grid cell corresponding to an area occupied by the vehicle and the object and determining, as a collision risk area, an area where a grid cell occupied by the vehicle for each reference time set based on the vehicle information overlaps a grid cell occupied by the object for each reference time predicted based on the object information, to control avoidance of the collision risk area.

Abstract: Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a first gate stack structure including a first dielectric pattern and a first conductive pattern that are alternately stacked with each other, a memory channel structure including a first memory portion that penetrates the first gate stack structure, a through contact including a first through portion at a level the same as a level of the first memory portion, and a connection contact including a first connection portion at a level the same as the level of the first memory portion and the level of the first through portion. A minimum width of the first memory portion is less than a minimum width of the first through portion and a minimum width of the first connection portion.

Abstract: The present disclosure provides a polishing pad, which may maintain polishing performances required for a polishing process, such as a removal rate and a polishing profile, minimize defects that may occur on a wafer during the polishing process, and polish layers of different materials so as to have the same level of flatness even when the layers are polished at the same time, and a method for producing the polishing pad. In addition, according to the present disclosure, it is possible to determine a polishing pad, which shows an optimal removal rate selectivity along with excellent performance in a CMP process, through the physical property values of the polishing pad without a direct polishing test.

Abstract: The present disclosure relates to a preparation method of a super absorbent polymer non-woven fabric and super absorbent polymer fibers prepared therefrom. According to the preparation method of the present disclosure, it is possible to provide super absorbent polymer fibers exhibiting high flexibility and fast absorption rate in the form of long fibers.

Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.

Abstract: Proposed are counter-based selective row hammer refresh apparatus and method for row hammer prevention and, more particularly, proposed are an apparatus and a method for reducing energy consumption of dynamic random access memory (DRAM) by improving counter-based algorithms for solving a row hammer problem when applying a refresh management (RFM) command that is a new command applied to the latest DRAM standards, such as DDR5, LPDDR5, and the like.

Abstract: The present disclosure relates to a display device, and one or more embodiments of the present disclosure provides a display device including: a first substrate provided with a main surface and a side surface that face different directions and are connected to each other; a wire disposed on the main surface of the first substrate and including a connection part; a connection conductive part including a side conductive part disposed on the side surface of the first substrate, and an inner conductive part that is connected to the side conductive part, is disposed on the main surface of the first substrate, and is electrically connected to the connection part; and a driving circuit part including a driving substrate disposed on the side conductive part, and a conductive protrusion that protrudes in a direction not parallel to a main surface of the driving substrate, wherein the protrusion is disposed on the main surface of the first substrate, disposed inside the inner conductive part, and is electrically connec

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: An embodiment method for classifying objects around a vehicle includes generating a dynamic occupancy grid map including a plurality of cells including point data corresponding to each of a plurality of objects located around the vehicle and velocity vector information of the point data, based on LiDAR data received from a LiDAR sensor of the vehicle and information related to movement of the vehicle, determining a cluster corresponding to each of the plurality of objects on the dynamic occupancy grid map using a clustering technique, and classifying an object corresponding to the cluster into a static object or a dynamic object, based on a region size of the cluster and velocity vector information included in cells belonging to the cluster.

Abstract: A method for providing contents includes receiving a selection request to view specific contents, from an electronic device; providing a plurality of items corresponding to a plurality of episodes included in the specific contents, in response to the selection request; and performing one of a first process and a second process, related to a provision of the specific episode, according to a product type of the specific episode, in response to a selection of one of the plurality of items through the electronic device.

Abstract: A display device includes including emission areas, a non-emission area. Light emitting elements are disposed on a substrate in the emission areas. A bank is disposed on the substrate in the non-emission area of the substrate and includes openings corresponding to the emission areas. Color conversion patterns are disposed in the openings of the bank and converts a wavelength band of light incident from the light emitting elements to emit light. Organic patterns are disposed on the color conversion patterns and are separated from each other. Color filters are disposed on the organic patterns. The color filters are sequentially stacked in a space between the organic patterns in the non-emission area.

Abstract: The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.

Abstract: Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.

Abstract: The present disclosure is intended to provide, as a polishing pad to which a window for an endpoint detection is applied, and in which the window is capable of providing improved polishing performance in terms of preventing defects, etc., by a specific structure due to the window, rather than negatively affecting polishing performance as a local heterogeneous component on the polishing pad, a polishing pad including: a polishing layer including a first surface that is a polishing surface and a second surface that is a rear surface thereof, and containing a first through-hole penetrating from the first surface to the second surface; a window disposed in the first through-hole; and a void between a side surface of the first through-hole and a side surface of the window, and a method for manufacturing a semiconductor device by applying the same.

Abstract: Provided are a polishing device including: a surface plate; a polishing pad mounted on the surface plate; a carrier for accommodating a polishing object; and a slurry supply unit including at least one nozzle, wherein the carrier performs a vibrating motion in a trajectory from the center of the surface plate to the end of the surface plate, and the slurry supply unit performs a vibrating motion at the same trajectory and speed as those of the vibrating motion of the carrier, as a polishing device which includes a slurry supply unit enabling subdivided driving in the supply of a polishing slurry, and in which the driving of the slurry supply unit has an advantage enabling optimized driving in an organic relationship between rotation and/or vibrating motion of the carrier and the surface plate and vertical pressurization conditions, etc. for the polishing surface of the carrier.

Abstract: The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.

Abstract: The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad, and the present disclosure can prevent an error in detecting the end point due to the window in the polishing pad by minimizing the effect on transmittance according to the surface roughness of the window in the polishing pad in the polishing process, and allows the fluidity and loading rate of the polishing slurry in the polishing process to be implemented at similar levels by maintaining the surface roughness difference between the polishing layer and the window in the polishing pad within the predetermined range, thereby enabling the problem of deterioration of polishing performance due to the surface difference between the polishing layer and the window to be prevented. Further, a method for manufacturing a semiconductor device to which a polishing pad is applied may be provided.

Abstract: An acoustic resonator comprises a substrate, a resonant portion disposed on the substrate and in which a first electrode, a piezoelectric layer, and a second electrode are stacked, a protective layer disposed on an upper portion of the resonant portion, and a hydrophobic layer formed on the protective layer, and the protective layer comprises a first protective layer stacked on the second electrode and a second protective layer stacked on the first protective layer, wherein a density of the second protective layer is higher than a density of the first protective layer.