Abstract: Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.

Abstract: The present disclosure is intended to provide, as a polishing pad to which a window for an endpoint detection is applied, and in which the window is capable of providing improved polishing performance in terms of preventing defects, etc., by a specific structure due to the window, rather than negatively affecting polishing performance as a local heterogeneous component on the polishing pad, a polishing pad including: a polishing layer including a first surface that is a polishing surface and a second surface that is a rear surface thereof, and containing a first through-hole penetrating from the first surface to the second surface; a window disposed in the first through-hole; and a void between a side surface of the first through-hole and a side surface of the window, and a method for manufacturing a semiconductor device by applying the same.

Abstract: Provided are a polishing device including: a surface plate; a polishing pad mounted on the surface plate; a carrier for accommodating a polishing object; and a slurry supply unit including at least one nozzle, wherein the carrier performs a vibrating motion in a trajectory from the center of the surface plate to the end of the surface plate, and the slurry supply unit performs a vibrating motion at the same trajectory and speed as those of the vibrating motion of the carrier, as a polishing device which includes a slurry supply unit enabling subdivided driving in the supply of a polishing slurry, and in which the driving of the slurry supply unit has an advantage enabling optimized driving in an organic relationship between rotation and/or vibrating motion of the carrier and the surface plate and vertical pressurization conditions, etc. for the polishing surface of the carrier.

Abstract: The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.

Abstract: The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad, and the present disclosure can prevent an error in detecting the end point due to the window in the polishing pad by minimizing the effect on transmittance according to the surface roughness of the window in the polishing pad in the polishing process, and allows the fluidity and loading rate of the polishing slurry in the polishing process to be implemented at similar levels by maintaining the surface roughness difference between the polishing layer and the window in the polishing pad within the predetermined range, thereby enabling the problem of deterioration of polishing performance due to the surface difference between the polishing layer and the window to be prevented. Further, a method for manufacturing a semiconductor device to which a polishing pad is applied may be provided.

Abstract: An acoustic resonator comprises a substrate, a resonant portion disposed on the substrate and in which a first electrode, a piezoelectric layer, and a second electrode are stacked, a protective layer disposed on an upper portion of the resonant portion, and a hydrophobic layer formed on the protective layer, and the protective layer comprises a first protective layer stacked on the second electrode and a second protective layer stacked on the first protective layer, wherein a density of the second protective layer is higher than a density of the first protective layer.

Abstract: The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.

Abstract: A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50: 4.20?(|Sv|)/Sz×P (%)?5.50.

Abstract: An electric compressor system for a vehicle includes: an electric motor having a rotor and a motor shaft which selectively rotate in a first rotation direction or a second rotation direction; an external rotation shaft extending from the motor shaft of the electric motor; a first compressor unit connected to the external rotation shaft and selectively compressing a first fluid according to the rotation direction of the external rotation shaft; and a second compressor unit connected to the external rotation shaft and selectively compressing a second fluid according to the rotation direction of the external rotation shaft, wherein the first compressor unit and the second compressor unit are sequentially arranged on the external rotation shaft, the first compressor unit is fluidly connected to a first fluid system, and the second compressor unit is fluidly connected to a second fluid system.

Abstract: The present disclosure provides a polishing pad, which may maintain polishing performances required for a polishing process, such as a removal rate and a polishing profile, minimize defects that may occur on a wafer during the polishing process, and polish layers of different materials so as to have the same level of flatness even when the layers are polished at the same time, and a method for producing the polishing pad. In addition, according to the present disclosure, it is possible to determine a polishing pad, which shows an optimal removal rate selectivity along with excellent performance in a CMP process, through the physical property values of the polishing pad without a direct polishing test.

Abstract: Disclosed herein are a polyamide-imide film which is transparent and exhibits superior mechanical properties such as surface hardness, etc. and a method of preparing the same. The polyamide-imide film a copolymer of an aromatic diamine, an aromatic dianhydride, and an aromatic dicarbonyl compound, wherein the aromatic diamine and the aromatic dianhydride forms an imide unit; the aromatic diamine and the aromatic dicarbonyl compound forms an amide unit; and the amide unit accounts for 50-70 mol % of 100 mol % of the units of the copolymer, thereby exhibiting transparency and superior mechanical properties including surface hardness.

Abstract: The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.

Abstract: A method for providing contents includes receiving a selection request to view specific contents, from an electronic device; providing a plurality of items corresponding to a plurality of episodes included in the specific contents, in response to the selection request; and performing one of a first process and a second process, related to a provision of the specific episode, according to a product type of the specific episode, in response to a selection of one of the plurality of items through the electronic device.

Abstract: A liquid crystal display includes: a gate line connected to a gate electrode; a semiconductor layer disposed on the gate line and including silicon; an ohmic contact layer disposed on the semiconductor layer; and a data conductor disposed on the ohmic contact layer. The semiconductor layer includes a source region, a drain region, and a channel region disposed between the source region and the drain region. The data conductor includes a data line transmitting a data signal, a source electrode corresponding to the source region, and a drain electrode corresponding to the drain region. A channel step of the semiconductor layer is a height difference between an upper surface in the source region or the drain region and an upper surface in the channel region. The upper surface in the source region or the drain region has a maximum height of the semiconductor layer.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: The present invention relates to a method for providing a mixed reality service by a server and a system for performing the same, the method comprising the steps of: generating a mixed reality conference room for arbitrary three-dimensional modeling data; receiving tracking information collected by at least one terminal participating in the mixed reality conference room; generating a virtual image for the three-dimensional modeling data and at least one object, on the basis of the tracking information; and transmitting the virtual image to the at least one terminal, wherein the tracking information includes space identification information of a reality space of each terminal and motion information of each terminal, and the virtual image is synthesized with a reality image in the at least one terminal so as to be displayed as a mixed reality image.

Abstract: Disclosed is a system for integrally treating a composite waste gas including nitrogen oxides (NOx and N2O), chlorofluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), hydrofluorocarbons (HFCs), and perfluorinated compounds (PFCs). The system includes a first wet processor configured to wash and adsorb dust including gases, SOx, and ash dissolved in water, a decomposing reactor configured to receive waste gas processed in the first wet processor and process nitrogen oxides (NOx and N2O), fluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), hydrofluorocarbons (HFCs), and perfluorinated compounds (PFCs) in the waste gas, and a second wet processor configured to receive the waste gas processed in the decomposing reactor and wash and adsorb the received waste gas. The system can efficiently treat a large amount of composite waste gas.

Abstract: Disclosed is a method and apparatus that may provide predetermined partial content of content provided from a content providing server to a user terminal by controlling the partial content based on an interaction of a user or synthesizing new content with the partial content, and by displaying the controlled content or the synthesized content.

Abstract: An electric compressor system for a vehicle includes: an electric motor having a rotor and a motor shaft which selectively rotate in a first rotation direction or a second rotation direction; an external rotation shaft extending from the motor shaft of the electric motor; a first compressor unit connected to the external rotation shaft and selectively compressing a first fluid according to the rotation direction of the external rotation shaft; and a second compressor unit connected to the external rotation shaft and selectively compressing a second fluid according to the rotation direction of the external rotation shaft, wherein the first compressor unit and the second compressor unit are sequentially arranged on the external rotation shaft, the first compressor unit is fluidly connected to a first fluid system, and the second compressor unit is fluidly connected to a second fluid system.