Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

Abstract: Methods for coating a glass-based article, for example a cover glass, with a coating layer that is not deposited on the perimeter edge of the glass-based article. The methods may include direct patterning of a sacrificial material over a first region on a top surface the glass-based article but not a second region on the top surface of the glass-based article. The first region includes at least a portion of a perimeter edge of the glass-based article that is to be protected from deposition of the coating layer. After direct patterning of a sacrificial material and deposition of a coating layer, the sacrificial material may be removed such that the coating layer is disposed on the second region on the top surface of the glass-based article and not the first region. These methods may be used to make a glass-based article with non-edge-to-edge coating layers.

Abstract: Methods for coating a glass-based article, for example a cover glass, with a coating layer that is not deposited on the perimeter edge of the glass-based article. The methods may include disposing a mask having an eave over a glass-based article to protect perimeter portions of the glass-based article from coating of the coating layer during a deposition process. The eave may be dimensioned to form a coating layer having non-uniform coating thickness region around the edge of the coating layer that is not visible to the naked eye on the surface of a glass-based article. The methods may be used to make a glass-based article with non-edge-to-edge coating layers.

Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.

Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.

Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.

Abstract: A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.

Abstract: A cutting method and cutting stage of toughened glass with which a piece of toughened glass is divided into unit pieces of toughened glass. The cutting method cuts a piece of toughened glass which is strengthened by forming a compressive stress in the surface of a raw glass plate. The method includes the steps of reducing the central tension inside a cutting portion of the piece of toughened glass that is to be cut by concavely bending the cutting portion; and cutting the piece of toughened glass by forming a median crack in the cutting portion.

Abstract: A bulk acoustic wave resonator includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.

Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.

Abstract: The present invention relates to a method for preparing a stereoblock polylactide, comprising: a step of obtaining a first reaction mixture with a monomer conversion rate of 80 to 95% by adding a catalyst to a D-lactide and growing a PDLA chain; a step of obtaining a second reaction mixture with a monomer conversion rate of 80 to 95% by adding an L-lactide to the first reaction mixture and growing a racemic PDLLA chain at the end of the PDLA chain; and a step of further adding an L-lactide to the second reaction mixture and growing a PLLA chain at the end of the PDLLA chain through a polymerization reaction.

Abstract: A bulk acoustic filter device includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer disposed below the lower electrode and in the cavity portion.

Abstract: A bulk acoustic wave filter device includes a resonating part, an electrode connecting part, a first layer, and a second layer. The resonating part is disposed on a substrate, and the electrode connecting part connects electrodes of the resonating part. The first layer is disposed on the substrate, and the second layer is disposed on regions of the first layer, other than a lower portion of the electrode connecting part.

Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.

Abstract: The present invention relates to a method for preparing a stereoblock polylactide, comprising: a step of obtaining a first reaction mixture with a monomer conversion rate of 80 to 95% by adding a catalyst to a D-lactide and growing a PDLA chain; a step of obtaining a second reaction mixture with a monomer conversion rate of 80 to 95% by adding an L-lactide to the first reaction mixture and growing a racemic PDLLA chain at the end of the PDLA chain; and a step of further adding an L-lactide to the second reaction mixture and growing a PLLA chain at the end of the PDLLA chain through a polymerization reaction.

Abstract: An acoustic resonator includes a resonating part including a piezoelectric layer located on a first electrode and a second electrode located on the piezoelectric layer; and a frame located on the second electrode along an edge of the resonating part, wherein the frame includes an inner surface and an outer surface, and the inner surface includes two inclined surfaces.

Abstract: An acoustic resonator includes: a substrate; a resonance part mounted on the substrate and including resonance part electrodes, the resonance part being configured to generate acoustic waves; a cavity disposed between the resonance part and the substrate; a frame part disposed on at least one electrode among the resonance part electrodes, and being configured to reflect the acoustic waves; and a connection electrode configured to connect the at least one electrode to an external electrode, and having a thickness less than a thickness of the at least one electrode.

Abstract: There is provided a piezoelectric actuator including: a piezoelectric member having a multilayer structure; an external electrode formed on an outer surface of the piezoelectric member; and an intermediate electrode formed between layers of the piezoelectric members and having an area smaller than that of the external electrode.

Abstract: A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.

Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.