Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.

Abstract: A display device having a display area and a non-display area disposed in the vicinity of the display area and including a bending area, the display device includes: a substrate; a first organic insulating layer disposed on the substrate; and a trench structure disposed in the non-display area, the trench structure including sidewalls formed by the first organic insulating layer and a bottom surface located in the bending area, wherein the bending area is disposed on a side of the display area.

Abstract: An electronic device for transmitting configuration information and an operation method thereof are provided. In various embodiments, an electronic device may receive a signal including information related to a media device, from the media device. The electronic device may identify configuration information usable for setting a configuration of the media device, in response to the signal. A level (such a security level or a priority level) of the configuration information may be identified. It may then be determined whether it is permissible for the configuration information to be transmitted to the media device, based on the identified level of the configuration information. If so, the configuration information may be transmitted to the media device.

Abstract: A memory device includes: a plurality of first control signal interfaces respectively corresponding to a plurality of channels, and suitable for receiving control signals from a host; a plurality of first data interfaces respectively corresponding to the plurality of channels, and suitable for exchanging data and data strobe signals with the host; a second control signal interface suitable for receiving control signals through a selected one of the first control signal interfaces and a selected one of the channels and outputting the received control signals, in a monitoring mode; and a second data interface suitable for receiving a part of the data and data strobe signals exchanged through a selected one of the first data interfaces and the selected channel, and outputting the received part of the data and data strobe signals, in the monitoring mode.

Abstract: A wafer burn-in test circuit may be provided. The wafer burn-in test circuit may include a timing correction unit configured to generate a plurality of timing-compensated input signals by synchronizing a plurality of pulse signals generated according to a plurality of input signals with an input signal among the plurality of input signals. The wafer burn-in test circuit may include a wafer burn-in signal decoding unit configured to generate a plurality of decoding signals by decoding the plurality of timing-compensated input signals and output the plurality of decoding signals as a plurality of wafer burn-in signals by latching the plurality of decoding signals.

Abstract: An embodiment of the present invention relates to a lighting device comprising: a light source unit comprising a plurality of light emitting elements; a conversion unit for converting light emitted from the light source unit; a reflection unit for reflecting light which has passed through the conversion unit; and a half mirror member, which is disposed on the top of the reflection unit, for transmitting a portion of incident light and reflecting a portion of the incident light. The conversion unit includes an optical pattern for selectively transmitting light emitted from the light source unit, the light source unit is disposed on a periphery portion of the reflection unit, and the height of the center portion of the reflection unit is greater than the height of the periphery portion thereof.

Abstract: An etching composition may include a peracetic acid mixture, a fluorine compound, an organic solvent (e.g., acetate-series organic solvent), and water. The etching composition may be used to selectively etch silicon-germanium (SiGe).

Abstract: A memory device includes: a plurality of data pads; a data distribution circuit suitable for distributing data received through some data pads of the plurality of data pads to a first data bus, and distributing data received through the other data pads to a second data bus, in a first mode; a first channel region suitable for storing data obtained by copying the data of the first data bus at a predetermined ratio of 1-N where N is an integer equal to or more than 2; and a second channel region suitable for storing data obtained by copying the data of the second data bus at the predetermined ratio of 1:N.

Abstract: A clock monitoring circuit includes: a sampling circuit suitable for sampling a monitoring target clock in synchronization with a sampling clock; a first counter circuit suitable for counting the number of times that the sampling circuit samples the monitoring target clock at a predetermined level; and a second counter circuit suitable for counting the number of times that the sampling circuit performs sampling.

Abstract: Disclosed are a pattern light irradiating device and an inspection apparatus using the same. The pattern light irradiating device includes first and second pattern light sources installed on a frame having a plurality of through-holes. Each of the through-holes is formed along a single optical axis. The first pattern light source is configured to irradiate first pattern light having a fixed pitch. The second pattern light source is configured to irradiate second pattern light having a variable pitch.

Abstract: A light emitting diode (LED) module array including: a plurality of LED groups connected to each other in series, each LED group including a single rod-shaped LED module or a plurality of LED modules connected to each other in parallel, wherein a number of LED modules included in a first LED group is different from a number of LED modules included in a second LED group.

Abstract: An etching composition selectively removes a titanium nitride film from a stacked conductive film structure including a titanium nitride (TiN) film and a tantalum nitride (TaN) film. The etching composition configured to etch titanium nitride (TiN) includes 5 wt % to 30 wt % of hydrogen peroxide, 15 wt % to 50 wt % of acid compound, and 0.001 wt % to 5 wt % of corrosion inhibitor, with respect to a total weight of the etching composition, wherein the acid compound includes at least one of phosphoric acid (H3PO4), nitric acid (HNO3), hydrochloric acid (HCl), hydroiodic acid (HI), hydrobromic acid (HBr), perchloric acid (HNO4), silicic acid (H2SiO3), boric acid (H3BO3), acetic acid (CH3COOH), propionic acid (C2H5COOH), lactic acid (CH3CH(OH)COOH), and glycolic acid (HOCH2COOH).

Abstract: A semiconductor light emitting device includes a plurality of light emitting cells having first and second surface opposing each other, the plurality of light emitting cells including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer therebetween, an insulating layer on the second surface of the plurality of light emitting cells and having first and second openings defining a first contact region of the first conductivity-type semiconductor layer and a second contact region of the second conductivity-type semiconductor layer, respectively, a connection electrode on the insulating layer and connecting a first contact region and a second contact region of adjacent light emitting cells, a transparent support substrate on the first surface of the plurality of light emitting cells, and a transparent bonding layer between the plurality of light emitting cells and the transparent support substrate.

Abstract: A wafer burn-in test circuit may be provided. The wafer burn-in test circuit may include a timing correction unit configured to generate a plurality of timing-compensated input signals by synchronizing a plurality of pulse signals generated according to a plurality of input signals with an input signal among the plurality of input signals. The wafer burn-in test circuit may include a wafer burn-in signal decoding unit configured to generate a plurality of decoding signals by decoding the plurality of timing-compensated input signals and output the plurality of decoding signals as a plurality of wafer burn-in signals by latching the plurality of decoding signals.

Abstract: A clock monitoring circuit includes: a sampling circuit suitable for sampling a monitoring target clock in synchronization with a sampling clock; a first counter circuit suitable for counting the number of times that the sampling circuit samples the monitoring target clock at a predetermined level; and a second counter circuit suitable for counting the number of times that the sampling circuit performs sampling.

Abstract: There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.

Abstract: According to an exemplary embodiment of the present invention, disclosed is a method for synchronizing query results between databases executed in a first database server. The method may include: determining synchronization of a materialized view present in a second database server which is remotely located from the first database server in which the materialized view refers to a master table present in the first database server and the first database server and the second database server are heterogeneous; generating a synchronization command to be transmitted to the second database server in response to determination of synchronization; and transmitting the generated synchronization command to the second database server to allow the second database server to synchronize the materialized view present in the second database server and the master table present in the first database server.

Abstract: Disclosed is a system for integrated remote control of wireless lighting devices and wireless electric/electronic devices in a wireless network environment. In the wireless network environment, a management server transmits a lighting control command and a device control command for individually driving and controlling wireless lighting devices and wireless electric/electronic devices to the wireless lighting devices on a main wireless node (i.e., first wireless node) over a communication network. Therefore, a user can wirelessly and remotely drive and control various wireless electric/electronic devices as well as wireless lighting devices through the management server without time and place constrains.

Abstract: An apparatus for mounting a vehicle roof rack, provided on a roof of a vehicle, includes a roof rack rail, a roof rack bolt fixed to the roof rack rail, a roof rack nut fastened to the roof rack bolt, a roof rack pad coupled to the roof rack rail, a spacer mounted to a roof panel of the vehicle, and an in-line nut for fixing the spacer.

Abstract: A method of making a side step of a vehicle includes a bracket that is mounted to a vehicle body and an insert main body that bears weight of passengers. The bracket and the insert main body are integrally provided by using a CFT material through insert-molding, and an injection molding resin is coupled to all over the insert main body where the bracket is coupled through insert-molding so as to form a main frame of the side step.