Patents by Inventor Jae Choi

Jae Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180246328
    Abstract: An electronic device that interacts with a head mounted display (HMD) device is provided. The electronic device includes a communication interface, a memory, a display, and at least one processor electrically connected to the communication interface, the memory, and the display. The at least one processor is configured to receive an event signal related to sharing of contents with at least one external device or receive request information related to sharing of contents from the at least one external device through the communication interface, identify attribute information of the at least one external device, convert a format of some of one or more contents, which are stored in the memory, such that the format of one or more contents corresponds to the identified attribute information, and transmit the contents to the at least one external.
    Type: Application
    Filed: February 26, 2018
    Publication date: August 30, 2018
    Inventors: Woo Taek Song, Hee Bae Park, Young Jae Choi, Hyuk Kang, Tae Ho Kim, Tae Gun Park, Gyu Cheol Choi
  • Patent number: 10041728
    Abstract: A refrigerator in which a storage box can be sufficiently drawn by placing a sliding shelf at the bottom of the storage box, and the storage box is easily inserted when it is inserted into inside the storage chamber, and less noise is generated, is provided.
    Type: Grant
    Filed: September 1, 2014
    Date of Patent: August 7, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyoung Min Go, Sung Cheul Park, Won Jae Choi
  • Patent number: 10037381
    Abstract: The present invention is to provide an apparatus for searching information based on Wikipedia's contents comprising: a document converting part extracting fulltext documents, section title documents, info-box documents, category documents and definition statement documents from Wikipedia original documents and generating at least one of Wikipedia documents for questions and answers; a document indexing part analyzing the Wikipedia document for questions and answers, extracting POS-based index terms from the Wikipedia document for questions and answers, and generating a Wikipedia document index for questions and answers; a question analyzing part receiving a natural language question, analyzing a question pattern, an answer pattern and a question focus from the natural language question, and extracting document search keywords; a document searching part performing document search by using the document search keywords from the Wikipedia document index for questions and answers and generating document search res
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: July 31, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Pum-Mo Ryu, Hyun-Ki Kim, Sang-Kyu Park, Yong-Jin Bae, Jeong Heo, Hyo-Jung Oh, Chung-Hee Lee, Soo-Jong Lim, Myung-Gil Jang, Mi-Ran Choi, Yoon-Jae Choi, Yeo-Chan Yoon, Yo-Han Jo
  • Publication number: 20180194447
    Abstract: A ship comprising an engine is disclosed. The ship comprising an engine comprises: a self-heat exchanger which heat-exchanges boil-off gas discharged from a storage tank; a multi-stage compressor which compresses, in multi-stages, boil-off gas that passed through the self-heat exchanger after being discharged from the storage tank; a first decompressing device which expands one portion of boil-off gas that passed through the self-heat exchanger after being compressed by the multi-stage compressor; and a second decompressing device which expands the other portion of the boil-off gas that passed through the self-heat exchanger after being compressed by the multi-stage compressor, wherein the self-heat exchanger uses boil-off gas discharged from the storage tank and boil-off gas expanded by the first decompressing device as refrigerants for cooling boil-off gas compressed by the multi-stage compressor.
    Type: Application
    Filed: June 29, 2016
    Publication date: July 12, 2018
    Applicant: DAEWOO SHIPBUILDING & MARINE ENGINEERING CO., LTD.
    Inventors: Joon Chae LEE, Won Jae CHOI
  • Publication number: 20180163130
    Abstract: An etching composition may include a peracetic acid mixture, a fluorine compound, an organic solvent (e.g., acetate-series organic solvent), and water. The etching composition may be used to selectively etch silicon-germanium (SiGe).
    Type: Application
    Filed: November 6, 2017
    Publication date: June 14, 2018
    Applicants: Samsung Electronics Co., Ltd., Soulbrain Co., Ltd.
    Inventors: Soo Jin KIM, Hyo Sun LEE, Jin Hye BAE, Jung Hun LIM, Yong Jae CHOI
  • Patent number: 9997663
    Abstract: There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: June 12, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pun Jae Choi, Yu Seung Kim, Jin Bock Lee
  • Publication number: 20180160108
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a display, a memory and a processor. The processor implements the method, including displaying a first image through the display, storing screen information associated with the first image in a memory, detecting whether the electronic device is mounted on the wearable device, generating a second image corresponding to a view point of the first image based on the stored screen information, and displaying the generated second image through the display.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 7, 2018
    Inventors: Hee-Bae PARK, Woo-Taek Song, Young-Jae Choi, Hyuk Kang, Tae-Ho Kim, Tae-Gun Park, Gyu-Cheol Choi
  • Publication number: 20180148645
    Abstract: An etching composition selectively removes a titanium nitride film from a stacked conductive film structure including a titanium nitride (TiN) film and a tantalum nitride (TaN) film. The etching composition configured to etch titanium nitride (TiN) includes 5 wt % to 30 wt % of hydrogen peroxide, 15 wt % to 50 wt % of acid compound, and 0.001 wt % to 5 wt % of corrosion inhibitor, with respect to a total weight of the etching composition, wherein the acid compound includes at least one of phosphoric acid (H3PO4), nitric acid (HNO3), hydrochloric acid (HCl), hydroiodic acid (HI), hydrobromic acid (HBr), perchloric acid (HNO4), silicic acid (H2SiO3), boric acid (H3BO3), acetic acid (CH3COOH), propionic acid (C2H5COOH), lactic acid (CH3CH(OH)COOH), and glycolic acid (HOCH2COOH).
    Type: Application
    Filed: November 10, 2017
    Publication date: May 31, 2018
    Applicants: Samsung Electronics Co., Ltd., Soulbrain Co., Ltd.
    Inventors: Hyo Sun LEE, Ho Young KIM, Sang Won BAE, Min Goo KIM, Jung Hun LIM, Yong Jae CHOI
  • Publication number: 20180124957
    Abstract: Provided are heat radiation sheet and method of manufacturing the same.
    Type: Application
    Filed: August 7, 2017
    Publication date: May 3, 2018
    Inventors: Sung Chul YOON, Cheol Heung AHN, Dong Hyun KIM, Hak-Soo KIM, Su-Han WOO, Jin GO, Won Jae CHOI, Dae-Bok PARK
  • Publication number: 20180120374
    Abstract: A wafer burn-in test circuit may be provided. The wafer burn-in test circuit may include a timing correction unit configured to generate a plurality of timing-compensated input signals by synchronizing a plurality of pulse signals generated according to a plurality of input signals with an input signal among the plurality of input signals. The wafer burn-in test circuit may include a wafer burn-in signal decoding unit configured to generate a plurality of decoding signals by decoding the plurality of timing-compensated input signals and output the plurality of decoding signals as a plurality of wafer burn-in signals by latching the plurality of decoding signals.
    Type: Application
    Filed: March 17, 2017
    Publication date: May 3, 2018
    Applicant: SK hynix Inc.
    Inventor: Young Jae CHOI
  • Publication number: 20180120971
    Abstract: The present invention relates to a touch panel and, more particularly, to a touch panel capable of improving electrical conductive characteristics of the touch panel, reducing the size of the touch panel, improving the visibility of the touch panel, and minimizing damage to a substrate when a failure test is performed on the touch panel.
    Type: Application
    Filed: May 2, 2016
    Publication date: May 3, 2018
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jin Woong LEE, Byung Youl MOON, Jung Hwan BANG, Kwang Yong JIN, Yong Jae CHOI
  • Patent number: 9961809
    Abstract: Provided are heat radiation sheet and method of manufacturing the same.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: May 1, 2018
    Assignee: SHINWHA INTERTEK CORP
    Inventors: Sung Chul Yoon, Cheol Heung Ahn, Dong Hyun Kim, Hak-Soo Kim, Su-Han Woo, Jin Go, Won Jae Choi, Dae-Bok Park
  • Patent number: 9905739
    Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-wook Chung, Jung-jin Kim, Pun-jae Choi, Si-han Kim, Sung-don Gang, Ah-young Woo
  • Patent number: 9902902
    Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: February 27, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Joo Jang, Mi Yang Kim, Hyung Kun Kim, Shin Ae Jun, Yong Wan Jin, Seong Jae Choi
  • Patent number: 9905656
    Abstract: Provided is a semiconductor substrate including a seed layer disposed on a substrate, a buffer layer disposed on the seed layer, a plurality of nitride semiconductor layers disposed on the buffer layer, and at least one stress control layer between the plurality of nitride semiconductor layers. The buffer layer includes a plurality of step regions and at least one heterogeneous region. The plurality of step regions includes the same nitride semiconductor material. The heterogeneous region includes a different nitride semiconductor material from the step regions.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: February 27, 2018
    Assignee: SK Siltron Co., Ltd.
    Inventors: Kye-Jin Lee, Ho-Jun Lee, Young-Jae Choi, Jung-Hyun Eum, Chung-Hyun Lee
  • Patent number: 9887332
    Abstract: A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: February 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pun Jae Choi, Geun Woo Ko, Yong Min Kwon, Ah Young Woo, Jun Ho Lee, Jin Wook Chung
  • Patent number: D827678
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 4, 2018
    Assignee: ZENITH TRACK CO., LTD.
    Inventor: Yong Jae Choi
  • Patent number: D827679
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 4, 2018
    Assignee: ZENITH TRACK CO., LTD.
    Inventor: Yong Jae Choi
  • Patent number: D827680
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 4, 2018
    Assignee: ZENITH TRACK CO., LTD.
    Inventor: Yong Jae Choi
  • Patent number: D827681
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 4, 2018
    Assignee: ZENITH TRACK CO., LTD.
    Inventor: Yong Jae Choi