Patents by Inventor Jae Dong Kim
Jae Dong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143927Abstract: Provided are a method for generating a summary and a system therefor. The method according to some embodiments may include calculating a likelihood loss for a summary model using a first text sample and a first summary sentence corresponding to the first text sample, calculating an unlikelihood loss for the summary model using a second text sample and the first summary sentence, the second text sample being a negative sample generated from the first text sample, and updating the summary model based on the likelihood loss and the unlikelihood loss.Type: ApplicationFiled: October 26, 2023Publication date: May 2, 2024Applicants: SAMSUNG SDS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Sung Roh YOON, Bong Kyu HWANG, Ju Dong KIM, Jae Woong YUN, Hyun Jae LEE, Hyun Jin CHOI, Jong Yoon SONG, Noh II PARK, Seong Ho JOE, Young June GWON
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Publication number: 20240144858Abstract: The present disclosure relates to a clock generator and a display device including the same. The clock generator includes a first clock generation circuit configured to output a clock, data, and a timing control signal; a first wiring through which the clock is serially transmitted; a second wiring through which the data is serially transmitted; a third wiring through which a pulse of the timing control signal is serially transmitted; a second clock generation circuit connected to the first clock generation circuit through the first wiring, the second wiring, and the third wiring and configured to generate pre-clocks in which phases are sequentially shifted based on the data and the clock; and a clock adjustment circuit configured to receive the pulse of the timing control signal and the pre-clock and output an output clock.Type: ApplicationFiled: September 27, 2023Publication date: May 2, 2024Inventors: Soon Dong CHO, Jae Won HAN, Jung Jae KIM, Min Gyu PARK, Sang Uk LEE
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Publication number: 20240138174Abstract: Provided are an organic electronic element comprising an anode, a cathode, and an organic material layer between the anode and the cathode, and an electronic device comprising the organic electronic element, wherein the organic material layer comprises each compound represented by Formula 1, Formula 2, or Formula 3, thereby the driving voltage of the organic electronic element can be lowered and the luminous efficiency and lifespan can be improved.Type: ApplicationFiled: March 15, 2023Publication date: April 25, 2024Applicant: DUK SAN NEOLUX CO., LTD.Inventors: Hyo Min JIN, Bu Yong YUN, Jae Ho KIM, Hyung Dong LEE, Chi Hyun PARK
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Patent number: 11945744Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).Type: GrantFiled: April 14, 2023Date of Patent: April 2, 2024Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTDInventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
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Publication number: 20240097238Abstract: A battery pack is advantageous for effective control and maintenance of thermal events. A battery pack according to one aspect of the present disclosure may include a battery module having one or more battery cells; a fire extinguishing tank holding a fire extinguishing liquid, disposed on top of the battery module and having a through hole formed therein; and a cover member installed in the through hole of the fire extinguishing tank and configured to open or close the through hole according to a change in internal pressure of the fire extinguishing tank.Type: ApplicationFiled: December 20, 2022Publication date: March 21, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Kyu AHN, Ki-Youn KIM, Hyeon-Kyu KIM, Jeong-O MUN, Gi-Dong PARK, Young-Won YUN, Seong-Ju LEE, Jae-Ki LEE
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Publication number: 20240092228Abstract: A seat for a vehicle, includes a second row center seat and a second row side seat provided on a partition wall positioned rearward of a driver seat, the second row center seat may move leftward or rightward, and an interval between the seats may be increased in a state in which the second row center seat is moved in a right direction away from the second row side seat, which makes it possible to maximally prevent body contact between a passenger in the second row center seat and a passenger in the second row side seat.Type: ApplicationFiled: January 20, 2023Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.Inventors: Jung Sang YOU, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
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Patent number: 11932140Abstract: Disclosed is a cushion tip-up type seat for a vehicle. The cushion tip-up type seat for a vehicle is configured to perform a tip-up function of a cushion part, and to move a seat leftward and rightward to adjust an interval between left and right seats, whereby left and right spacing between occupants seated in the seats is sufficiently secured and the convenience of the occupants is improved.Type: GrantFiled: July 13, 2022Date of Patent: March 19, 2024Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.Inventors: Dong Woo Jeong, Eun Sue Kim, Dae Hee Lee, Myung Hoe Kim, Jun Sik Hwang, Gwon Hwa Bok, Hae Dong Kwak, Jae Sung Shin, Han Kyung Park, Jae Hoon Cho
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Patent number: 11934950Abstract: An apparatus for embedding a sentence feature vector according to an embodiment includes a sentence acquisitor configured to acquire a first sentence and a second sentence, each including one or more words; a vector extractor configured to extract a first feature vector corresponding to the first sentence and a second feature vector corresponding to the second sentence by independently inputting each of the first sentence and the second sentence into a feature extraction network; and a vector compressor configured to compress the first feature vector and the second feature vector into a first compressed vector and a second compressed vector, respectively, by independently inputting each of the first feature vector and the second feature vector into a convolutional neural network (CNN)-based vector compression network.Type: GrantFiled: October 26, 2020Date of Patent: March 19, 2024Assignee: SAMSUNG SDS CO., LTD.Inventors: Seong Ho Joe, Young June Gwon, Seung Jai Min, Ju Dong Kim, Bong Kyu Hwang, Jae Woong Yun, Hyun Jae Lee, Hyun Jin Choi
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Publication number: 20240083384Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.Type: ApplicationFiled: February 3, 2023Publication date: March 14, 2024Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
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Publication number: 20240067065Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.Type: ApplicationFiled: December 21, 2022Publication date: February 29, 2024Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
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Publication number: 20240067056Abstract: The present disclosure relates to a vehicle rear seat including: a center seat; and side seats located on the left and right of the center seat, wherein, the center seat is capable of protruding by moving the center seat forward with respect to the side seats, and in the state in which the center seat protrudes forward, it is possible to increase an inter-passenger distance so that physical contact between the passenger of the center seat and the passenger of each of the side seats can be prevented as much as possible.Type: ApplicationFiled: March 6, 2023Publication date: February 29, 2024Inventors: Jung Sang You, Yong Chul Kim, Dae Hee Lee, Eun Sue Kim, Jae Hoon Cho, Han Kyung Park, Jae Sung Shin, Hae Dong Kwak, Jun Sik Hwang, Gwon Hwa Bok
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Patent number: 11869829Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: GrantFiled: July 10, 2020Date of Patent: January 9, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
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Publication number: 20200343163Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: July 10, 2020Publication date: October 29, 2020Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Patent number: 10811341Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: GrantFiled: July 2, 2018Date of Patent: October 20, 2020Assignee: Amkor Technology Singapore Holding Pte Ltd.Inventors: Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim, Jae Dong Kim, Yeon Soo Jung, Sung Hwan Cho
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Publication number: 20180308788Abstract: In accordance with the present description, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: July 2, 2018Publication date: October 25, 2018Applicant: AMKOR TECHNOLOGY, INC.Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Patent number: 9839898Abstract: Disclosed is a fuel processor. The fuel processor includes: a steam reformer unit configured to be disposed at an upper portion in a casing; a heat exchanger unit configured to be disposed at a lower portion of the steam reformer unit; a high temperature shift reforming unit configured to be disposed at a lower portion of the heat exchanger unit; a low temperature shift reforming unit configured to be disposed while enclosing an outer portion of the high temperature shift reforming unit; and a heat exchange chamber configured to be disposed at a lower portion of the high temperature shift reforming unit and exchange heat between reformed gas and a heat exchange fluid supplied through a channel part formed to drain the reformed gas and combustion gas and supply the heat exchange fluid.Type: GrantFiled: January 29, 2016Date of Patent: December 12, 2017Assignees: Korea Gas Corporation, CHP TechInventors: Dal Ryung Park, Bong Gyu Kim, Jae Dong Kim, Jin Wook Kim, Keun Yong Cho, Chul Hee Jeon, Min Ho Bae, Chan Sik Park
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Publication number: 20170117214Abstract: In accordance with the present invention, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically connected to the substrate, both the semiconductor die and the substrate being at least partially covered by a package body of the semiconductor device. In certain embodiments of the semiconductor device, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In other embodiments, through mold vias are also included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body.Type: ApplicationFiled: December 26, 2016Publication date: April 27, 2017Applicant: AMKOR TECHNOLOGY, INC.Inventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Publication number: 20160236166Abstract: Disclosed is a fuel processor. The fuel processor includes: a steam reformer unit configured to be disposed at an upper portion in a casing; a heat exchanger unit configured to be disposed at a lower portion of the steam reformer unit; a high temperature shift reforming unit configured to be disposed at a lower portion of the heat exchanger unit; a low temperature shift reforming unit configured to be disposed while enclosing an outer portion of the high temperature shift reforming unit; and a heat exchange chamber configured to be disposed at a lower portion of the high temperature shift reforming unit and exchange heat between reformed gas and a heat exchange fluid supplied through a channel part formed to drain the reformed gas and combustion gas and supply the heat exchange fluid.Type: ApplicationFiled: January 29, 2016Publication date: August 18, 2016Applicants: KOREA GAS CORPORATION, CHP TECHInventors: DAL RYUNG PARK, BONG GYU KIM, JAE DONG KIM, JIN WOOK KIM, KEUN YONG CHO, CHUL HEE JEON, MIN HO BAE, CHAN SIK PARK
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Patent number: D979624Type: GrantFiled: July 20, 2021Date of Patent: February 28, 2023Assignee: HANWHA CORPORATIONInventors: Sung Jin Kwon, Kang Wook Lee, Jae Dong Kim, Kang Gyun Kim
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Patent number: D1019486Type: GrantFiled: January 19, 2022Date of Patent: March 26, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Jae-Dong Yoo, Ki-Euk Kim