Abstract: A method and an electronic device are disclosed. The electronic device includes a camera, an illumination sensor, and at least one processor. The processor executes the method, including determining, by at least one processor of the electronic device, a photographic condition and selecting a number of photographic captures to be executed in a multi-image frame photographing mode based on the determined photographic condition, capturing by the camera multiple image frames based on the number of photographic captures, and generating an image having a predetermined image resolution from the captured multiple image frames.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: A method and apparatus for combining characteristics of images and applying the combined characteristic to a display or a camera in an electronic device. The method includes displaying a plurality of images in which an image processing parameter value is applied to a reference image step by step, selecting any one of the plurality of images, and applying an image processing parameter value for the selected image to a display or a camera.

Abstract: A fan out build up substrate stackable package includes an electronic component having an active surface including a bond pad. A package body encloses the electronic component, the package body having a first surface coplanar with the active surface of the electronic component. A buildup dielectric layer is applied to the active surface of the electronic component and the first surface of the package body. A circuit pattern is formed within the first buildup dielectric layer and electrically connected to the bond pad, the first circuit pattern including via capture pads. Via capture pad apertures extend through the package body and expose the via capture pads. In this manner, direct connection to the first circuit pattern, i.e., the first metal layer, of the fan out build up substrate stackable package is facilitated. Further, the fan out build up substrate stackable package is extremely thin resulting in extremely thin stacked assemblies.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a apace between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surfaces, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An optical pointing device including a Printed Circuit Board (PCB); an infrared Light Emitting Diode (LED) provided on a side of the PCB; a cover plate for detecting motion of a subject, which is placed in an upper portion of the optical pointing device; an image forming system lens placed below the cover plate and configured to condense a light reflected from the subject; an optical image sensor for receiving a reflected image of the subject and detecting motion of the subject; and an optical coating unit placed on the optical image sensor. The cover plate and the optical coating unit are made of a material capable of passing a wavelength of infrared rays which cannot be perceived by a user's eye. A first cut off wavelength of the cover plate is shorter than a second cut off wavelength of the optical coating unit.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mounting region of the first surface of the insulative layer and electrically connected to one of the plurality of conductive patterns on the first surface. An extending pattern extends from the conductive lands to outside of the mounting region. A protective layer covers the first surface of the insulative layer and the electrically conductive patterns. A trench is formed in the protective layer to expose the conductive lands and the extending patterns.

Abstract: In accordance with the present invention, there is provided multiple embodiments of a package-in-package semiconductor device including shortened electrical signal paths to optimize electrical performance. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In certain embodiments, a semiconductor package and one or more semiconductor dies are vertically stacked upon the substrate, and placed into electrical communication with the conductive pattern thereof. One or more of the semiconductor dies may include through-silicon vias formed therein for facilitating the electrical connection thereof to the conductive pattern of the substrate or to other electronic components within the vertical stack. Similarly, the semiconductor package may be provided with through-mold vias to facilitate the electrical connection thereof to other electronic components within the vertical stack.

Abstract: An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.

Abstract: An optical pointing device and a portable electronic device having the same, in which external noise light and/or noise light due to diffused reflection or the like is prevented from being introduced into an optical sensor enhancing precision of operation and providing a housing with improved structure. The device includes an infrared source; a cover having a cover plate transmitting infrared rays from the IR source for reaching a subject out of the cover plate and a cover frame that supports the cover plate; an optical unit in the cover and on which the infrared ray reflected from the subject is incident; and an optical sensor sensing the infrared ray incident thereon from the optical unit; the cover plate has a base coupled to the cover frame, and an IR band-pass filter layer provided on one side of the base.

Abstract: A semiconductor package comprises a plurality of stacked semiconductor chips having the same structure. Therefore, the semiconductor chips can be produced using masks of the same design, resulting in a reduction in production cost and an improvement in productivity. Each of the semiconductor chips includes a plurality of through-silicon vias penetrating therethrough. The through-silicon vias of each semiconductor chip include at least one signal pad through which a common signal is delivered to the semiconductor chip and at least one chip enable pad connected to at least one chip enable pin to select the semiconductor chip. The chip enable pin may be connected to or disconnected from the chip enable pad through a conductive line to select the semiconductor chip. The conductive line is sawn to disconnect the chip enable pin from the chip enable pad before stacking of the semiconductor chip.

Abstract: Disclosed herein is an optical pointing device as a user interface for electronic devices such as communication terminals and the like. The optical pointing device includes a light receiving part, an optical unit transferring light to the light receiving part and including a reflection part disposed in an optical path, a frame body integrally formed with the reflection part to support the reflection part, a cover covering the frame body and having an interface surface, and a light source illuminating the cover. The optical pointing device reduces the number of components and permits convenient and easy assembly, thereby significantly improving productivity while reducing assembly defect.

Abstract: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that sections of the upper circuit board surface, including one which extends along the entirety of the chamfer, is not covered by the body.

Abstract: An optical joystick and portable electronic device having the same are disclosed, by which malfunctions of the optical joystick due to sunlight or external illumination light are prevented or minimized. Therefore, precision of the optical joystick can be enhanced. The optical joystick according to the present invention includes an infrared light source, a cover part having a contacting surface for a contact by a subject, a light-receiving part detecting the infrared ray, and an optical member provided on an light path of the infrared ray traveling from the cover part toward the light-receiving part, wherein the cover part comprises a cover base and an infrared ray pass layer blocking out external noisy light on a predetermined band and passing substantially a wavelength band of infrared rays.

Abstract: The present invention relates to an ultra thin optical pointing device, and a personal portable device having the optical pointing device. The optical pointing device includes a PCB (508). An infrared LED (501) is provided on a side of the top surface of the PCB. A cover plate (503) detects motion of a finger, which is a subject. An illumination system (502) transmits light from the infrared LED to the cover plate. An image forming system lens (505) is placed below the cover plate to condense reflected light. An optical image sensor (507) receives a reflected image of the subject and detects motion of the subject. A body tube (509) is provided on a side portion over the PCB. The illumination system, the cover plate and the image forming system lens are made of an optical plastic material capable of passing only a wavelength band of infrared rays.

Abstract: The present invention relates to an optical pointing device for mobile terminals, which can improve assembly efficiency and stability. An optical pointing device according to the present invention includes a holder having an accommodation opening therein. Light emitting means is installed in the accommodation opening of the holder. A condensing element includes a pair of prisms installed in the accommodation opening of the holder and integrated into a single structure so as to condense light emitted from the light emitting means, and a condensing lens disposed between the paired prisms. An image sensor captures light provided through the condensing element and calculates the captured light as displacement values. The condensing element includes a lens holder coupled to the condensing lens so as to maintain stable installation of the condensing lens between the paired prisms.

Abstract: A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, first and second covers are movably attached to a case for selectively covering or exposing the I/O pads and the test features/pads of the module of the memory card.