Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: A method of preparing an organopolysiloxane is provided. An organopolysiloxane, which has both a linear or cross-linking structure derived from a trifunctional siloxane unit and a linear structure derived from a difunctional siloxane unit among the molecular structures and also has a sufficiently long linear structure, can be effectively prepared. Also, the organopolysiloxane can be synthesized so that it can have a sufficiently high molecular weight, and a target product showing excellent physical properties can be effectively prepared by minimizing a ratio of a functional group such as an alkoxy group or a hydroxyl group in the synthesized organopolysiloxane.

Abstract: A digital polar modulator (DPM) for transforming a baseband signal into a modulated digital modulator output signal comprises an input unit and two low-pass delta-sigma modulators, a first one being connected downstream from the first input part and configured to provide at its output a first pulse train in dependence on an amplitude- modulating baseband signal component, and a second one being connected downstream from the second input part and configured to provide at its output a multilevel quantized signal in dependence on a phase modulating baseband signal component; a multiphase generator, which is configured to provide a set of square-wave carrier signals having a common carrier frequency and exhibiting discrete phase shifts with respect to each other; a multiplexer, which is configured to provide a multiplexer output signal that is formed by switching, in dependence on a signal received at a select input as a function of time, between selected ones of the carrier signals; and a combiner unit.

Abstract: A delta-sigma modulator and a transmitter apparatus including the same are disclosed. The delta-sigma modulator includes a first integrator, a second integrator, a first comparator configured to compare an output signal of the second integrator and a reference signal, and output a first comparison signal, a second comparator configured to compare the output signal of the second integrator and the reference signal, and output a second comparison signal, a first DAC configured to output the first signal corresponding to the first comparison signal and the second comparison signal, a second DAC configured to output the second signal corresponding to the first comparison signal and the second comparison signal, a delayer configured to generate a delayed signal that delays the first comparison signal and the second comparison signal by a predetermined time, and an output DAC configured to generate an output signal having a multi-level corresponding to the delayed signal.

Abstract: This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: Provided is a method of correcting a time misalignment between envelope and phase components in a transmitting apparatus which separates envelope and phase components of a signal, processes them, and then recombines them to transmit the recombined signal. For this, in a method of correcting a time misalignment between envelope and phase components according to an embodiment of the present invention, a time misalignment is corrected by applying a time delay to at least one of envelope and phase components in digital and analog signal processing operations, or applying a time delay to an envelope or phase component by a pre-processing operation.

Abstract: Provided is a method of generating a driving signal for driving a dual mode supply modulator for a power amplifier. The method includes obtaining an envelope of a complex baseband signal to be transmitted, comparing the envelope of the complex signal with a preset threshold value, when a current envelope of the complex signal is the preset threshold value or greater or when there is a result having the preset threshold value or greater in previous N comparisons, outputting a digital board output signal configured with a first logic level through a digital-to-analog converter; and when the current envelope of the complex signal is smaller than the preset threshold value and when there is no result having the preset threshold value or greater in the previous N comparisons, outputting a digital board output signal configured with a second logic level through the digital-to-analog converter.

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: Provided is a method of generating a driving signal for driving a dual mode supply modulator for a power amplifier. The method includes obtaining an envelope of a complex baseband signal to be transmitted, comparing the envelope of the complex signal with a preset threshold value, when a current envelope of the complex signal is the preset threshold value or greater or when there is a result having the preset threshold value or greater in previous N comparisons, outputting a digital board output signal configured with a first logic level through a digital-to-analog converter; and when the current envelope of the complex signal is smaller than the preset threshold value and when there is no result having the preset threshold value or greater in the previous N comparisons, outputting a digital board output signal configured with a second logic level through the digital-to-analog converter.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: A signal amplification apparatus includes a first modulator configured to receive an envelope signal, use a predetermined reference level to separate the received envelope signal into a first period and a second period, digitally modulate a signal of the second period to output the digitally modulated signal to a first output terminal, and output a signal of the first period to a second output terminal. Further, the signal amplification apparatus includes a second modulator configured to mix the digital modulated signal input through the first output terminal with a phase modulated carrier signal; an envelope modulator configured to output the signal of the first period as a power supply signal; and a power amplifier configured to amplify the mixed signal output by the second modulator to output the amplified signal.

Abstract: A three dimensional image display device includes a display panel in which at least one of two consecutive left eye images and two consecutive right eye images are inputted, where the two consecutive left eye images are substantially the same as each other, and the two consecutive right eye images are substantially the same as each other, and where gate scanning directions of the two consecutive left eye images are opposite to each other, and gate scanning directions of the two consecutive right eye images are opposite to each other.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.