Patents by Inventor Jae Ho Shin

Jae Ho Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12089456
    Abstract: A display device includes: a substrate on which a plurality of islands and a plurality of bridges connecting the plurality of islands to each other are defined; a plurality of pixels disposed in each of the plurality of islands; and a wire disposed in each of the plurality of bridges and connected to the plurality of pixels, where the plurality of islands and the plurality of bridges are defined based on cutout portions of the substrate, and a vertex of a cutout portion between one of the plurality of islands and a bridge connected to the one of the plurality of islands is an intersection of a straight line and a curved line.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: September 10, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jong Ho Hong, Jun Hyeong Park, Jae Min Shin, Hye Jin Joo
  • Patent number: 12079041
    Abstract: The present disclosure relates to a display panel including a display area that can be stretched by including a plurality of stretching units and a peripheral area positioned at an edge of the display area. Each of the stretching units includes: a plurality of islands separately disposed to include a plurality of pixels disposed therein; a plurality of bridges extended from the islands to connect adjacent islands or to connect the islands with the peripheral area; and a plurality of openings disposed adjacent to the bridges, between the bridges, and between the bridges and the islands, wherein areas of the islands are gradually increased toward the peripheral area.
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: September 3, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jong Ho Hong, Hye Jin Joo, Gun Mo Kim, Il Gon Kim, Jae Min Shin
  • Publication number: 20240274823
    Abstract: Disclosed is a method for manufacturing a dry electrode. The method allows determination of the micro-fibrilization degree of a binder resin from the crystallinity of the binder resin. Based on this, the processing conditions of mixed powder for electrode or an electrode film may be controlled. In this manner, it is possible to check and control the processing conditions easily and efficiently. In addition, the method for manufacturing a dry electrode includes a kneading step using a kneader under a low speed and high temperature and pulverization step. Therefore, there is no problem of blocking of a flow path caused by aggregation of the ingredients, which is favorable to mass production.
    Type: Application
    Filed: April 25, 2024
    Publication date: August 15, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Seong-Wook Kang, Jae-Sung Han, Dong-Mok Shin, Dong-Oh Shin, Kyung-Hwan Yoon, Kwang-Ho Yoo
  • Publication number: 20240266542
    Abstract: The present disclosure relates to a conductive material master batch for use in an electrode and an electrode obtained by using the same. The electrode obtained by using the conductive material master batch has an electrode resistance of 55 ohm·cm or less.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 8, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Seong-Wook Kang, Jae-Sung Han, Sang-Min Kwak, Kyung-Hwan Yoon, Dong-Oh Shin, Ki-Seok Lee, Kwang-Ho Yoo, Nam-Jeong Lee
  • Publication number: 20240256729
    Abstract: Provided are a method and a system for determining a model output direction on the basis of heat dissipation characteristic analysis for stabilizing output of metal 3D printing.
    Type: Application
    Filed: May 25, 2022
    Publication date: August 1, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Hwa Seon SHIN, Sung Hwan CHUN, Hye In LEE, Jae Ho SHIN, Sung Hun PARK
  • Publication number: 20240253124
    Abstract: A thermal-analysis-based output stabilization method and system for improving 3D printing output reliability are provided. The thermal-analysis-based output stabilization method according to an embodiment of the present invention comprises steps in which: an output stabilization system performs first stacking thermal analysis on a plurality of residual heat quantity review specimens for which a process range corresponding to normal output quality is set; the output stabilization system performs second stacking thermal analysis on an actual stacked product on the basis of the first stacking thermal analysis result in the same manner as the first stacking thermal analysis method; and the output stabilization system performs stability review on the stacking result of the stacked product on the basis of the second stacking thermal analysis result.
    Type: Application
    Filed: May 25, 2022
    Publication date: August 1, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Jae Ho SHIN, Hwa Seon SHIN, Hye In LEE, Sung Hwan CHUN, Sung Hun PARK
  • Patent number: 12052909
    Abstract: A display device includes a plurality of islands and a bridge connecting the plurality of islands to each other. Each of the plurality of islands includes a flexible substrate, a thin film transistor positioned on a first surface of the flexible substrate, a first electrode connected to the thin film transistor, and a protective mask positioned on a second surface of the flexible substrate.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: July 30, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jae Min Shin, Seung Bae Kang, Jong Ho Hong, Gun Mo Kim, Min Woo Kim, Won Sang Park, Hye Jin Joo
  • Publication number: 20240243616
    Abstract: Disclosed is a wireless power transmission system including a first circuit comprising a transmitting coil for transmitting power; and a second circuit comprising a shielded coil, wherein, in the transmitting coil and the shielded coil, frequency division wherein an impedance magnitude of the second circuit is minimized at a first frequency smaller than a resonant frequency of the second circuit and a second frequency larger than the resonant frequency of the second circuit occurs, and inductive coupling wherein the first frequency is larger than a fundamental frequency of the first circuit and the second frequency is smaller than a third high frequency of the second circuit.
    Type: Application
    Filed: January 12, 2024
    Publication date: July 18, 2024
    Inventors: Seung Young AHN, Bom Son LEE, Chang Min LEE, Seong Ho WOO, Yu Jun SHIN, Jae Won RHEE, Dong Ryul PARK
  • Publication number: 20240234802
    Abstract: An all-solid-state battery having an increased lifespan is equipped with a pressure pad layer. More particularly, the all-solid-state battery includes a unit cell and a pressuring pad layer. The unit cell is composed of a cathode, an anode, and a solid electrolyte layer positioned between the cathode and the anode. The pressurizing pad layer is positioned on each side of the unit cell and includes a non-porous upper layer, a non-porous lower layer, and a porous core layer positioned between the non-porous upper layer and the non-porous lower layer.
    Type: Application
    Filed: August 16, 2023
    Publication date: July 11, 2024
    Inventors: Young Jin Nam, Yong Guk Gwon, Jae Ho Shin, Yong Seok Choi, Min Sun Kim
  • Publication number: 20240232783
    Abstract: A method and a system for providing a domain-based process framework are provided. The method for providing a domain-specific process framework, according to one embodiment of the present invention, comprises steps in which: a process framework provision system generates a process model on the basis of a pre-stored meta-model (primitive) and a relationship model (relation); and the process framework provision system distributes the generated process model. Therefore, a process framework capable of reflecting domain knowledge is introduced so that different business processes between companies can be normalized by domain.
    Type: Application
    Filed: December 14, 2022
    Publication date: July 11, 2024
    Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Hwa Seon SHIN, Hye In LEE, Jae Ho SHIN, Sung Hwan CHUN, Sung Hun PARK
  • Publication number: 20240222386
    Abstract: A display device includes: a first-color light emitting diode (LED); thin film transistors (TFTs) and wires located on the first-color LED; a second-color LED located in a first area on the TFTs and the wires; a third-color LED located in a second area on the TFTs and the wires; a plurality of wires located between the first area and the second area; and a plurality of pads connected to the plurality of wires.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Jiwon PARK, Hyunwoo KIM, Jae Ho SHIN, Jin Hyeong YU
  • Publication number: 20240193105
    Abstract: An operating method of a computational storage device includes: setting a first computing namespace, including a first queue and a first accelerator and having a first value as its first ID, per instructions from a first host; setting a second computing namespace, including a second queue and a second accelerator and having a second value as its first ID, per instructions from a second host; loading a first program from the first host in the first computing namespace; loading a second program from the second host in the second computing namespace; setting a second ID of the first computing namespace to a third value based on an ID of the first program per instructions to activate the first program; and setting the second ID of the second computing namespace to a fourth value based on an ID of the second program per instructions to activate the second program.
    Type: Application
    Filed: June 6, 2023
    Publication date: June 13, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong Won LEE, Sang Oak WOO, Myung June JUNG, Jae Ho SHIN
  • Publication number: 20240186596
    Abstract: A pressurizing system capable of actively varying and adjusting the pressure applied to a cell of an all-solid-state battery includes: a pressurizing mechanism provided to pressurize an all-solid-state battery and driven to adjust and vary the pressure applied to the all-solid-state battery; a driving device operated to drive the pressurizing mechanism; and a controller controlling the operation of the driving device so that the pressure to pressurize the all-solid-state battery can be adjusted and varied by the above pressurizing mechanism. When the all-solid-state battery is charged or discharged, the controller controls the operation of the driving device based on a pressure change rate so that the pressure for pressurizing the all-solid-state battery may be adjusted and varied according to the pressure change rate determined based on the state information of the all-solid-state battery.
    Type: Application
    Filed: November 15, 2023
    Publication date: June 6, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Ho Shin, Young Jin Nam, Min Sun Kim, Ga Young Choi, Yong Seok Choi, Yong Guk Gwon
  • Publication number: 20240184276
    Abstract: An embodiment system for adjusting a gap step includes a process device configured to mount a first moving part and a second moving part, a first information obtaining device including a camera, and a control device configured to control the process device based on a first driving control value such that the first moving part and the second moving part are mounted on a first vehicle body, obtain a first image of the first vehicle body on which the first moving part and the second moving part are mounted, obtain the gap step for the first moving part, the second moving part, or both through the first image, and mount the first moving part and the second moving part on a second vehicle body by controlling the process device based on a second driving control value corresponding to the gap step.
    Type: Application
    Filed: March 28, 2023
    Publication date: June 6, 2024
    Inventors: Chul Woo Park, Jae Ho Shin, Kang Hyeon Jo
  • Publication number: 20240179830
    Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes a plurality of insulating layers each having a plurality of concave portions; a plurality of conductor pattern layers disposed in a plurality of concave portions of each of the plurality of insulating layers; first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other. An average width of the first via conductor is greater than that of the second via conductor on a cross-section.
    Type: Application
    Filed: February 6, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Woong Choi, Jae Ho Shin
  • Publication number: 20240158421
    Abstract: The presently disclosed subject matter relates to nitric oxide-releasing particles for delivering nitric oxide, and their use in biomedical and pharmaceutical applications.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 16, 2024
    Inventors: Mark H. Schoenfisch, Jae Ho Shin, Nathan Stasko
  • Publication number: 20240155771
    Abstract: A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO2, SiN, and SiCN.
    Type: Application
    Filed: January 26, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Ho Shin
  • Publication number: 20240136572
    Abstract: An all-solid-state battery having an increased lifespan is equipped with a pressure pad layer. More particularly, the all-solid-state battery includes a unit cell and a pressuring pad layer. The unit cell is composed of a cathode, an anode, and a solid electrolyte layer positioned between the cathode and the anode. The pressurizing pad layer is positioned on each side of the unit cell and includes a non-porous upper layer, a non-porous lower layer, and a porous core layer positioned between the non-porous upper layer and the non-porous lower layer.
    Type: Application
    Filed: August 15, 2023
    Publication date: April 25, 2024
    Inventors: Young Jin Nam, Yong Guk Gwon, Jae Ho Shin, Yong Seok Choi, Min Sun Kim
  • Publication number: 20240128494
    Abstract: A pouch type all-solid-state battery including a reference electrode is disclosed. In the all-solid-state battery, a potential variation of each electrode is accurately measured because the ion transfer path between the reference electrode and a positive electrode/negative electrode is short. Accordingly, the all-solid-state battery secures a desired cell performance while having battery specifications similar to actual battery specifications.
    Type: Application
    Filed: September 5, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Ho Shin, Ji Chang Kim, Hyun Min Seo, Young Jin Nam, Ga Young Choi
  • Publication number: 20240090135
    Abstract: An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ga Young An