Patents by Inventor Jae Ho Shin

Jae Ho Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11691995
    Abstract: The presently disclosed subject matter relates to nitric oxide-releasing particles for delivering nitric oxide, and their use in biomedical and pharmaceutical applications.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: July 4, 2023
    Assignee: The University of North Carolina at Chapel Hill
    Inventors: Mark H. Schoenfisch, Jae Ho Shin, Nathan Stasko
  • Publication number: 20230187740
    Abstract: The present disclosure relates to a pouch-type all-solid-state battery with a reference electrode inserted and a method for manufacturing the same. The pouch-type all-solid-state battery with a reference electrode inserted includes a unit cell including a negative electrode portion, a positive electrode portion, and a solid electrolyte portion interposed between the negative electrode portion and the positive electrode portion and having a sheet shape; an exterior material provided with a space capable of accommodating the unit cell therein; a reference electrode tap adjacent to the solid electrolyte portion, and formed inside the exterior material; and a reference electrode portion positioned between the solid electrolyte portion and the reference electrode tap, and formed inside the unit cell.
    Type: Application
    Filed: December 8, 2022
    Publication date: June 15, 2023
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Yong Guk GWON, Ju Min KIM, Jae Ho SHIN, Ga Young CHOI, Yong Seok CHOI, Min Sun KIM
  • Publication number: 20230171890
    Abstract: A printed circuit board includes a wiring board including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers, a first die embedded in the plurality of insulating layers, a bridge embedded on the first die in the plurality of insulating layers, a second die mounted on the wiring board, and a third die mounted on the wiring board.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 1, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Woong Choi, Jae Ho Shin, Joo Hwan Jung
  • Publication number: 20230140708
    Abstract: An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.
    Type: Application
    Filed: March 17, 2022
    Publication date: May 4, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ga Young An
  • Publication number: 20230076846
    Abstract: The present disclosure relates to a Beauveria bassiana KNU-101 strain. The Beauveria bassiana KNU-101 strain is entomopathogenic, exhibits an excellent insecticidal effect on controlling thrips, which are soil pests that harm crops, and also has excellent sporulation ability. Thus, the Beauveria bassiana KNU-101 strain may be effectively used as an environmentally friendly means for controlling pests.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 9, 2023
    Inventors: JAE HO SHIN, CHANG EON PAKR, YEON GYUN JUNG, SEUNG DAE CHOI, YEONG JUN PARK, HYUNG WOO JO, MIN JI KIM, MIN KYU PARK, MIN CHUL KIM
  • Publication number: 20220385751
    Abstract: The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.
    Type: Application
    Filed: August 11, 2022
    Publication date: December 1, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Ho Shin
  • Publication number: 20220350250
    Abstract: The present disclosure relates to a method for micropatterning on silicone-based elastomer, the method including forming an initiator at a position of the silicone-based elastomer having high optical transmittance and transparency, and moving a laser beam to induce chain pyrolysis, thereby forming micropatterns with high quality in a very short time.
    Type: Application
    Filed: April 10, 2020
    Publication date: November 3, 2022
    Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Seung Hwan KO, Jae Ho SHIN, Phil Lip WON, Seong Min JEONG
  • Patent number: 11483422
    Abstract: The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: October 25, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Jae Ho Shin
  • Publication number: 20220111325
    Abstract: A mask according to an embodiment of the present disclosure may adjust permeability thereof by including and using an air filter unit which is capable of expanding or contracting, in at least one direction, a filter for filtering particles contained in air passing through the mask by pores.
    Type: Application
    Filed: November 17, 2020
    Publication date: April 14, 2022
    Inventors: Seung Hwan KO, Jae Ho SHIN, Seong Min JEONG, Jinmo KIM, Joonwha CHOI
  • Patent number: 11259404
    Abstract: A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Oh Hwang, Jae Ho Shin, Yun Je Ji
  • Publication number: 20210355312
    Abstract: The present disclosure relates to a continuous glucose monitoring biosensor, and more specifically, to: a biosensor which controls the flow of blood glucose flowing into a body during implantation, thereby enabling continuous detection and quantification of the blood glucose with high sensitivity; and a continuous glucose monitoring device and method using same. When a polymer blend composition including a hydrophilic polymer and a hydrophobic polymer according to the present disclosure, a diffusion control membrane formed therefrom and a continuous glucose monitoring biosensor including the same are used, they have the advantage capable of controlling an excessive influx of blood glucose due to an increase in the rate of diffusion in the sensor, thus enabling manufacture of a sensor having excellent accuracy and durability.
    Type: Application
    Filed: August 9, 2019
    Publication date: November 18, 2021
    Applicant: l-SENS, INC.
    Inventors: In Seok JEONG, Jinseon LEE, Hyunhee YANG, Young Jea KANG, Jae Ho SHIN, Min HEO, Hee June JEONG
  • Patent number: 11172574
    Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: November 9, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-Ho Shin, Jun-Oh Hwang, Yun-Je Ji, Tae-Seong Kim
  • Patent number: 11099606
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Ho Shin, Ju Ho Kim
  • Publication number: 20210212201
    Abstract: A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 8, 2021
    Inventors: Jun Oh Hwang, Jae Ho Shin, Yun Je Ji
  • Publication number: 20210181799
    Abstract: The present disclosure relates to a printed circuit board, a display device including the same, and a manufacturing method therefor. The printed circuit board includes a rigid region; and a flexible region comprising a flexible layer having a first surface and a second surface on an opposite side to the first surface, a reinforcing structure disposed on the first surface of the flexible layer, and a conductor pattern disposed on the second surface of the flexible layer. A material of the reinforcing structure has a coefficient of thermal expansion lower than that of a material of the flexible layer.
    Type: Application
    Filed: March 17, 2020
    Publication date: June 17, 2021
    Inventors: Jae Ho SHIN, Ju Ho KIM
  • Patent number: 10890557
    Abstract: The present disclosure relates to an electron transfer mediator comprising the osmium complex or a salt thereof, a reagent composition for an electrochemical biosensor, and an electrochemical biosensor, where the osmium compound or its salt maintains a stable oxidation-reduction form for an extended time period, a capacity to react with oxidoreductase being capable of performing the redox reaction of the target analytes, and no effect of oxygen partial pressure.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: January 12, 2021
    Assignee: I-SENS, INC.
    Inventors: In Jun Yoon, Jae Ho Shin, Yeon Ho Jung, Geun Sig Cha, Hakhyun Nam
  • Publication number: 20200412857
    Abstract: The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.
    Type: Application
    Filed: February 11, 2020
    Publication date: December 31, 2020
    Inventor: Jae Ho Shin
  • Publication number: 20200325307
    Abstract: Disclosed herein is a novel polymer having a structure based on a biodegradable polymer. In the novel polymer, the biodegradable polymer has at least one kind of functional groups from among a hydroxyl group and a carboxyl group, wherein the biodegradable polymer bears a functional group conjugated with a nitric oxide-releasing compound and a different functional group substituted with a photopolymerizable functional group, the nitric oxide-releasing compound comprising a NO donor. Also provided is a nanofiber fabricated from the modified biodegradable polymer. The nanofiber can be fabricated by electrospinning the novel polymer.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 15, 2020
    Inventors: Jae Ho Shin, Ki Hak Gwon
  • Publication number: 20200305282
    Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.
    Type: Application
    Filed: November 7, 2019
    Publication date: September 24, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-Ho SHIN, Jun-Oh HWANG, Yun-Je JI, Tae-Seong KIM
  • Publication number: 20200187362
    Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
    Type: Application
    Filed: February 19, 2020
    Publication date: June 11, 2020
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yang Je Lee, Dek Gin Yang, Dong Gi An, Jae Ho Shin