Abstract: A smart multi-card may include: a frame; a wireless communication unit configured to transmit or receive data to or from a card terminal or a communication device through wireless communication; an information storage unit configured to store card information relating to a plurality of cards; a user input unit configured to receive a user input from a user to select card information corresponding to one of the plurality of cards; a display unit configured to visually display the selected card information; and a processor configured to extract the card information selected by the user from the information storage unit, process the card information, deliver the processed card information to the display unit, and process the data transmitted or received through the wireless communication unit.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A multi-smartcard may include: a support; a touchscreen disposed on the support configured to receive an input operation from a user including a first input operation and a second input operation; and a processor configured to generate a first user interface (UI) of card information corresponding to the input operation applied to the touchscreen and instruct the touch screen to display the first UI, and to receive the first and second input operations, wherein the processor is configured to change the card category in response to receiving the first input operation and change the card type in response to receiving the second input operation.

Abstract: A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. The redistribution structure may include a linear portion and a bump pad, and a conductive bump on the bump pad may include a main bump and a protruding part extending toward the linear portion, where the protruding part may be smaller than the main bump.

Abstract: A mobile payment method using a smart multi card and a smart multi card application, enabling the automatic recommendation of a card to be used when making a mobile payment. The mobile payment method using a smart multi card, includes storing card information of a smart multi card; collecting order information on an ordered product through a user terminal; choosing a recommended card that is adequate considering the order information among a plurality of cards included in the smart multi card; and transmitting the card information of the recommended card to the smart multi card.

Abstract: A smart card may include: a support; and a magnetic field generator arranged on the support and including at least one track configured to generate a magnetic signal corresponding to a card information stored on the smart card by forming a magnetic field, wherein the at least one track may include a single magnetic cell in which both magnetic poles thereof are formed when an electric current flows therethrough, wherein the magnetic cell may include: a first layer having a first circuit pattern and a first via hole; a second layer having a second circuit pattern and a second via hole; and a core material provided between the first layer and the second layer, and wherein the first and second via holes are matched so that the electric current rotationally flows through the circuit patterns and the via holes in a predetermined direction with respect to the core material.

Abstract: A smart multi card, and a method for issuing card data for a smart multi card. The smart multi card includes a first storage unit storing one or more pieces of first encryption data and seed data. The first encryption data generated by performing a first encryption of specific card information or alternative information corresponding to the card information. A second storage unit for storing card related data including storage location data of the specific first encryption data and seed data in the first storage unit. A user input unit for receiving a user's operation. A first control unit for generating token data by performing a second encryption of the first encryption data corresponding to the selected card using the seed data. A second control unit for making a request to the first control unit for the token data. A card data output unit for externally outputting the token data.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.

Abstract: A smart multi-card may include: a frame; a wireless communication unit configured to transmit or receive data to or from a card terminal or a communication device through wireless communication; an information storage unit configured to store card information relating to a plurality of cards; a user input unit configured to receive a user input from a user to select card information corresponding to one of the plurality of cards; a display unit configured to visually display the selected card information; and a processor configured to extract the card information selected by the user from the information storage unit, process the card information, deliver the processed card information to the display unit, and process the data transmitted or received through the wireless communication unit.

Abstract: A multi-smartcard may include: a support; a touchscreen disposed on the support configured to receive an input operation from a user including a first input operation and a second input operation; and a processor configured to generate a first user interface (UI) of card information corresponding to the input operation applied to the touchscreen and instruct the touch screen to display the first UI, and to receive the first and second input operations, wherein the processor is configured to change the card category in response to receiving the first input operation and change the card type in response to receiving the second input operation.

Abstract: A smart card may include: a support; and a magnetic field generator arranged on the support and including at least one track configured to generate a magnetic signal corresponding to a card information stored on the smart card by forming a magnetic field, wherein the at least one track may include a single magnetic cell in which both magnetic poles thereof are formed when an electric current flows therethrough, wherein the magnetic cell may include: a first layer having a first circuit pattern and a first via hole; a second layer having a second circuit pattern and a second via hole; and a core material provided between the first layer and the second layer, and wherein the first and second via holes are matched so that the electric current rotationally flows through the circuit patterns and the via holes in a predetermined direction with respect to the core material.

Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.

Abstract: A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.

Abstract: A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.

Abstract: An optical joystick and portable electronic device having the same are disclosed, by which malfunctions of the optical joystick due to sunlight or external illumination light are prevented or minimized. Therefore, precision of the optical joystick can be enhanced. The optical joystick according to the present invention includes an infrared light source, a cover part having a contacting surface for a contact by a subject, a light-receiving part detecting the infrared ray, and an optical member provided on an light path of the infrared ray traveling from the cover part toward the light-receiving part, wherein the cover part comprises a cover base and an infrared ray pass layer blocking out external noisy light on a predetermined band and passing substantially a wavelength band of infrared rays.

Abstract: The present invention relates to an ultra thin optical pointing device, and a personal portable device having the optical pointing device. The optical pointing device includes a PCB (508). An infrared LED (501) is provided on a side of the top surface of the PCB. A cover plate (503) detects motion of a finger, which is a subject. An illumination system (502) transmits light from the infrared LED to the cover plate. An image forming system lens (505) is placed below the cover plate to condense reflected light. An optical image sensor (507) receives a reflected image of the subject and detects motion of the subject. A body tube (509) is provided on a side portion over the PCB. The illumination system, the cover plate and the image forming system lens are made of an optical plastic material capable of passing only a wavelength band of infrared rays.

Abstract: The present invention relates to an optical pointing device for mobile terminals, which can improve assembly efficiency and stability. An optical pointing device according to the present invention includes a holder having an accommodation opening therein. Light emitting means is installed in the accommodation opening of the holder. A condensing element includes a pair of prisms installed in the accommodation opening of the holder and integrated into a single structure so as to condense light emitted from the light emitting means, and a condensing lens disposed between the paired prisms. An image sensor captures light provided through the condensing element and calculates the captured light as displacement values. The condensing element includes a lens holder coupled to the condensing lens so as to maintain stable installation of the condensing lens between the paired prisms.

Abstract: An optical joystick includes a first waveguide including a first reflecting surface located below a reading area for sensing the movement of an object and a first plano-convex lens portion condensing light reflected from the first reflecting surface, a second waveguide including a second plano-convex lens portion facing the first plano-convex lens portion and a second reflecting surface for reflecting light refracted at the second plano-convex lens portion, and an image sensor located below the second reflecting surface. The first reflecting surface and the first plano-convex lens portion form a single body, and the second plano-convex lens portion and the second reflecting surface also form a single body. The reflecting surface and the lens portion are in a single body, thereby notably reducing the thickness of the optical joystick. The first and second waveguides are facing each other, thereby improving refraction and condensing light.