Patents by Inventor Jae-Hun Kim
Jae-Hun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240080713Abstract: Methods and apparatuses are provided in a wireless communication system. Packet data convergence protocol (PDCP) configuration information that configures a PDCP entity of the terminal to use an uplink data compression (UDC) is received from a base station. The PDCP entity generates a UDC header and a UDC data block, based on the PDCP configuration information. The PDCP entity ciphers the UDC header and the UDC data block. The PDCP entity generates PDCP data including a PDCP header, the ciphered UDC header and the ciphered UDC data block. The generated PDCP data is transmitted to the base station. A header compression is not configured in case that the UDC is configured.Type: ApplicationFiled: November 14, 2023Publication date: March 7, 2024Inventors: Sang Bum KIM, Soeng Hun KIM, Dong Gun KIM, Jae Hyuk JANG, Alexander SAYENKO, Seung Ri JIN
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Patent number: 11923124Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.Type: GrantFiled: August 2, 2019Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Jae Hun Kim, Joung Gul Ryu, Byung Soo Kang, Byeong Cheol Moon, Jeong Gu Yeo
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Publication number: 20240069310Abstract: A lens includes a lens unit; an intermediate layer configured to cover a surface portion of the lens unit; and a water-repellent layer, configured to cover a surface portion of the intermediate layer, including a base layer and an ultraviolet (UV) absorber disposed in the base layer.Type: ApplicationFiled: March 16, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Kyung LEE, Byung Ju KIM, Jung Ho LEE, Na Yi KANG, Joung Hun KIM, Jae Goon AUM
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Publication number: 20240074249Abstract: The present disclosure relates to a display device and a manufacturing method thereof, and a display device according to one or more embodiments includes a substrate, a transistor above the substrate, a first pixel electrode connected to the transistor, a scattering layer above the first pixel electrode, and defining repeating protrusions and depressions, a second pixel electrode above the scattering layer, and connected with the first pixel electrode, an emission layer above the second pixel electrode, and a common electrode above the emission layer.Type: ApplicationFiled: August 22, 2023Publication date: February 29, 2024Inventors: Yang-Ho JUNG, Woong Sik KIM, Kab Jong SEO, Jun Ho SIM, Jae Hun LEE
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Patent number: 11913773Abstract: The present invention relates to a method of non-destructively measuring a thickness of a reinforcement membrane, and more particularly, to a method of non-destructively measuring a thickness of a hydrogen ion exchange reinforcement membrane for a fuel cell, in which the reinforcement membrane has a symmetric three-layer structure including a reinforcement base layer and pure water layers disposed at opposing sides of the reinforcement base layer, including performing total non-destructive inspection and omitting a process of analyzing a position by means of a thickness peak of a power spectrum of the respective layers of the reinforcement membrane.Type: GrantFiled: May 20, 2019Date of Patent: February 27, 2024Assignee: LG CHEM, LTD.Inventors: Sung-Hyun Yun, Joo-Yong Park, Ji-Hun Kim, Jae-Choon Yang
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Publication number: 20240047119Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.Type: ApplicationFiled: October 19, 2023Publication date: February 8, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun KIM, Byeong Cheol MOON
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Patent number: 11890906Abstract: Disclosed are a vehicle suspension spring device and a vehicle suspension system having the same. The vehicle suspension spring device includes a leaf spring unit comprising at least one leaf spring disposed in a lateral direction of a vehicle, a pair of first coupling parts provided at opposite ends of the leaf spring unit in a longitudinal direction and rotatably coupled to a pair of axles on which opposite wheels of the vehicle are mounted, and a pair of second coupling parts provided at two points between the opposite ends of the leaf spring unit in the longitudinal direction to be rotatably coupled to a subframe of the vehicle.Type: GrantFiled: November 14, 2022Date of Patent: February 6, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOLONGLOTECH. INC, HYUNDAI MOBIS CO., LTD.Inventors: Hyun Soo Kim, Jae Hun Kim, Young Ha Kim, Woo Bin Song, Dong Won Kim, Jun Sung Goo
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Publication number: 20240033846Abstract: A laser welding apparatus includes a stage on which a first structure and a second structure, targets of a laser welding process, are seated, a vision camera located above the stage and obtaining a sample image indicating a welding target region in which the first structure and the second structure come into contact, and a controller adjusting setting parameters of the vision camera. The controller obtains a sample RGB value from each of a plurality of regions of interest selected from the sample image, compares the sample RGB value with a reference RGB value obtained from each of reference regions of interest defined in the same location as the plurality of regions of interest in a predetermined reference image, to adjust at least one of the setting parameters, and sets the vision camera.Type: ApplicationFiled: January 27, 2023Publication date: February 1, 2024Inventors: Hoemin Cheong, Jae Hun Kim, Hyeong Won Kim, Sung Chel Yoon, Ki Dong Lee
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Publication number: 20240027324Abstract: The present disclosure relates to an apparatus for detecting microplastics based on optical technology, more particularly the present disclosure relates to an apparatus for detecting microplastics, which is capable of detecting and analyzing microplastics of various sizes that exist in a fluid in real time regardless of transparency using a microfluidic chip based on optical technology.Type: ApplicationFiled: March 21, 2023Publication date: January 25, 2024Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Seok Won HONG, Jae Hun KIM, Jiyun HAN, Subeen PARK
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Publication number: 20240029945Abstract: A coil component includes: a body; a coil disposed within the body; and an insulating film covering at least a portion of the coil in the body, wherein the insulating film includes a copolymer including a repeating unit derived from a monomer containing an unsaturated bond and a repeating unit derived from a parylene monomer.Type: ApplicationFiled: January 6, 2023Publication date: January 25, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Jae Hun Kim, Doo Ho Park, Hye Hun Park, In Young Kang, Ki Young Yoo, Boum Seock Kim
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Publication number: 20230420179Abstract: A coil component includes a body, an insulating layer disposed in the body, at least one first coil disposed on a first surface of the insulating layer, at least one second coil disposed on a second surface of the insulating layer, a plurality of conductive vias connecting the at least one first coil and the at least one second coil, a first external electrode disposed on the body and connected to the at least one first coil; and a second external electrode disposed on the body and connected to the at least one second coil, wherein at least two conductive vias, among the plurality of conductive vias, include a plurality of side surfaces, respectively, and at least one side surface, among the plurality of side surfaces, is at least partially uncovered by and exposed from the insulating layer.Type: ApplicationFiled: January 31, 2023Publication date: December 28, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun KIM, Boum Seock KIM, Ju Hwan YANG, Woo Jin LEE
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Patent number: 11850903Abstract: A vehicle height adjuster includes an actuator provided to form vertical linear displacement between a leaf spring and a suspension arm, a power source connected to the actuator and configured to provide power to drive the actuator, a vehicle height sensor provided to detect a change in a height of the suspension arm relative to a vehicle body, and a controller connected to the vehicle height sensor and the power source and configured to receive a signal from the vehicle height sensor and to control the power source to drive the actuator.Type: GrantFiled: October 31, 2022Date of Patent: December 26, 2023Assignees: Hyundai Motor Company, Kia Corporation, HYUNDAI MOBIS CO., LTD.Inventors: Jae Hun Kim, Hee Hoon Son
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Patent number: 11856206Abstract: A method for decoding an image based on an intra prediction, comprising: obtaining a first prediction pixel of a first region in a current block by using a neighboring pixel adjacent to the current block; obtaining a second prediction pixel of a second region in the current block by using the first prediction pixel of the first region; and decoding the current block based on the first and the second prediction pixels.Type: GrantFiled: September 15, 2022Date of Patent: December 26, 2023Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Je Chang Jeong, Ki Baek Kim, Won Jin Lee, Hye Jin Shin, Jong Sang Yoo, Jang Hyeok Yun, Kyung Jun Lee, Jae Hun Kim, Sang Gu Lee
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Publication number: 20230408376Abstract: Provided herein are systems for determining a stretch condition of a tissue and assessing the stiffness of the tissue. Also provided herein are methods for using the systems for measuring stiffness of a tissue, assessing the effect of an agent on a tissue, and identifying subjects having a disease or disorder associated with increased or decreased stiffness of a tissue.Type: ApplicationFiled: June 16, 2023Publication date: December 21, 2023Applicants: Trustees of Boston University, Beth Israel Deaconess Medical Center, Inc.Inventors: Bela Suki, Jae Hun Kim, Joseph Hall, Ramaswamy Krishnan, Niccole Schaible
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Patent number: 11848136Abstract: A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body.Type: GrantFiled: November 19, 2020Date of Patent: December 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11837394Abstract: A coil component may include a body having one surface and the other surface facing each other, and including a molded portion having a core and a cover portion disposed on the molded portion; a wound coil disposed between the molded portion and the cover portion and wound around the core; and a first accommodation groove and a second accommodation groove disposed on the one surface of the body to be spaced apart from each other, and respectively disposed outside of a region of the body corresponding to the core, wherein both end portions of the wound coil are respectively disposed in the first and second accommodation grooves, and a minimum value of a distance between the first and second accommodation grooves is greater than a diameter of the core.Type: GrantFiled: July 30, 2019Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Jae Hun Kim
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Patent number: 11830665Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.Type: GrantFiled: August 2, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon
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Patent number: 11830654Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.Type: GrantFiled: November 26, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
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Patent number: 11830662Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.Type: GrantFiled: January 22, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon, Joung Gul Ryu
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Patent number: 11830652Abstract: A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.Type: GrantFiled: July 31, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Byeong Cheol Moon