Abstract: A touch sensing device of a current driving type, which separately drives a parasitic capacitor by using an electric charge controller, includes a parasitic capacitance charger connected to a touch sensing line to charge a parasitic capacitor of a touch electrode connected to the touch sensing line with a predetermined charging current during a charging period and a sensing unit connected to the touch sensing line during a first driving period to drive a capacitor of the touch electrode with a first driving current corresponding to a difference voltage between a first voltage, charged into the parasitic capacitor when a touch does not occur, and a second voltage charged into the parasitic capacitor when a touch occurs and to sense a first touch voltage of the capacitor based on the first driving current during a first sensing period.

Abstract: A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

Abstract: A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.

Abstract: The present disclosure relates to a height adjustment apparatus of a vehicle seat, whereby during a height adjustment of a seat cushion, a desired tilting angle of the seat cushion is obtained and heights of a front part and a rear part of the seat cushion are individually adjusted. Due to the height adjustment apparatus, the comfort of a seated occupant is improved by adjusting the angles of the seat cushion in response to various postures of the occupant. In addition, a link connection is structurally secured and thus its durability is also improved.

Abstract: A semiconductor device includes a plurality of active fins defined by an isolation layer on a substrate, a gate structure on the active fins and the isolation layer, and a gate spacer structure covering a sidewall of the gate structure. A sidewall of the gate structure includes first, second, and third regions having first, second, and third slopes, respectively. The second slope increases from a bottom toward a top of the second region. The second slope has a value at the bottom of the second region less than the first slope. The third slope is greater than the second slope.

Abstract: A semiconductor device includes a plurality of active fins defined by an isolation layer on a substrate, a gate structure on the active fins and the isolation layer, and a gate spacer structure covering a sidewall of the gate structure. A sidewall of the gate structure includes first, second, and third regions having first, second, and third slopes, respectively. The second slope increases from a bottom toward a top of the second region. The second slope has a value at the bottom of the second region less than the first slope. The third slope is greater than the second slope.

Abstract: A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.

Abstract: A method of fabricating a semiconductor device includes forming an active pattern protruding from a substrate, forming a liner layer on the active pattern, forming a sacrificial gate pattern on the liner layer and crossing the active pattern, forming source/drain regions on the active pattern and at both sides of the sacrificial gate pattern, forming an interlayer insulating layer to cover the source/drain regions, forming capping insulating patterns on the interlayer insulating layer to expose the sacrificial gate pattern, and removing the sacrificial gate pattern and the liner layer by an etching process using the capping insulating patterns as an etch mask to form a gap region exposing the active pattern. The active pattern includes a material having a lattice constant greater than a lattice constant of the substrate, and the capping insulating patterns include a material having an etch selectivity with respect to the liner layer.

Abstract: A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.

Abstract: A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

Abstract: An electronic device is provided. The electronic device includes an input interface configured to receive first input information relating to a sharing content operation, a communication interface configured to receive second input information relating to the sharing content operation from at least one external electronic device, a memory configured to store at least one instruction relating to processing of the sharing content, and a processor electronically connected to the input interface, the communication interface, and the memory, where the processor, upon executing the least one instruction, is configured to determine collision occurrence possibility of the first input information and the second input information, and to apply a specified effect corresponding to the collision occurrence possibility.

Abstract: A gas detection device comprises a pump module for drawing in air; a sensor module including a plurality of unit sensors detecting a gas included in the air; a driving module driving the pump module and the sensor module; and a case including a main body mounted to allow at least one among the pump module, the sensor module, and the driving module to be detachable and a cover connected to the main body to allow the at least one among the pump module, the sensor module, and the driving module to be exposed.

Abstract: An electronic device and method are disclosed. The electronic device includes a touchscreen, microphone, speaker, wireless communication circuit, processor and memory. The memory stores instructions executable by the processor to: receive a first user utterance through the microphone, transmit, by the wireless communication circuit, the received first user utterance to an external server through the wireless communication circuit, receive, by the wireless communication circuit, first text data generated by the external server using automatic speech recognition (ASR), when the first text data includes at least one pre-stored word, phrase, and sentence, identifying a plurality of tasks mapped to the at least one pre-stored word, phrase, and sentence, and execute the identified plurality of tasks using at least one of sequential execution or parallel execution.

Abstract: An electronic device and method are disclosed herein. The electronic device includes a touchscreen, a wireless communication circuit, a microphone, a processor and memory storing instructions implementing the method, including: receiving a first user input including a request to perform a task, transmitting first data associated with the first user input to an external server, receiving a sequence of states executable to perform the task, detecting whether at least one first parameter is omitted from the first user input based on whether execution type information is received with the sequence of states, when the execution type information is received, displaying a graphical user interface (GUI) including at least one input field requesting input of the at least one first parameter, and when the execution type information is not received from the external server, executing a portion of the sequence of states to perform a portion of the task.

Abstract: A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.

Abstract: An electronic apparatus is provided. The electronic apparatus includes a housing including a first plate facing a first direction and a second plate facing a second direction opposite to the first direction, a display exposed through the first plate, a first force sensor disposed inside the housing and disposed under the display, a second force sensor physically spaced apart from the first force sensor and adjacent to the second plate, a processor positioned inside the housing and electrically connected to the display, the first force sensor, and the second force sensor, and a memory electrically connected to the processor and positioned inside the housing.

Abstract: A semiconductor device includes a plurality of active fins defined by an isolation layer on a substrate, a gate structure on the active fins and the isolation layer, and a gate spacer structure covering a sidewall of the gate structure. A sidewall of the gate structure includes first, second, and third regions having first, second, and third slopes, respectively. The second slope increases from a bottom toward a top of the second region. The second slope has a value at the bottom of the second region less than the first slope. The third slope is greater than the second slope.

Abstract: A method of providing a content in an electronic device is provided. The method includes include detecting a mapping event associated with a content of the electronic device, in response to detecting the mapping event, confirming the content, determining a contact point for mapping the content, and mapping the content to the contact point for mapping.

Abstract: A semiconductor device including a first fin protruding on a substrate and extending in a first direction; a first gate electrode on the first fin, the first gate electrode intersecting the first fin; a first trench formed within the first fin at a side of the first gate electrode; a first epitaxial layer filling a portion of the first trench, wherein a thickness of the first epitaxial layer becomes thinner closer to a sidewall of the first trench; and a second epitaxial layer filling the first trench on the first epitaxial layer, wherein a boron concentration of the second epitaxial layer is greater than a boron concentration of the first epitaxial layer.