Patents by Inventor Jae-Hyun Park

Jae-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12225821
    Abstract: A method of making an acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes forming or providing a mold having one or more grooves in a top surface of the mold that extend in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam, the distal portion of the beam having a corrugated section including one or more grooves that correspond to the grooves of the mold. The method also includes forming a gap in the structure to define two beams separated by the gap, and releasing the structure from the mold to form one or more cantilever beams that increases an acoustic resistance of the gap between sensors.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: February 11, 2025
    Assignee: Skyworks Global Pte. Ltd.
    Inventors: You Qian, Rakesh Kumar, Guofeng Chen, Myeong Gweon Gu, Myung Hyun Park, Jae Hyung Lee, Michael Jon Wurtz
  • Publication number: 20250048861
    Abstract: A display device includes a first substrate including an open portion, a first barrier insulating layer disposed on the first substrate and including a first contact hole overlapping the open portion, a first fan-out line disposed on the first barrier insulating layer, a pad part integrally formed with the first fan-out line and exposed through the open portion, a second substrate disposed on the first fan-out line, a connection part disposed on the second substrate and connected to the first fan-out line, a second fan-out line disposed on a layer between the first fan-out line and the connection part and connected to the connection part, a data line disposed on the same layer as the connection part and electrically connected to the second fan-out line, a flexible film including a lead electrode, and a contact part electrically connecting the lead electrode and the pad part.
    Type: Application
    Filed: March 4, 2024
    Publication date: February 6, 2025
    Inventors: Si Joon SONG, Youn Woong KANG, Eui Jeong KANG, Min Sang KOO, Tae Oh KIM, Seok Hyun NAM, Jeong Jin PARK, Dong Hyun LEE, Jae Hak LEE
  • Publication number: 20250042748
    Abstract: An anode for a secondary battery includes an anode current collector, a first anode active material layer disposed on at least one surface of the anode current collector and including a first anode active material that includes a first silicon composite oxide, and a second anode active material layer disposed on the first anode active material layer and including a second anode active material that includes a second silicon composite oxide. Each of the first silicon composite oxide and the second silicon composite oxide includes a metal. A BET specific surface area of each of the first silicon composite oxide and the second silicon composite oxide is in a range from 2.0 m2/g to 6.5 m2/g.
    Type: Application
    Filed: July 17, 2024
    Publication date: February 6, 2025
    Inventors: Ji Hee BAE, Hyeon Soo KANG, Jae Ram KIM, Ji Won NA, So Hyun PARK, Sang Won BAE, Yeon Hwa SONG, Ki Joo EOM, Jeong Seok YEON, Myung Ro LEE, Jae Yeong LEE, Hyun Joong JANG
  • Patent number: 12218286
    Abstract: A light emitting module including a circuit board, a plurality of unit pixels arranged on the circuit board, a molding member covering the unit pixels, and an anti-glare layer disposed on the molding member, in which the molding member includes a first molding layer at least partially covering each of the unit pixels, and a second molding layer covering the first molding layer.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: February 4, 2025
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Jae Hyun Park, Seung Sik Hong
  • Patent number: 12219585
    Abstract: Disclosed are various methods for transmitting or receiving data or control information having high reliability conditions. A method for operating a terminal which transmits uplink control information (UCI) includes: a step of generating UCI; a step of comparing the priority of an uplink (UL) control channel for the transmission of the UCI with the priority of a UL data channel when some symbols of the UL control channel and the UL data channel overlap; and a step of selecting the UL channel having a higher priority among the UL control channel and the UL data channel, and transmitting the UCI to a base station through the selected UL channel.
    Type: Grant
    Filed: January 17, 2024
    Date of Patent: February 4, 2025
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Cheul Soon Kim, Sung Hyun Moon, Seung Kwon Baek, Gi Yoon Park, Ok Sun Park, Jae Su Song
  • Patent number: 12218380
    Abstract: An electrode assembly manufacturing method includes the steps of: assembling an electrode stack; performing a primary heat press operation on the electrode stack while engaging the electrode stack with a gripper; and then performing a secondary heat press operation on the electrode stack while the gripper is disengaged from the electrode stack. The secondary heat press operation may include applying heat and pressure to the electrode stack for a time period from 5 seconds to 60 seconds under a temperature condition from 50° C. to 90° C. and under a pressure condition from 1 Mpa to 6 Mpa. The step of assembling the electrode stack may include alternately stacking first and second electrodes on an elongated separator sheet, and sequentially folding the separator sheet over a previously-stacked one of the electrodes before a subsequent electrode is stacked. An apparatus for performing the manufacturing method is also disclosed.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: February 4, 2025
    Assignee: LG Energy Solution, Ltd.
    Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung
  • Patent number: 12218193
    Abstract: An integrated circuit (IC) device includes a first region and a second region adjacent to each other along a first direction on a substrate, fin patterns in each of the first and second regions extending along a second direction perpendicular to the first direction; gate electrodes extending along the first direction and intersecting the fin patterns; and an isolation region between the first and second regions, a bottom of the isolation region having a non-uniform height relative to a bottom of the substrate.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-hyun Park, Kye-hyun Baek, Yong-ho Jeon, Cheol Kim, Sung-il Park, Yun-il Lee, Hyung-suk Lee
  • Publication number: 20250040241
    Abstract: A semiconductor device includes a first active pattern extending in a first direction, a second active pattern on the first active pattern and extending in the first direction, a gate structure on the first active pattern and the second active pattern and extending in a second direction intersecting the first direction, a first source/drain region on side faces of the gate structure and connected to the first active pattern, a second source/drain region on the side faces of the gate structure and connected to the second active pattern, and an intermediate connecting layer which includes a first intermediate conductive pattern between the first active pattern and the second active pattern, and a second intermediate conductive pattern connected to the first intermediate conductive pattern between the first source/drain region and the second source/drain region.
    Type: Application
    Filed: February 1, 2024
    Publication date: January 30, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung Il PARK, Jae Hyun PARK, Jin Wook YANG
  • Publication number: 20250038308
    Abstract: Examples of the disclosure include a battery module including a plurality of cells, an insulation sheet between the plurality of cells, the insulation sheet having an upper surface and a lower surface disposed so as to face cells adjacent thereto, respectively, and a refractory layer formed on at least one side surface part of a border side surface between the upper surface and the lower surface of the insulation sheet, wherein the refractory layer includes an inorganic binder. Examples of the disclosure also include a method of manufacturing the battery module, and a battery pack including the battery module.
    Type: Application
    Filed: May 24, 2024
    Publication date: January 30, 2025
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Jae Hyun LEE, Bo Kyung RYU, Seung Yong YANG, Hye Jin PARK, Ha Na RA, Myung Heui WOO, Sang Hoon KIM
  • Publication number: 20250038309
    Abstract: Example embodiments include an aerogel composition for battery insulation sheets, the aerogel composition including a reinforcement material including a first fibrous support and a second fibrous support, an aerogel, a functional material including a binder, a dispersant, or a combination thereof, and a solvent, wherein the first fibrous support and the second fibrous support have different ingredients. Example embodiments also include a method of manufacturing the aerogel composition, a battery insulation sheet formed using the aerogel composition, and a method of manufacturing the battery insulation sheet.
    Type: Application
    Filed: May 28, 2024
    Publication date: January 30, 2025
    Applicant: SAMSUNG SDI CO., LTD.
    Inventors: Jae Hyun LEE, Bo Kyung RYU, Seung Yong YANG, Hye Jin PARK, Ha Na RA, Myung Heui WOO, Sang Hoon KIM
  • Publication number: 20250038307
    Abstract: An aerogel composition for battery insulation sheets includes a reinforcement material including two or more fibrous supports, an aerogel, a functional material including a binder, a dispersant, or a combination thereof, and a solvent, wherein the two or more fibrous supports have different aspect ratios (AR) as represented by Formula 1: AR=L/D,??Formula 1 where in Formula 1, L indicates an average length of a fibrous support of the two or more fibrous supports and D indicates an average diameter of the two or more fibrous supports.
    Type: Application
    Filed: May 21, 2024
    Publication date: January 30, 2025
    Inventors: Jae Hyun LEE, Bo Kyung RYU, Seung Yong YANG, Hye Jin PARK, Ha Na RA, Myung Heui WOO, Sang Hoon KIM
  • Patent number: 12212645
    Abstract: A clock frequency divider circuit and a receiver are provided. The clock frequency divider circuit includes a reset retimer circuit configured to receive a reset signal and a clock signal, output a reset buffer signal of a differential signal pair obtained by buffering the reset signal, and output a reset synchronization signal obtained by synchronizing the reset signal with the clock signal, a clock buffer circuit configured to receive the clock signal and the reset synchronization signal and output a clock buffer signal of a differential signal pair obtained by buffering the clock signal, and an IQ divider circuit configured to output first through fourth output signals having different phases based on the reset buffer signal and the clock buffer signal.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: January 28, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Juyun Lee, Vishnu Kalyanamahadevi Gopalan Jawarlal, Kang Jik Kim, Hyo Gyuem Rhew, Jae Hyun Park
  • Patent number: 12212073
    Abstract: Disclosed is a UWB antenna module arranged in the lateral direction of a portable terminal so as to prevent deterioration of communication performance while minimizing a mounting space. The disclosed UWB antenna module comprises: a planar base substrate; a plurality of radiation patterns arranged on the upper surface of the base substrate, and arranged so as to be spaced from each other; a switching element arranged on the lower surface of the base substrate and connected to the plurality of radiation patterns; and a communication chipset arranged to be spaced from the switching element on the lower surface of the base substrate, and connected to one of the plurality of radiation patterns through a switching operation of the switching element.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: January 28, 2025
    Assignee: AMOSENSE CO.,LTD
    Inventors: Kyung Hyun Ryu, Hyung Il Baek, Yun Sik Seo, Jeong Geun Heo, Se Ho Lee, Hyun Joo Park, Seung Yeob Yi, Jae Il Park, Hong Dae Jung
  • Publication number: 20250026331
    Abstract: A motor driving redundancy device for an electronic parking brake includes a first motor-driving module configured to supply current to a motor, a first driver module configured to control the first motor-driving module, a second motor-driving module configured to drive the motor, a second driver module configured to control the second motor-driving module, a monitoring module configured to monitor a status of the first motor-driving module and the second motor-driving module, and a processor configured to, when a failure is detected in either the first motor-driving module or the second motor-driving module by the monitoring module, control at least one of the first motor-driving module or the second motor-driving module to drive the motor.
    Type: Application
    Filed: March 13, 2024
    Publication date: January 23, 2025
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Bo Min KIM, Jae Hyun PARK, Se Hyun KIM, Byeong Jin CHOI, Cheol Jun KIM
  • Publication number: 20250029741
    Abstract: The present invention relates to a method for analyzing a severe accident at a nuclear power plant by using a modular analysis code, comprising the step of: receiving the input of a nuclear power plant to be analyzed and an accident sequence; selecting, from a modular analysis code, an individual module for analyzing a severe accident that is triggered by the accident sequence; setting an accident simulation variable for simulating the severe accident from a nuclear power plant input model; determining whether the accident simulation variable is valid; and, if determined to be valid, analyzing the severe accident through the modular analysis code by using the accident simulation variable, wherein the individual module of the modular analysis code includes: a master module; a first module for analyzing in-core phenomena in the event of a severe accident; a second module for analyzing ex-core phenomena in the event of a severe accident; and a third module for analyzing behaviors of fission products in the event
    Type: Application
    Filed: January 5, 2023
    Publication date: January 23, 2025
    Inventors: Jae Hwan PARK, Yu Jung CHOI, Chang Hyun KIM
  • Patent number: 12206286
    Abstract: A rotor for an induction motor includes a rotor core having a hollow portion on a central portion wherein a shaft is coupled to the rotor core by being inserted through the hollow portion, a plurality of slots radially formed in the rotor core around a central axis of the shaft, a plurality of conductor bars coupled to the plurality of slots, and an end ring electrically connecting the plurality of conductor bars to each other, wherein the rotor core is thermally treated above Curie temperature to form a predetermined pattern on an outer circumference of the rotor core.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 21, 2025
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Jin Ho Choi, Sang Jin Park, Jong Seok Lee, Ki O Kim, Sung Woo Hwang, Myung Seop Lim, Jae Hyun Kim
  • Publication number: 20250022784
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Publication number: 20250019474
    Abstract: The present invention pertains to a polyolefin having excellent processability. A polyolefin prepared in the presence of a hybrid metallocene catalyst according to an embodiment of the present invention has a broad unimodal molecular weight distribution with a shoulder, and has excellent high-speed processability.
    Type: Application
    Filed: November 22, 2022
    Publication date: January 16, 2025
    Inventors: Ahreum KIM, Hye Ran PARK, Jeong Hyun PARK, Jae Yun LIM, Junho SEO, Ui Gap JOUNG
  • Publication number: 20250023022
    Abstract: An anode for a lithium secondary battery includes an anode current collector, and an anode active material layer formed on at least one surface of the anode current collector. The anode active material layer includes a first region adjacent to the anode current collector and a second region spaced apart from the anode current collector in a thickness direction with the first region interposed therebetween. The anode active material layer includes an anode active material including an artificial graphite-based active material and a silicon-based active material having a minimum particle diameter (Dmin) in a range from 1 ?m to 5 ?m. A content of the silicon-based active material based on a total weight of the anode active material included in the second region is greater than a content of the silicon-based active material based on a total weight of the anode active material included in the first region.
    Type: Application
    Filed: June 24, 2024
    Publication date: January 16, 2025
    Inventors: So Hyun PARK, Jae Ram KIM, Jeong Seok YEON, Ji Won NA, Sang Won BAE, Ji Hee BAE, Jae Yeong LEE
  • Patent number: 12190560
    Abstract: An automatic labeling method for assigning labels to unlabeled point clouds among a set of labeled and unlabeled point clouds includes preparing an initial machine learning classification model, selecting a labeled point cloud for each of the unlabeled point clouds based on similarities between a feature vector of each of the unlabeled point clouds output through the model and feature vectors of the labeled point clouds output through the model and assigning a cluster label to each of the unlabeled point clouds based on a label of the selected labeled point cloud, assigning pseudo labels to the unlabeled point clouds to which the cluster labels are assigned based on a confidence score obtained through the model, and updating the model by training the model with the labeled point clouds and the unlabeled point clouds to which the pseudo labels are assigned.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: January 7, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Jin Kyu Hwang, Ya Gyeol Seo, Jae Hyun Park, Su Rin Jo, Min Hyeok Lee, Seung Hoon Lee, Jun Hyeop Lee, Sang Youn Lee