Patents by Inventor Jae-Jeong Kim

Jae-Jeong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240374846
    Abstract: An inhaler includes a housing having one surface, the other surface opposite to the one surface, and a plurality of side surfaces connecting the one surface and the other surface, a mouthpiece which is disposed on the one side of the housing, a reservoir which is disposed inside the housing and stores an inhalable composition, a nozzle which extends from the mouthpiece to the reservoir, and a needle valve which is movably disposed inside the nozzle, when a suction force is not applied to the mouthpiece, the needle valve is maintained in a first state in which the nozzle is closed, and when a suction force is applied through the mouthpiece, the needle valve is switched into a second state in which the nozzle is opened.
    Type: Application
    Filed: March 20, 2023
    Publication date: November 14, 2024
    Applicant: KT&G CORPORATION
    Inventors: Tae Heon KIM, Jae Hyun KIM, Mi Jeong LEE, Yongmi JUNG, Eun Mi JEOUNG, Seung Kyu HAN, Minseok JEONG, Tae Young CHUNG
  • Patent number: 12134848
    Abstract: An anhydrous fiber-dyeing apparatus using vacuum transfer, includes: a hollow drum in which a plurality of fine holes are formed to penetrate therethrough, and a fiber to be dyed are wound around an outer surface thereof; a transfer film covering the outer surface of the fiber wound around the drum and having an inner side surface coated with a dye; heating means heating the fiber wound around the drum; and a vacuum means suctioning air through an inner space of the drum to form a vacuum pressure through the fine holes of the drum.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: November 5, 2024
    Assignee: ASSEMS INC.
    Inventors: Ji-Sang Jang, Jae-Jeong Lee, Kyoung Kyu Kim, Kyung-Seok Choi, Chi-Kyun Park, Yong-Hoon Park
  • Publication number: 20240358083
    Abstract: The following embodiments relate to a method of controlling an electronic device to implement virtual smoke in a virtual display device. The method of controlling an electronic device according to an embodiment includes predicting a virtual smoke implementation timepoint based on a smoking pattern learned using a pressure sensor and a button included in the electronic device; adjusting a volume and concentration of virtual smoke based on the learned smoking pattern; and transmitting a control signal including the virtual smoke implementation timepoint and the volume and concentration of virtual smoke to a device for displaying a virtual image.
    Type: Application
    Filed: March 22, 2023
    Publication date: October 31, 2024
    Applicant: KT&G CORPORATION
    Inventors: Minseok JEONG, Jae Hyun Kim, Tae Young CHUNG
  • Patent number: 12133457
    Abstract: An organic light-emitting device is provided. The device includes a first electrode, a second electrode, and an organic layer disposed between the first electrode and the second electrode and including an emission layer. The organic layer includes a first compound represented by Formula 1 and a second compound represented by Formula 2. Various possibilities for the constituents of chemical structures in Formulas 1 and 2 are presented.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: October 29, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hwan-Hee Cho, Myeong-Suk Kim, Jae-Yong Lee, Hye-In Jeong
  • Publication number: 20240351061
    Abstract: Proposed is an apparatus for inspecting and repairing a dispensed viscous fluid, the apparatus including a dispenser module dispensing a viscous fluid on a workpiece, a vision module generating original images by photographing the viscous fluid dispensed on the workpiece, a robot module moving the dispenser module and the vision module through predetermined paths, respectively, and a control module determining whether a defective part exists in the dispensed viscous fluid by analyzing the original images and controlling the dispenser module and the robot module to dispense a viscous fluid to a defective part when the defective part exists. Accordingly, a defect occurring in the viscous fluid dispensed on the workpiece can be repaired, and furthermore, the shape of the viscous fluid in the repaired part can be formed by using a correction module, thereby improving application quality.
    Type: Application
    Filed: February 16, 2024
    Publication date: October 24, 2024
    Inventors: Min Jeong HONG, Jae Hun KIM, Yoon Sung OH, Seul Gi LEE, Seung Won LEE
  • Publication number: 20240347462
    Abstract: A method for forming an insulating layer pattern includes providing a substrate comprising two or more different types of dielectric layer regions; and selectively forming a blocking layer on the substrate to include a first region and a second region. On the first region, the blocking layer is formed, whereas on the second region, no blocking layer is formed or the blocking layer is formed less than in the first region. The difference in water contact angle between the first region and the second region is within the range of 7 to 50 degrees.
    Type: Application
    Filed: June 22, 2024
    Publication date: October 17, 2024
    Inventors: Ha Kyung YUN, Jae Woo LEE, Jun Young KIM, So Jeong YEO, Han jin LEE, Pil Soo KIM, Jang Keun SIM, Cheol Kyu BOK
  • Patent number: 12116298
    Abstract: Disclosed is a method for removing nitrogen and phosphorus from sewage and wastewater through a combination of a biological nitrogen and phosphorus removal process using nitrite nitrogen and an anaerobic ammonium oxidation process. An objective of an embodiment of the present invention is to provide an apparatus for removing nitrogen and phosphorus in which, by inducing a denitritation- and nitritation-based biological nitrogen and phosphorus removal process in a bioreactor and applying an anaerobic ammonium oxidation process, nitrogen and phosphorus can be economically and effectively removed without separately injecting organic materials.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: October 15, 2024
    Assignees: BKT CO., LTD., SUDOKWON LANDFILL SITE MANAGEMENT CORPORATION
    Inventors: Young Hyun Park, Dae Hwan Rhu, Min Ki Jung, Jae Min Kim, Jonathan Liberzon, Jong Cheol Won, Joon Ho Cho, Swong Kyun Hong, Moon Jeong Kim, Kyung Sam Jeong, Min Hyuk Kim, June Woo Lee
  • Publication number: 20240326022
    Abstract: Provided is a single atom catalyst based on a carbon nanotube according to the present invention including a carbon support; and single atom metals supported on the carbon support, wherein the carbon support has a cone shape with an empty space formed therein and includes at least one carbon support having an open tip of the corn-shaped carbon support.
    Type: Application
    Filed: March 13, 2024
    Publication date: October 3, 2024
    Inventors: Nam Dong KIM, Jae Young JUNG, Sung Jong YOO, Bon-Cheol KU, Min Woo KIM, Hyeonsu JEONG
  • Publication number: 20240326005
    Abstract: The present disclosure provides a hydrogen generation device. The hydrogen generation device includes: a plurality of cylinders; a combustor disposed in each of the plurality of cylinders to combust a fuel; a distributor configured to deliver the fuel supplied from the fuel supplier to each of the plurality of combustors by distributing the fuel in a uniform quantity, a plurality of reactors disposed in the plurality of cylinders, respectively, to generate hydrogen by a reforming reaction of a feed supplied from a feed supplier while the reactors are heated by a combustion heat transmitted from the combustor, and a fuel meter disposed between the distributor and the combustor to adjust an amount of the fuel delivered from the distributor to the combustor in a fixed quantity.
    Type: Application
    Filed: March 13, 2024
    Publication date: October 3, 2024
    Inventors: Sun Hyuk BAE, Jae Jeong KIM
  • Publication number: 20240332159
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: June 4, 2024
    Publication date: October 3, 2024
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20240332714
    Abstract: In a method of manufacturing a battery cell stack, a lower battery cell and an upper battery cell are aligned with an bonding space therebetween in a stacking direction of battery cells. A distance in the stacking direction between an upper surface of the lower battery cell and a lower surface of the upper battery cell is continuously measured along a length direction or a width direction of the battery cells to derive a bonding space profile. An adhesive resin composition is sprayed along the length direction or the width direction while changing a moving rate of a nozzle based on a thickness of the profile. The lower surface of the upper battery cell are attached onto the sprayed adhesive resin composition.
    Type: Application
    Filed: March 8, 2024
    Publication date: October 3, 2024
    Inventors: Seung Won LEE, Jae Hun KIM, Yoon Sung OH, Seul Gi LEE, Min Jeong HONG
  • Publication number: 20240320869
    Abstract: The following embodiments relate to a method of controlling an electronic device to implement virtual smoke in a virtual display device. The method of controlling an electronic device includes predicting a virtual smoke implementation timepoint by monitoring the distance between one side of the electronic device and an object, and transmitting a control signal including the virtual smoke implementation timepoint to a device for displaying a virtual image.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Applicant: KT&G CORPORATION
    Inventors: Minseok JEONG, Jae Hyun KIM, Tae Young CHUNG
  • Patent number: 12100070
    Abstract: The following embodiments relate to a method of controlling an electronic device to implement virtual smoke in a virtual display device. The method of controlling an electronic device includes predicting a virtual smoke implementation timepoint by monitoring the distance between one side of the electronic device and an object, and transmitting a control signal including the virtual smoke implementation timepoint to a device for displaying a virtual image.
    Type: Grant
    Filed: March 21, 2023
    Date of Patent: September 24, 2024
    Assignee: KT&G CORPORATION
    Inventors: Minseok Jeong, Jae Hyun Kim, Tae Young Chung
  • Publication number: 20240304917
    Abstract: In a method of manufacturing a battery module, a plurality of battery cells each of which includes a pouch case including an inactive adhesive layer formed on an outer surface thereof and an electrode assembly accommodated in the pouch case are prepared. An energy is applied to the inactive adhesive layer of each of the battery cells to form an adhesive layer having an increased adhesion. The battery cells including the adhesive layer are stacked so that the adhesive layer is interposed between neighboring battery cells.
    Type: Application
    Filed: February 22, 2024
    Publication date: September 12, 2024
    Inventors: Jae Hun KIM, Yoon Sung OH, Seul Gi LEE, Seung Won LEE, Min Jeong HONG
  • Publication number: 20240300432
    Abstract: An airbag chute-integrated crash pad assembly includes: a main core that includes a door portion expanding when an airbag expands, and a cover portion mounted on a dash board. In particular, the main core is formed with a reinforcement portion extending downward from a lower surface of the cover portion, and the door portion and the cover portion are separated by a hinge groove that is formed in a lower surface of the main core and forms an expansion line. The reinforcement portion is combined with an airbag accommodation body that accommodates a passenger airbag (PAB). Thus, process optimization can be realized by omitting a process of machining a score and fusing a PAB chute, and also a problem of damage to the PAB chute can be solved.
    Type: Application
    Filed: September 18, 2023
    Publication date: September 12, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KBI DONGKOOK IND. CO., LTD., HYUNDAI MOBIS CO., LTD.
    Inventors: Jae-Hyun An, Min-Ha Lee, Chang-Hoon Yang, Young-Chan Cho, Neung-Han Kim, Dong-Hyuk Choi, Dong-Il Son, Chang-Woo Kang, In-Han Jeong
  • Publication number: 20240306494
    Abstract: An organic light-emitting device is provided. The device includes a first electrode, a second electrode, and an organic layer disposed between the first electrode and the second electrode and including an emission layer. The organic layer includes a first compound represented by Formula 1 and a second compound represented by Formula 2. Various possibilities for the constituents of chemical structures in Formulas 1 and 2 are presented.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 12, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: Hwan-Hee CHO, Myeong-Suk KIM, Jae-Yong LEE, Hye-In JEONG
  • Patent number: 12087148
    Abstract: A device for establishing a communication network and collecting situation information at a site of a collapse disaster is disclosed. The device includes a ground drone 10 deployed at the site of the collapse disaster, the ground drone 10 having a communication device 80 mounted thereon, a flying drone 32 mounted on and carried by the ground drone 10 to fly and photograph the site of the collapse disaster, a camera device 40 mounted on the ground drone 10 to photograph surroundings of the ground drone 10, a storage 50 installed on the ground drone 10, and a plurality of repeater modules 60 connected by the wireless communication network to relay wireless communications between the ground drone 10, the flying drone 32, and a command and control center 100, wherein the storage 50 accommodates the repeater modules 60, and throws the repeater modules 60 in response to an operation signal.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: September 10, 2024
    Assignee: Republic of Korea (National Disaster Management Research Institute)
    Inventors: Si Beum Cho, Kyung Su Lee, Jae Jeong Kim, Cheol Kyu Lee, Tae Wook Lee
  • Patent number: 12081911
    Abstract: A buried person search device using a detachable module is disclosed. The device includes a ground drone 10 deployed at a site of a collapse disaster, the ground drone 10 having a communication device 80 and a first beacon, a camera device 40 mounted on the ground drone 10 to photograph surroundings of the ground drone 10, a storage 50 installed on the ground drone 10, a plurality of repeater modules 60 connected by a wireless communication network to relay wireless communications between the ground drone 10, a flying drone 32, and a command and control center 100, each of the repeater modules 60 having a second beacon, and a sensing device 70 installed on the ground drone 10 or the repeater modules 60 to collect a sound, wherein the storage 50 accommodates the repeater modules 60, and throws the repeater modules 60 in response to an operation signal.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: September 3, 2024
    Assignee: Republic of Korea (National Disaster Management Research Institute)
    Inventors: Si Beum Cho, Kyung Su Lee, Jae Jeong Kim, Cheol Kyu Lee, Tae Wook Lee
  • Patent number: 12062833
    Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: August 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
  • Patent number: 12062588
    Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: August 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon