Patents by Inventor Jae Min Bae
Jae Min Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Patent number: 11915998Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: August 12, 2022Date of Patent: February 27, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Patent number: 11912102Abstract: An air conditioner for a vehicle including an air-conditioning case divided into a plurality of air passageways by a separation wall. A heating heat exchanger is disposed inside the air-conditioning case and exchanges heat with air to heat the interior of the vehicle. A perforated member is disposed at a downstream side of the heating heat exchanger and has a plurality of perforated holes through which the air passing the heating heat exchanger passes, and a partition wall is disposed between the heating heat exchanger and the perforated member to divide the air passageway of the air-conditioning case into a plurality of air passageways, wherein the partition wall is formed integrally with the perforated member.Type: GrantFiled: October 8, 2019Date of Patent: February 27, 2024Assignee: HANON SYSTEMSInventors: Dong Won Lee, Jong Su Kim, Jae Woo Ko, Young Keun Kim, Chang Soo Bae, Jong Min Lee, Gyu Ik Han
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Patent number: 11908779Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: April 19, 2021Date of Patent: February 20, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Patent number: 11887916Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: GrantFiled: September 9, 2020Date of Patent: January 30, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee
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Publication number: 20230352374Abstract: In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 3, 2023Publication date: November 2, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Min BAE, Hyung Jun CHO, Seung Woo LEE
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Publication number: 20230335883Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.Type: ApplicationFiled: April 28, 2023Publication date: October 19, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan MANGRUM, Hyung Jun CHO, Byong Jin KIM, Gi Jeong KIM, Jae Min BAE, Seung Mo KIM, Young Ju LEE
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Patent number: 11694946Abstract: In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.Type: GrantFiled: May 24, 2021Date of Patent: July 4, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Min Bae, Hyung Jun Cho, Seung Woo Lee
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Patent number: 11677135Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad.Type: GrantFiled: January 27, 2021Date of Patent: June 13, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
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Publication number: 20230031119Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: ApplicationFiled: August 12, 2022Publication date: February 2, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Patent number: 11521918Abstract: In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.Type: GrantFiled: July 8, 2019Date of Patent: December 6, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20220375834Abstract: In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: May 24, 2021Publication date: November 24, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jae Min BAE, Hyung Jun CHO, Seung Woo LEE
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Publication number: 20220293482Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: ApplicationFiled: December 20, 2021Publication date: September 15, 2022Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Patent number: 11417589Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: November 17, 2020Date of Patent: August 16, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20220115301Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 10, 2021Publication date: April 14, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son, Miki Nakashima, Kazuaki Nagasawa, Shingo Nakamura, Sophie Olson, Jin Young Khim
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Publication number: 20220115304Abstract: In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 13, 2020Publication date: April 14, 2022Inventors: Shaun Bowers, Yoshio Matsuda, Hyung II Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son
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Publication number: 20220077031Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: ApplicationFiled: September 9, 2020Publication date: March 10, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Patent number: 11205602Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: GrantFiled: August 28, 2018Date of Patent: December 21, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Publication number: 20210242113Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: ApplicationFiled: April 19, 2021Publication date: August 5, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon LEE, Byong Jin KIM, Jae Min BAE, Hyung Il JEON, Gi Jeong KIM, Ji Young CHUNG
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Patent number: 11018079Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: November 28, 2017Date of Patent: May 25, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung