Patents by Inventor Jae Min Bae
Jae Min Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220293482Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: ApplicationFiled: December 20, 2021Publication date: September 15, 2022Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Patent number: 11417589Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: November 17, 2020Date of Patent: August 16, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20220115301Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 10, 2021Publication date: April 14, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son, Miki Nakashima, Kazuaki Nagasawa, Shingo Nakamura, Sophie Olson, Jin Young Khim
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Publication number: 20220115304Abstract: In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 13, 2020Publication date: April 14, 2022Inventors: Shaun Bowers, Yoshio Matsuda, Hyung II Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son
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Publication number: 20220077031Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: ApplicationFiled: September 9, 2020Publication date: March 10, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Patent number: 11205602Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: GrantFiled: August 28, 2018Date of Patent: December 21, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Publication number: 20210242113Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: ApplicationFiled: April 19, 2021Publication date: August 5, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon LEE, Byong Jin KIM, Jae Min BAE, Hyung Il JEON, Gi Jeong KIM, Ji Young CHUNG
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Patent number: 11018079Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: November 28, 2017Date of Patent: May 25, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Publication number: 20210151854Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad.Type: ApplicationFiled: January 27, 2021Publication date: May 20, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan MANGRUM, Hyung Jun CHO, Byong Jin KIM, Gi Jeong KIM, Jae Min BAE, Seung Mo KIM, Young Ju LEE
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Publication number: 20210090977Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: ApplicationFiled: November 17, 2020Publication date: March 25, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20210013136Abstract: In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 8, 2019Publication date: January 14, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Patent number: 10840169Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: February 14, 2019Date of Patent: November 17, 2020Assignee: Amkor Technology Singapore Holding PTE. LTD.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20200266132Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: ApplicationFiled: February 14, 2019Publication date: August 20, 2020Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Publication number: 20190057919Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: ApplicationFiled: August 28, 2018Publication date: February 21, 2019Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Patent number: 10062626Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: GrantFiled: July 26, 2016Date of Patent: August 28, 2018Assignee: Amkor Technology, Inc.Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
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Patent number: 9978695Abstract: A semiconductor device includes a die pad, a plurality of first lands each having a first land first top recessed portion disposed on a first land first end distal to the die pad, and a plurality of second lands each having a second land first bottom recessed portion disposed on a second land first end distal to the die pad. A semiconductor die is electrically connected to the first and second lands. A package body, which defines a bottom surface and a side surface, at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body.Type: GrantFiled: March 13, 2017Date of Patent: May 22, 2018Assignee: Amkor Technology, Inc.Inventors: Jae Min Bae, Byong Jin Kim, Won Bae Bang
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Patent number: 9966652Abstract: A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.Type: GrantFiled: November 3, 2015Date of Patent: May 8, 2018Assignee: Amkor Technology, Inc.Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
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Publication number: 20180082932Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: ApplicationFiled: November 28, 2017Publication date: March 22, 2018Applicant: Amkor Technology, Inc.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Patent number: 9911685Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.Type: GrantFiled: February 14, 2016Date of Patent: March 6, 2018Assignee: Amkor Technology, Inc.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Publication number: 20180033708Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.Type: ApplicationFiled: July 26, 2016Publication date: February 1, 2018Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae