Patents by Inventor Jae Min Bae

Jae Min Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220293482
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: December 20, 2021
    Publication date: September 15, 2022
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Patent number: 11417589
    Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: August 16, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
  • Publication number: 20220115301
    Abstract: In one example, an electronic device comprises a first substrate comprising a base, an electronic component over the first substrate and comprising a top side and a bottom side, a first terminal and a second terminal on the top side, and a third terminal on the bottom side, wherein the third terminal is coupled with the first substrate. The electronic device further comprises a second substrate over the electronic component, and an encapsulant over the first substrate, contacting a lateral side of the electronic component and contacting the second substrate. A first lead is coupled with and extends over the base of the first substrate, a second lead of the second substrate is coupled to the first terminal of the electronic component, and the first lead and the second lead are exposed from a top side of the encapsulant. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 10, 2021
    Publication date: April 14, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son, Miki Nakashima, Kazuaki Nagasawa, Shingo Nakamura, Sophie Olson, Jin Young Khim
  • Publication number: 20220115304
    Abstract: In one example, an electronic device comprises a substrate comprising a first side and a second side, a first a lead on the second side, and a cavity in the second side adjacent to the first lead, an electronic component in the cavity and comprising a first terminal, a second terminal, and a third terminal, and a device encapsulant in the cavity and contacting a lateral side of the electronic component, and contacting a lateral side of the first lead opposite to the cavity. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 14, 2022
    Inventors: Shaun Bowers, Yoshio Matsuda, Hyung II Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Woo Lee, Yong Ho Son
  • Publication number: 20220077031
    Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.
    Type: Application
    Filed: September 9, 2020
    Publication date: March 10, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
  • Patent number: 11205602
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 21, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Publication number: 20210242113
    Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 5, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Kyoung Yeon LEE, Byong Jin KIM, Jae Min BAE, Hyung Il JEON, Gi Jeong KIM, Ji Young CHUNG
  • Patent number: 11018079
    Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 25, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
  • Publication number: 20210151854
    Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Marc Alan MANGRUM, Hyung Jun CHO, Byong Jin KIM, Gi Jeong KIM, Jae Min BAE, Seung Mo KIM, Young Ju LEE
  • Publication number: 20210090977
    Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.
    Type: Application
    Filed: November 17, 2020
    Publication date: March 25, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
  • Publication number: 20210013136
    Abstract: In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 14, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
  • Patent number: 10840169
    Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: November 17, 2020
    Assignee: Amkor Technology Singapore Holding PTE. LTD.
    Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
  • Publication number: 20200266132
    Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.
    Type: Application
    Filed: February 14, 2019
    Publication date: August 20, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
  • Publication number: 20190057919
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 21, 2019
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Patent number: 10062626
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: August 28, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae
  • Patent number: 9978695
    Abstract: A semiconductor device includes a die pad, a plurality of first lands each having a first land first top recessed portion disposed on a first land first end distal to the die pad, and a plurality of second lands each having a second land first bottom recessed portion disposed on a second land first end distal to the die pad. A semiconductor die is electrically connected to the first and second lands. A package body, which defines a bottom surface and a side surface, at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: May 22, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Min Bae, Byong Jin Kim, Won Bae Bang
  • Patent number: 9966652
    Abstract: A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: May 8, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
  • Publication number: 20180082932
    Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 22, 2018
    Applicant: Amkor Technology, Inc.
    Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
  • Patent number: 9911685
    Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.
    Type: Grant
    Filed: February 14, 2016
    Date of Patent: March 6, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
  • Publication number: 20180033708
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 1, 2018
    Inventors: Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee, Jae Min Bae