Patents by Inventor Jae Song

Jae Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210162649
    Abstract: The present invention provides a container forming apparatus, a container forming method, a container, and an instant food packaging method using the container. The container forming apparatus, which is a container forming apparatus for forming a container by thermoforming, comprises: a bottom forming part for forming the bottom portion of the container; a side forming part extending upwardly inclined from the bottom forming part and configured to form a part of the side portion of the container; a first form part configured to rise upward and pressurize the container to separate and take out the formed container; and a second form part disposed outside the first form part and configured to form the remaining parts of the container except the part of the side portion.
    Type: Application
    Filed: June 13, 2019
    Publication date: June 3, 2021
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Byung Kook LEE, Hui Jae SONG, Kyoung Sik CHO, Gyu Hwan CHA
  • Patent number: 10930427
    Abstract: A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: February 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Soo Yoon, Jae Woon Park, Seung Jae Song, Sang Jong Lee, Min Ki Jung, Seung Hee Hong, Su Bong Jang
  • Publication number: 20210039828
    Abstract: The present invention provides a packaging box and a product dispenser, the packaging box comprising a body having a receiving space in which a product is received. The packaging box comprises: a front part which is one of surfaces forming the body, is disposed at the front of the body, and has a front perforated line formed to provide a front opening for opening the receiving space; and a side part which is at least one of the surfaces forming the body, is arranged at a side of the body to be connected to the front part, and has a side perforated line extending from the front perforated line and formed to provide a side opening extending from the front opening toward the side of the body, wherein an opening for taking the product received in the receiving space is formed over both the front part and the side part by the front opening and the side opening.
    Type: Application
    Filed: March 29, 2019
    Publication date: February 11, 2021
    Inventors: Hui Jae SONG, Kwang Soo PARK, Gyu Hwan CHA, Min Seok CHOI
  • Patent number: 10854940
    Abstract: A window assembly includes a first radio frequency device disposed between a first window substrate and a second window substrate. An embedded coplanar waveguide is disposed between the first window substrate and the second window substrate, and is attached to the first radio frequency device. An exterior coplanar waveguide is disposed adjacent an exterior side surface of the first window substrate, and is disposed opposite the embedded coplanar waveguide for communicating electromagnetic waves therebetween. A printed circuit board is attached to and interconnects the exterior coplanar waveguide and a radio frequency cable connector. The radio frequency cable connector is configured for connection to a second radio frequency device. An adhesive layer bonds the printed circuit board to the exterior side surface of the first window substrate.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: December 1, 2020
    Assignee: GM Global Technology Operations LLC
    Inventors: Hyok Jae Song, Timothy J. Talty, James H. Schaffner, Duane S. Carper, Eray Yasan
  • Patent number: 10855185
    Abstract: A semiconductor circuit includes a reference voltage generating circuit which generates a first reference voltage; a voltage control circuit which receives the first reference voltage from the reference voltage generating circuit to output a second reference voltage; a DC-DC conversion circuit which executes DC-DC conversion on the basis of the second reference voltage which is output from the voltage control circuit, and provides an output thereof to a first node; and a voltage regulator which executes voltage regulating on the basis of the first reference voltage which is output from the reference voltage generating circuit, and a voltage of the first node, and provides an output thereof to a second node.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 1, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki Jae Song, Jong Woon Yoo
  • Publication number: 20200361687
    Abstract: One or more embodiments of the present disclosure relate to a pouch for packaging fermented foods, a method of packaging fermented foods using the same, and a pouch for packaging.
    Type: Application
    Filed: December 17, 2018
    Publication date: November 19, 2020
    Inventors: Dong Rag SON, Kyoung Sik CHO, Yoon Seung NAM, Kwang Soo PARK, Hui Jae SONG, Gyu Hwan CHA
  • Patent number: 10842021
    Abstract: A printed circuit board includes a magnetic member including a magnetic layer, a first coil pattern disposed above the magnetic member, and having a planar spiral structure, and a second coil pattern disposed below the magnetic member, and having a planar spiral structure.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: November 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO. LTD.
    Inventors: Seung Jae Song, Seong Hee Choi, Sang Jong Lee, Mi Ja Han
  • Patent number: 10816594
    Abstract: An apparatus for testing a signal speed of a semiconductor package may include a plurality of sockets, one or more test boards including at least a first test board, an extension board and a test head. Each of the sockets may be configured to receive the semiconductor package. The first test board may include a plurality of mount regions on which the sockets may be mounted, and test lines extended from the mount regions toward at least one side surface of the first test board. The extension board may be vertically arranged at the side surface of the first test board. The extension board may be electrically connected to the test lines. The test head may be electrically connected to the extension board to provide the mount regions with a test signal for testing the signal speed of the semiconductor package through the extension board. Thus, it may not be required to change a structure of the socket in accordance with types of the semiconductor packages.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Ki-Jae Song
  • Patent number: 10796836
    Abstract: An inductor includes a body including insulating layers stacked therein, in which coil patterns are respectively disposed on the insulating layers, and first and second external electrodes disposed on an external surface of the body, wherein the coil patterns are connected to each other by a plurality of coil connecting portions, and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil, the coil patterns include outer coil patterns disposed in an outer portion of the body and inner coil patterns disposed in an inner portion, a first coil connecting portion connects the outer coil patterns and a second coil connecting portion connects one coil pattern of the outer coil patterns and another coil pattern of the inner coil patterns, and the first and second coil connecting portions are disposed in a staggered manner.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Jae Song, Min Ki Jung, Han Kim, Seung Hee Hong
  • Publication number: 20200300535
    Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Jun YOON, Young Jae SONG, Seung Yong YANG, Sung Sik MOON, Ho June JEON, Kyung Han JEONG
  • Patent number: 10764993
    Abstract: The present application electromagnetic signal filtering. More specifically, the application teaches a system and method for affixing a frequency selective surface to an existing antenna radome, such that unwanted signals are attenuated before reaching an antenna structure within the antenna radome.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: September 1, 2020
    Inventors: Walter S. Wall, James H. Schaffner, Hyok Jae Song, David S. Hammon, Timothy J. Talty, Duane S. Carper, Eray Yasan
  • Patent number: 10732219
    Abstract: An apparatus for testing semiconductor devices and a system including the same includes a socket unit having a plurality of sockets into which a plurality of semiconductor devices are inserted, respectively. Also included is a module unit including a first sub-module for receiving a test signal from a host and providing the same test signal to each of the plurality of sockets, and a second sub-module including the same structure as the first sub-module. The first sub-module includes a first buffer unit including an amplifier having an input terminal to which an input signal is inputted and an output terminal to amplify and output the input signal inputted based on a reference voltage (VT), and a reference resistor having one end connected to the input terminal of the amplifier and the other end to which the reference voltage is applied, and a second buffer unit including the same structure as the first buffer unit.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Ki Jae Song
  • Publication number: 20200240761
    Abstract: An arrow shaft test apparatus, includes: a measuring machine body disposed lengthily in the left and right directions; a pair of arrow seating parts provided on the upper end of the measuring machine body, and disposed to be spaced at a predetermined distance apart from each other in the left and right directions; and a measuring sensor unit fixed to the measuring machine body, and for measuring the spacing distance forming with any outer circumferential surface of a shaft seated in the pair of arrow seating parts.
    Type: Application
    Filed: February 4, 2019
    Publication date: July 30, 2020
    Inventors: Yun Il SONG, Yun Sub SONG, Yoon Jae SONG
  • Patent number: 10727200
    Abstract: A memory device includes a buffer die including a first bump array and a second bump array spaced apart from each other in a first direction parallel to a lower surface of the buffer die; a first memory die stacked on the buffer die through a plurality of first through silicon vias and including banks; and a second memory die stacked on the first memory die by a plurality of second through silicon vias and including banks, wherein the first bump array is provided for a first channel to communicate between the first and second memory dies and a first processor, wherein the second bump array is provided for a second channel to communicate between the first and second memory dies and a second processor, and wherein the first channel and the second channel are independent of each other such that banks allocated to the first channel are accessed only by the first processor not the second processor through the first channel and banks allocated to the second channel are accessed only by the second processor not the
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul-Hwan Choo, Woong-Jae Song
  • Patent number: 10711321
    Abstract: The present invention relates to a non-oriented electrical steel sheet adhesive coating composition including the constituent elements below, a non-oriented electrical steel sheet product, and a manufacturing method thereof. The non-oriented electrical steel sheet adhesive coating composition includes: a first component including an organic/inorganic composite; and a second component including a composite metal phosphate, wherein the organic/inorganic composite is formed by having inorganic nanoparticles chemically substituted with some functional groups in an organic resin, the organic resin is one, or two or more, selected from an epoxy-based resin, an ester-based resin, an acrylic resin, a styrene-based resin, a urethane-based resin, and an ethylene-based resin, and the inorganic nanoparticles are one, or two or more, selected from SiO2, Al2O3, TiO2, MgO, ZnO, and ZrO2.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 14, 2020
    Assignee: POSCO
    Inventors: Jung Woo Kim, Ji Hyun Kim, Jae Song Kim, Jae Hoon Kim
  • Patent number: 10707553
    Abstract: A thin film, flexible antenna that has particular application to be adhered to vehicle glass, where the antenna has a wideband antenna geometry and is operable to receive right-hand or left-hand circularly polarized signals from, for example, GPS and SDARS satellites. The antenna is a printed planar antenna formed to the substrate and includes a ground plane having a slot formed therein and a tuning sleeve having a vertical portion and a horizontal portion. The planar antenna further includes a radiating element positioned adjacent to the tuning sleeve and including a feed portion positioned within the slot, where the radiating element includes a first horizontal portion and a second horizontal portion extending from a vertical portion towards the vertical portion of the sleeve. The ground plane is operable to generate circularly polarized signals to be received by the radiating element where the sleeve provides phase tuning of the signals.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: July 7, 2020
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Timothy J. Talty, Amit M. Patel, Keerti S. Kona, Hyok Jae Song, James H. Schaffner, Duane S. Carper, Eray Yasan
  • Patent number: 10707554
    Abstract: A thin film, flexible, co-planar waveguide (CPW), antenna structure suitable to be mounted on vehicle glass and that has particular application for MIMO LTE applications in, for example, the 0.46-3.8 GHz frequency band. The antenna structure includes a planar antenna formed on a substrate that includes a ground plane having an elliptical cut-out slot section defined within an outer perimeter portion of the ground plane and an antenna radiating element extending into the slot from the perimeter portion.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: July 7, 2020
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Timothy J. Talty, Amit M. Patel, Keerti S. Kona, James H. Schaffner, Hyok Jae Song, Duane S. Carper, Eray Yasan
  • Patent number: 10690394
    Abstract: Provided is a refrigerator which allows a pivoting bar to pivot to seal a gap between a pair of doors regardless of whether the door at which the pivoting bar is not installed between the pair of doors is open or closed. The refrigerator includes a guide device which induces the pivoting bar to pivot. Here, the guide device includes a rack that is moved forward and backward linearly depending on opening and closing of the second door and includes a second magnet built therein, a pinion gear engaged with the rack and pivoting when the rack is moved linearly, and a guide unit which includes a guide groove guiding a guide protrusion and is engaged with the pinion gear to move linearly in a direction opposite to that of the rack to allow the pivoting bar to pivot when the pinion gear pivots.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Jun Yoon, Young Jae Song, Seung Yong Yang, Sung Sik Moon, Ho June Jeon, Kyung Han Jeong
  • Patent number: 10690998
    Abstract: A camera module includes a housing including a lens module; a diaphragm module to form N apertures of different sizes, where N is a natural number, with blades disposed on an object side of the lens module; and a diaphragm driving unit disposed with the diaphragm module, and including a driving coil and a magnetic member disposed opposite to the driving coil, the magnetic member being movable in a direction perpendicular to an optical axis to be fixed in N positions along a movement path.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: June 23, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hee Hong, Sang Jong Lee, Min Ki Jung, Hee Soo Yoon, Su Bong Jang, Seung Jae Song
  • Patent number: 10685775
    Abstract: A coil component includes a body part including an internal coil including one end and another end; a first external electrode connected to the one end of the internal coil; a second external electrode connected to the another end of the internal coil; and a third external electrode connected to a first point between the one end of the internal coil and the another end of the internal coil.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Ki Jung, Su Bong Jang, Jae Woon Park, Seung Jae Song