Patents by Inventor Jae Ung LEE

Jae Ung LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210047172
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Patent number: 10872879
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 22, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20200353534
    Abstract: A method of casting a casting product having tubular flow passages includes: attaching a cast-in pipe insert, having outer and inner fixing members to which both ends of pipes are coupled, respectively, to a fixed mold; assembling a movable mold with the fixed mold; injecting a molten metal into a cavity defined inside the fixed and movable molds; ejecting a casting product from the assembled molds after injecting the molten metal; and removing the outer and inner fixing members from the casting product.
    Type: Application
    Filed: November 26, 2019
    Publication date: November 12, 2020
    Inventors: Yoon-Ki LEE, Hyung-Sop YOON, Cheol-Ung LEE, Jae-Gi SIM, Jun BAK, Sang-Muk PARK, Sung-Chun JANG, Jin-Hee LEE, Young-Han NO, Young-Jae DO
  • Patent number: 10822226
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 3, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Publication number: 20200251422
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.
    Type: Application
    Filed: April 24, 2020
    Publication date: August 6, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 10682690
    Abstract: A centrifugal casting apparatus for different materials may include a mold having a shape corresponding to a shape of an outer surface of a casting to be produced, and having a cavity receiving molten metals therein, a molten metal guide inserted into the mold and configured to guide the molten metals so that the molten metals are separately injected into the mold, a guide fixing support fixing the molten metal guide to a predetermined position, and a motor configured to rotate the mold around a rotation axis.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 16, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hyo-Moon Joo, Ji-Yong Lee, Yoon-Ki Lee, Young-Chan Kim, Cheol-Ung Lee, Jun-Min Lee, Mun-Gu Kang, Young-Rae Cho, Min-Soo Kim, Jae-Gi Sim
  • Patent number: 10673131
    Abstract: A coil assembly includes: a substrate; and a coil wiring coupled to the substrate and including a spiral wiring and a lead wiring, wherein the spiral wiring includes a first section forming an outer portion of the spiral wiring and a second section, disposed inside the first section, and having a line width narrower than a line width of the first section.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: June 2, 2020
    Assignee: WITS Co., Ltd.
    Inventors: Dae Ung Ahn, Jae Hyoung Cho, Dae Seong Jeon, Sung Uk Lee, Ki Won Chang
  • Patent number: 10469133
    Abstract: An antenna device includes a first wiring may include a spiral shape forming an empty region therein, and a second wiring disposed inside or outside of the first wiring. The second wiring is disposed to be spaced apart from the first wiring, and includes a first ring-shaped wiring and a second ring-shaped wiring, which are concentric to each other.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: November 5, 2019
    Assignee: WITS Co., Ltd.
    Inventors: Dae Ung Ahn, Hyung Wook Cho, Jun Seung Yi, Yu Jin Lee, Seung Hun Ryu, Sang Beom Lee, Dae Ki Lim, Jae Hyoung Cho, Si Hyung Kim
  • Patent number: 10418580
    Abstract: An organic electroluminescent device and organic electroluminescent display device having enhanced efficiency are disclosed. The organic electroluminescent device includes first and second electrodes facing each other on a substrate, first and second emission layers formed between the first and second electrodes, a hole transport layer formed between the first electrode and the first emission layer, an electron transport layer formed between the second electrode and the second emission layer, and at least one emission control layer formed between the first and second emission layers and having the same properties as those of at least any one of the hole transport layer and the electron transport layer.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 17, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: Jeong-Haeng Heo, Jae-Man Lee, Jeong-Dae Seo, Se-Ung Kim
  • Publication number: 20190168294
    Abstract: A centrifugal casting apparatus for different materials may include a mold having a shape corresponding to a shape of an outer surface of a casting to be produced, and having a cavity receiving molten metals therein, a molten metal guide inserted into the mold and configured to guide the molten metals so that the molten metals are separately injected into the mold, a guide fixing support fixing the molten metal guide to a predetermined position, and a motor configured to rotate the mold around a rotation axis.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 6, 2019
    Inventors: Hyo-Moon JOO, Ji-Yong LEE, Yoon-Ki LEE, Young-Chan KIM, Cheol-Ung LEE, Jun-Min LEE, Mun-Gu KANG, Young-Rae CHO, Min-Soo KIM, Jae-Gi SIM
  • Publication number: 20180374798
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.
    Type: Application
    Filed: June 24, 2017
    Publication date: December 27, 2018
    Applicant: Amkor Technology, Inc.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 10163867
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 25, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20180350734
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: July 23, 2018
    Publication date: December 6, 2018
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 10144634
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: December 4, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Publication number: 20180323170
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Application
    Filed: July 17, 2018
    Publication date: November 8, 2018
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 10032705
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: July 24, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20180138155
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 9935083
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: April 3, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi, Jin Seong Kim
  • Publication number: 20180057353
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Patent number: PP31289
    Abstract: A new and distinct Citrus reticulate Blanco plant named Tamnaneunbong, characterized by its upright plant type and strong vigor, short oval ovary shape, germination state in middle of April, blooming state in late May, fruits start coloring in late October, mature state in late March, acidity of the fruit juice at about 1.51%, leaf length at about 10.1 cm and leaf width at about 4.3 cm, and length of leaf petiole at about 3.6 cm.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 31, 2019
    Inventors: Jae-Ho Park, Su-Hyun Yun, Dong-Hoon Lee, Sang-Woog Koh, Hyun-Joo An, I-Ung Yang