Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A method of casting a casting product having tubular flow passages includes: attaching a cast-in pipe insert, having outer and inner fixing members to which both ends of pipes are coupled, respectively, to a fixed mold; assembling a movable mold with the fixed mold; injecting a molten metal into a cavity defined inside the fixed and movable molds; ejecting a casting product from the assembled molds after injecting the molten metal; and removing the outer and inner fixing members from the casting product.

Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: A centrifugal casting apparatus for different materials may include a mold having a shape corresponding to a shape of an outer surface of a casting to be produced, and having a cavity receiving molten metals therein, a molten metal guide inserted into the mold and configured to guide the molten metals so that the molten metals are separately injected into the mold, a guide fixing support fixing the molten metal guide to a predetermined position, and a motor configured to rotate the mold around a rotation axis.

Abstract: A coil assembly includes: a substrate; and a coil wiring coupled to the substrate and including a spiral wiring and a lead wiring, wherein the spiral wiring includes a first section forming an outer portion of the spiral wiring and a second section, disposed inside the first section, and having a line width narrower than a line width of the first section.

Abstract: An antenna device includes a first wiring may include a spiral shape forming an empty region therein, and a second wiring disposed inside or outside of the first wiring. The second wiring is disposed to be spaced apart from the first wiring, and includes a first ring-shaped wiring and a second ring-shaped wiring, which are concentric to each other.

Abstract: An organic electroluminescent device and organic electroluminescent display device having enhanced efficiency are disclosed. The organic electroluminescent device includes first and second electrodes facing each other on a substrate, first and second emission layers formed between the first and second electrodes, a hole transport layer formed between the first electrode and the first emission layer, an electron transport layer formed between the second electrode and the second emission layer, and at least one emission control layer formed between the first and second emission layers and having the same properties as those of at least any one of the hole transport layer and the electron transport layer.

Abstract: A centrifugal casting apparatus for different materials may include a mold having a shape corresponding to a shape of an outer surface of a casting to be produced, and having a cavity receiving molten metals therein, a molten metal guide inserted into the mold and configured to guide the molten metals so that the molten metals are separately injected into the mold, a guide fixing support fixing the molten metal guide to a predetermined position, and a motor configured to rotate the mold around a rotation axis.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: A new and distinct Citrus reticulate Blanco plant named Tamnaneunbong, characterized by its upright plant type and strong vigor, short oval ovary shape, germination state in middle of April, blooming state in late May, fruits start coloring in late October, mature state in late March, acidity of the fruit juice at about 1.51%, leaf length at about 10.1 cm and leaf width at about 4.3 cm, and length of leaf petiole at about 3.6 cm.