Abstract: An ultrasonic probe for acquiring an ultrasonic image is provided. The ultrasonic probe includes a transducer generating an ultrasonic signal and including a lens provided to transmit the ultrasonic signal to the outside, a case accommodating the transducer and having an opening at one side so that the lens is brought into contact with an external target object, and a buffer member provided along a circumference of the transducer to protect the transducer from external impact and disposed between the case and the transducer.

Abstract: Disclosed herein is an ultrasonic probe including a piezoelectric layer, a matching layer disposed at an upper portion of the piezoelectric layer, a conductive member disposed at a lower portion of the piezoelectric layer, a second connector coupled to at least one side of the conductive member, and a printed circuit board coupled to a side of the second connector and electrically coupled to the second connector. A printed circuit board is disposed outside a laminated structure of the acoustic element so that the printed circuit board can be prevented from affecting acoustic characteristics of the ultrasonic probe, a failure in a process of manufacturing the ultrasonic probe that occurs due to a change in temperature or humidity can be prevented, and the manufacturing process can be relatively simplified.

Abstract: Disclosed herein is an ultrasonic probe for acquiring an ultrasound image. The ultrasound probe includes a transducer configured to be movable, a cap configured to transmit an ultrasound signal generated by the transducer to outside, and an impact mitigating member disposed along a circumference of the cap to protect the cap from an external impact.

Abstract: Disclosed herein is an ultrasonic probe including a piezoelectric layer, a matching layer disposed at an upper portion of the piezoelectric layer, a conductive member disposed at a lower portion of the piezoelectric layer, a second connector coupled to at least one side of the conductive member, and a printed circuit board coupled to a side of the second connector and electrically coupled to the second connector. A printed circuit board is disposed outside a laminated structure of the acoustic element so that the printed circuit board can be prevented from affecting acoustic characteristics of the ultrasonic probe, a failure in a process of manufacturing the ultrasonic probe that occurs due to a change in temperature or humidity can be prevented, and the manufacturing process can be relatively simplified.

Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.

Abstract: An ultrasonic probe for acquiring an ultrasonic image is provided. The ultrasonic probe includes a transducer generating an ultrasonic signal and including a lens provided to transmit the ultrasonic signal to the outside, a case accommodating the transducer and having an opening at one side so that the lens is brought into contact with an external target object, and a buffer member provided along a circumference of the transducer to protect the transducer from external impact and disposed between the case and the transducer.

Abstract: Disclosed herein is an ultrasonic probe for acquiring an ultrasound image. The ultrasound probe includes a transducer configured to be movable, a cap configured to transmit an ultrasound signal generated by the transducer to outside, and an impact mitigating member disposed along a circumference of the cap to protect the cap from an external impact.

Abstract: Provided is a method of manufacturing an ultrasonic probe. The method includes forming a sacrificial layer on a substrate; forming a plurality of openings in the sacrificial layer that are separated from one another; forming piezoelectric units by growing a piezoelectric element in each of the plurality of openings; and removing the sacrificial layer.

Abstract: An ultrasonic probe and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe includes a vibration generator for transferring sound beneficial to a fetus so as to transmit the sound signal to the fetus more efficiently than a conventional ultrasonic probe. An ultrasonic probe includes a transducer configured to transmit an ultrasonic signal to an object or receive an ultrasonic signal reflected from the object. The ultrasonic probe includes a frame and a vibration generator. The vibration generator is located in the frame, and generates vibration when the ultrasonic probe contacts the object in such a manner that the generated vibration is transferred to a fetus of the object.

Abstract: Provided are an acoustic probe and a method of manufacturing the acoustic probe including a chip module substrate, a piezoelectric unit for cross-converting ultrasound and an electric signal while the piezoelectric unit is vibrating, and a connection unit for supporting the piezoelectric unit and electrically connecting the piezoelectric unit and the chip module substrate.

Abstract: Disclosed are an ultrasonic diagnostic instrument and a manufacturing method thereof. The ultrasonic diagnostic instrument includes a matching layer, at least one transducer provided at a lower surface of the matching layer to generate ultrasonic waves, a first acoustic absorption layer provided at a lower surface of the transducer to transmit an ultrasonic wave generation signal to the transducer, a controller provided at a lower surface of the first acoustic absorption layer to control operation of the transducer, the controller having a recess formed in a lower surface thereof, and a second acoustic absorption layer provided at a lower surface of the controller and having an insert formed at an upper surface thereof, the insert corresponding to the recess of the controller.

Abstract: A probe for an ultrasound system, and a method of manufacturing the same are disclosed. The probe includes a backing layer, an electrode part formed on the backing layer, and a piezoelectric member installed to the electrode part. The probe is manufactured by connecting the piezoelectric member to the PCB via a unidirectional conduction part, instead of soldering which requires difficult and laborious operations, thereby allowing easy connection therebetween while reducing an operation time for connection.

Abstract: A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.

Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract: The present application relates to an ultrasonic probe including a connector capable of applying an electrical signal to a piezoelectric material and disposed at the outside of a backing layer, and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric material, a backing layer installed on the rear surface of the piezoelectric material, and a first connector installed on at least one side surface of the backing layer and electrically connected to the piezoelectric material.

Abstract: A probe for an ultrasonic diagnostic apparatus and a method of manufacturing the same are disclosed. The probe includes a sound matching layer having a mounting groove, a piezoelectric member mounted on the mounting groove, a first connector interconnected to the sound matching layer, and a second connector interconnected to the piezoelectric member. The probe permits interconnection of the piezoelectric member to the first and second connectors to be performed rapidly and easily through a single bonding operation, thereby reducing manufacturing time while facilitating the manufacture of the probe.

Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.

Abstract: A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.

Abstract: The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.

Abstract: The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.