Abstract: A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.

Abstract: Provided are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes a body in which grooves are formed, and ultrasonic transducers disposed respectively in the grooves to perform transduction between an ultrasonic signal and an electrical signal.

Abstract: A probe for an ultrasonic diagnostic apparatus includes a backing layer including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, and a piezoelectric member electrically connected to the electrodes. A method of manufacturing the same is also disclosed. The piezoelectric member is connected to the first connector or to first and second connectors via an electrode layer instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connector while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacturing operation.

Abstract: Disclosed are an ultrasonic diagnostic instrument and a manufacturing method thereof. The ultrasonic diagnostic instrument includes a matching layer, at least one transducer provided at a lower surface of the matching layer to generate ultrasonic waves, a first acoustic absorption layer provided at a lower surface of the transducer to transmit an ultrasonic wave generation signal to the transducer, a controller provided at a lower surface of the first acoustic absorption layer to control operation of the transducer, the controller having a recess formed in a lower surface thereof, and a second acoustic absorption layer provided at a lower surface of the controller and having an insert formed at an upper surface thereof, the insert corresponding to the recess of the controller.

Abstract: Provided is a method of manufacturing an ultrasonic probe. The method includes forming a sacrificial layer on a substrate; forming a plurality of openings in the sacrificial layer that are separated from one another; forming piezoelectric units by growing a piezoelectric element in each of the plurality of openings; and removing the sacrificial layer.

Abstract: Probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract: Provided are an acoustic probe and a method of manufacturing the acoustic probe including a chip module substrate, a piezoelectric unit for cross-converting ultrasound and an electric signal while the piezoelectric unit is vibrating, and a connection unit for supporting the piezoelectric unit and electrically connecting the piezoelectric unit and the chip module substrate.

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract: The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.

Abstract: The present application relates to an ultrasonic probe including a connector capable of applying an electrical signal to a piezoelectric material and disposed at the outside of a backing layer, and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric material, a backing layer installed on the rear surface of the piezoelectric material, and a first connector installed on at least one side surface of the backing layer and electrically connected to the piezoelectric material.

Abstract: Disclosed herein arc a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.

Abstract: The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.

Abstract: An ultrasonic diagnostic probe and a method of manufacturing the same are disclosed. The probe includes a first piezoelectric member having a first thickness, and a second piezoelectric member having a second thickness and stacked on the first piezoelectric member. The method allows the production of several kinds of ultrasonic diagnostic probes, which generate ultrasound waves in different frequency bands, with a single kind of transducer module by changing connection between an external electrode and the electrodes of the probe.

Abstract: A probe for an ultrasonic diagnostic apparatus and a method of manufacturing the same are disclosed. The probe includes a sound matching layer having a mounting groove, a piezoelectric member mounted on the mounting groove, a first connector interconnected to the sound matching layer, and a second connector interconnected to the piezoelectric member. The probe permits interconnection of the piezoelectric member to the first and second connectors to be performed rapidly and easily through a single bonding operation, thereby reducing manufacturing time while facilitating the manufacture of the probe.

Abstract: A probe for an ultrasonic diagnostic apparatus includes a backing layer including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, and a piezoelectric member electrically connected to the electrodes. A method of manufacturing the same is also disclosed. The piezoelectric member is connected to the first connector or to first and second connectors via an electrode layer instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connector while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacturing operation.

Abstract: A probe for an ultrasonic diagnostic apparatus includes including backing members, a first connector bonded between the backing members and including electrodes spaced from each other in an arrangement direction, a ground connector bonded between the backing members to be spaced from the first connector, and a piezoelectric member electrically connected to the electrodes and the ground connector. A method of manufacturing the same is also disclosed. The piezoelectric member is joined to the first connector and the ground connector or to first and second connectors and the ground connector via first and second electrode layers instead of using a complicated and laborious soldering operation, thereby enabling easy connection between the piezoelectric member and the connectors while preventing deterioration in performance caused by defective connection therebetween and deterioration in performance of the piezoelectric member caused by heat during manufacture.

Abstract: A probe for an ultrasound system, and a method of manufacturing the same are disclosed. The probe includes a backing layer, an electrode part formed on the backing layer, and a piezoelectric member installed to the electrode part. The probe is manufactured by connecting the piezoelectric member to the PCB via a unidirectional conduction part, instead of soldering which requires difficult and laborious operations, thereby allowing easy connection therebetween while reducing an operation time for connection.

Abstract: A probe for an ultrasound system, and a method of manufacturing the same are disclosed. The probe includes a backing layer, a piezoelectric member installed to the backing layer, and a unidirectional conduction part installed to at least one of the backing layer and the piezoelectric member. The probe is manufactured by connecting the piezoelectric member to the PCB via a unidirectional conduction part, instead of soldering which requires difficult and laborious operations, thereby facilitating manufacture of the probe while reducing an operation time in manufacture of the probe.

Abstract: Disclosed herein are a printed circuit board (PCB) and a probe including the same. The probe includes a transducer, a PCB having a pattern part contacting the transducer via face-to-face contact, and a bonding member bonding the transducer to the pattern part of the PCB. The bonding part of the PCB is provided with the pattern part to increase a bonding area of the bonding part and to allow the bonding member to contact not only a metal layer of the bonding part but also an electrical insulation part thereof, thereby improving a bonding force between the transducer and the PCB. As a result, the transducer can be reliably bonded to the PCB, so that performance of the transducer can be prevented from being deteriorated due to defective connection between the PCB and the transducer.