Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: The present invention relates to a chemical cross-linking based porous material for tissue regeneration and hemostasis, including an extracellular matrix of decellularized kidney tissue, and a method for production thereof. The porous material including an extracellular matrix of decellularized kidney tissues according to the present invention forms a chemical cross-linking bond, while the final product does not contain any existing cross-linking agent component, whereby the porous material can be utilized in biocompatible substances. Further, the porous material of the present invention does not only have rapid hemostasis but also delays degradation in a long term to thus exhibit tissue regeneration effects, so that the porous material is expected to be usefully applicable for treatment of different diseases due to tissue damage in a variety of tissues, or for hemostasis and tissue regeneration at removal of tissues or incision operation.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: The present invention relates to a method for preparing directly reprogrammed natural killer (drNK) cells or CAR (chimeric antigen receptor) gene introduced CAR-drNK cells using substances and methods that inhibit BCL11B (B-cell leukemia 11B) gene expression and/or function. The present invention also relates to drNK cells or CAR-drNK cells prepared by a BCL11B gene-based cell reprogramming method, and a cell therapeutic and/or a composition for the prevention or treatment of cancer diseases and infectious diseases caused by viruses, bacteria, fungi, and the like, and/or inflammatory diseases, which contain the cells.

Abstract: A method for preparing a hydrogel includes forming a pre-gel comprising polymer and metal salt particles, unidirectionally-shrinking and dehydrating the pre-gel, and impregnating the unidirectionally shrunk and dehydrated pre-gel with an ion solution to crosslink and rehydrate the unidirectionally shrunk and dehydrated pre-gel to produce the hydrogel.

Abstract: The present disclosure relates to a scaffold with atelocollagen inserted into a porous hyaluronic acid polymer for treatment and recovery of tendon or ligament diseases. The scaffold enhances the efficacy of hyaluronic acid and atelocollagen through slow and prolonged secretion at the suture site, thereby creating a synergistic effect. Additionally, the porous scaffold with high mechanical properties binds the suture site of a ruptured tendon and provides a microenvironment for the regeneration process of surrounding cells, thereby making it useful for the treatment and recovery of tendon or ligament diseases.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, an electronic device comprises a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure, a first electronic component over the top side of the substrate and coupled with the conductive structure, an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate, a lid over the first electronic component and over the encapsulant, and a second electronic component over the top side of the substrate and coupled with the conductive structure, wherein the second electronic component is between the first electronic component and the lateral side of the substrate. Other examples and related methods are also disclosed herein.

Abstract: Provided is a rubber mixture, which includes a unit structure derived from a first conjugated diene-based monomer and is functionalized with at least one of the compounds represented by Formulas 1 to 6; and a second low molecular weight rubber polymer, which includes a unit structure derived from a second conjugated diene-based monomer and is functionalized with at least one of the compounds represented by Formulas 1 to 6.

Abstract: The present disclosure relates to a contact lens containing ceria particles. Further, the present disclosure relates to a method for manufacturing a contact lens containing ceria particles. The method includes preparing ceria particles; preparing poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) in a form of cross-linked hydrogel; mixing the ceria particles and the monomer mixture for poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) with each other to form a mixture; and injecting the mixture in a mold having a contact lens shape; and performing photo-curing polymerization of the mixture. The contact lens effectively eliminates the reactive oxygen species and harmful radicals that are identified as a cause of eye diseases.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: An air bubble removal device for removing air bubbles from a medium including a housing including an inner space for storing a predetermined amount of the medium, an introduction port through which the medium is introduced from the outside into the inner space, and a discharge port through which the medium in a state in which air bubbles have been removed is discharged from the inner space to the outside; and a support part coupled to the housing so as to maintain the housing in a state spaced a predetermined height from a bottom surface.

Abstract: The present invention relates to a dual-scale porous silica particle-based pharmaceutical composition for preventing or treating cancer, which includes porous silica nanoparticles and porous silica microparticles. The pharmaceutical composition of the present invention promotes the generation of a larger amount of antigen-specific, cytotoxic T cells against cancer than a mesoporous silica nanoparticle (MSN) vaccine, and exhibits increased anti-tumor efficacy compared with a mesoporous silica microrod (MSR) vaccine.

Abstract: Proposed is a rubber composition for a tire tread, which includes: a solution-polymerized elastomer having a conjugated diene-based monomer unit, a solution-polymerized elastomer having an aromatic vinyl monomer unit and a conjugated diene-based monomer unit, or a combination thereof, at 100 parts by weight; and a plasticizer containing an aromatic petroleum resin and an aliphatic olefin polymer, at 10 to 50 parts by weight. Further, a manufacturing method of the rubber composition for a tire tread is proposed.

Abstract: The present disclosure relates to a method for preparing a restructured hydrogel, including forming a hydrogel containing a first polymer, unidirectionally shrinking and dehydrating the hydrogel, and additionally cross-linking and rehydrating the dehydrated hydrogel.

Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

Abstract: The method for decellularization of kidney tissue according to the present invention, the decellularized material produced through the method, and a bioink comprising the decellularized material have the effect of maximizing the effect of kidney treatment by maximizing the content of components specialized for kidney treatment such as the collecting duct and renal tubule of the kidney.

Abstract: The present invention relates to a kidney organoid having a nephron-like structure and a production method therefor. A kidney organoid culture system using kidney dECM hydrogels according to the present invention induced the vascularization of the kidney organoid and the expression of podocytes, tubular transporters, and cilium genes, and has an effect of forming a more mature nephron-like structure. Therefore, the kidney organoid produced by the method of the present invention is an option for treating nephron loss through transplantation into humans, and is expected to be utilized as a kidney on a chip, which is an in vitro kidney model.