Abstract: An embodiment of the present specification provides a rubber composition for a tire tread, comprising: a rubber polymer; a petroleum resin; and a functionalized processing aid, wherein the functionalized processing aid is a bond of a silane-based compound and a cardanol-derived structure, represented by the following formula 1: (R1)3Si—R2—Z-(E)n??[Formula 1] wherein R1, R2, Z, E and n are as defined in the specification, and a method of manufacturing the same.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A method for preparing a hydrogel includes forming a pre-gel comprising polymer and metal salt particles, unidirectionally-shrinking and dehydrating the pre-gel, and impregnating the unidirectionally shrunk and dehydrated pre-gel with an ion solution to crosslink and rehydrate the unidirectionally shrunk and dehydrated pre-gel to produce the hydrogel.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A cell culture device is provided. A cell culture device according to an exemplary embodiment of the present invention comprises: a housing which has a plurality of through-holes formed through at least one surface thereof to allow carbon dioxide to be introduced thereinto from the outside and includes an inner space filled with a medium for culturing cells; a plurality of supporters which are arranged in the inner space in multiple steps while being spaced at an interval from each other so as to culture cells and are provided in a plate-shape having a predetermined area; and a porous member which is attached to one surface of the housing so as to cover the plurality of through-holes, prevents the medium filled in the inner space from leaking to the outside, and allows carbon dioxide to be introduced into the inner space from the outside.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor structure comprises a frontside substrate comprising a conductive structure, a backside substrate comprising a base substrate and a cavity substrate contacting the base substrate, wherein the backside substrate is over a top side of the frontside substrate and has a cavity and an internal interconnect contacting the frontside substrate, and a first electronic component over the top side of the frontside substrate and in the cavity. The first electronic component is coupled with the conductive structure, and an encapsulant is in the cavity and on the top side of the frontside substrate, contacting a lateral side of the first electronic component, a lateral side of the cavity, and a lateral side of the internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A flat-plate filter for water treatment and a flat-plate filter module comprising the same are provided. The flat-plate filter for water treatment according to an embodiment of the present invention comprises: a piece-shaped filtration member comprising a first support and a membrane formed on both sides of the first support; and a support frame fitted in and coupled to the edge of the filtration member so as to support the filtration member, and having a flow path through which filtered water introduced from at least one surface of the filtration member flows, wherein a part of the filtration member is disposed in the flow path or at the edge of the flow path such that the first support is exposed.

Abstract: A method of manufacturing a rubber composition is provided. The method includes: (a) allowing a mixture including a conjugated diene-based monomer to react in the presence of a first catalyst; (b) introducing a carboxylic acid-based compound into the product of the step (a) to deactivate the first catalyst; and (c) introducing a second catalyst and a conjugated diene-based monomer into the product of the step (b) and allowing the second catalyst and the conjugated diene-based monomer to react with the product of the step (b).

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: The present invention relates to a method for producing induced natural killer (iNK) cells, into which a chimeric antigen receptor (CAR) gene encoding a CAR is introduced, iNK cells produced by the method, and a cell therapy composition and a pharmaceutical composition for preventing or treating cancer, comprising the iNK cells. The method according to the present invention has the effects of producing the iNK cells, into which a CAR gene is introduced, with high efficiency through direct reprogramming from isolated cells without limiting an initial cell, and directly producing the same without a differentiation process, thereby simplifying the production process and reducing costs and time. The method according to the present invention has the effect of producing excellent NK cells having enhanced safety by directly producing NK cells from human somatic cells that are easy to obtain, without passing through induced pluripotent stem cells produced through conventional reprogramming technology.

Abstract: The present invention relates to: a method for producing immunocytes, specifically induced natural killer T (iNKT) cells that are induced by direct reprogramming of isolated somatic cells, and chimeric antigen receptor (CAR)-iNKT cells into which a CAR gene encoding a CAR is introduced; iNKT cells produced by the method; and a cell therapy composition and a pharmaceutical composition for preventing or treating cancer, comprising the iNKT cells. The method according to the present invention can produce, through direct reprogramming, iNKT cells or iNKT cells into which a CAR gene is introduced, from isolated cells so as to simplify the production process and shorten production time, thereby reducing costs, to have excellent NKT cell production efficiency, and to ensure safety according to the production without passing through induced pluripotent stem cells, thereby having an excellent NKT cell production effect distinguished from that of a conventional reprogramming technique.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: The present specification relates to a method for manufacturing a multilayered cell sheet, and a multilayered cell sheet manufactured using same, the method comprising the steps of: (a) forming a first cell layer on a first substrate, which has a melting point or is changed from being hydrophobic to being hydrophilic at any one temperature from 0° C. to 30° C.; (b) forming a second cell layer on a second substrate to be degraded by an enzyme; (c) making the first cell layer and the second cell layer come in contact with each other; (d) selectively removing the first substrate by providing a temperature lower than or equal to the melting point of the first substrate or a temperature at which the first substrate is changed to being hydrophilic; and (e) selectively removing the second substrate by making the second substrate come in contact with a solution containing the enzyme.

Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: The method for decellularization of kidney tissue according to the present invention, the decellularized material produced through the method, and a bioink comprising the decellularized material have the effect of maximizing the effect of kidney treatment by maximizing the content of components specialized for kidney treatment such as the collecting duct and renal tubule of the kidney.

Abstract: The present disclosure relates to a method for preparing a restructured hydrogel, including forming a hydrogel containing a first polymer, unidirectionally shrinking and dehydrating the hydrogel, and additionally cross-linking and rehydrating the dehydrated hydrogel.