Abstract: In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: According to an embodiment of the present invention, there is provided a method of preparing a rubber composition, which includes (a) synthesizing a living polymer by solution polymerization of a monomer mixture including a conjugated diene-based monomer in the presence of a first catalyst; (b) reacting some ends of the living polymer with a coupling agent; (c) reacting the remaining ends of the living polymer with an organotin halide compound to prepare an end-modified conjugated diene-based polymer solution; and (d) adding a second catalyst and a conjugated diene-based monomer to the end-modified conjugated diene-based polymer solution to induce solution polymerization.

Abstract: Provided is a method of preparing a rubber composition, which includes (a) reacting a conjugated diene-based monomer with one or more of compounds in the presence of a first catalyst; (b) adding a conjugated diene-based monomer to a product of the step (a) and inducing a reaction; and (c) adding a second catalyst and a conjugated diene-based monomer to a product of the step (b) and inducing a reaction.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: A method of manufacturing a rubber composition is provided. The method includes: (a) allowing a mixture including a conjugated diene-based monomer to react in the presence of a first catalyst; (b) introducing a carboxylic acid-based compound into the product of the step (a) to deactivate the first catalyst; and (c) introducing a second catalyst and a conjugated diene-based monomer into the product of the step (b) and allowing the second catalyst and the conjugated diene-based monomer to react with the product of the step (b).

Abstract: A flat-plate filter for water treatment and a flat-plate filter module comprising the same are provided. The flat-plate filter for water treatment according to an embodiment of the present invention comprises: a piece-shaped filtration member comprising a first support and a membrane formed on both sides of the first support; and a support frame fitted in and coupled to the edge of the filtration member so as to support the filtration member, and having a flow path through which filtered water introduced from at least one surface of the filtration member flows, wherein a part of the filtration member is disposed in the flow path or at the edge of the flow path such that the first support is exposed.

Abstract: Methods and apparatus for extracting sentences are provided, one of methods comprises, receiving a document summarization request, which does not comprise a keyword for extracting important sentences from a document, from a user terminal, selecting a keyword, which reflects the preference of a user of the user terminal, based on a profile of the user, extracting important sentences from the document based on the selected keyword; and generating a summary of the document based on the extracted important sentences.

Abstract: Methods and systems for extracting sentences are provided, one of methods comprises, receiving a keyword, parsing a document, and identifying each of a plurality of sentences included in the parsed document, configuring a graph having vertices and edges, wherein each vertex corresponds to each sentence, and each edge has a first weight corresponding to similarity between each pair of the sentences, calculating importance of each sentence by applying a modified PageRank algorithm to the graph, wherein the modified PageRank algorithm is designed to reflect a second weight corresponding to whether the keyword is included in a sentence of each vertex adjacent to a first vertex and extracting important sentences from the document based on the calculated importance.

Abstract: The present disclosure relates to a contact lens containing ceria particles. Further, the present disclosure relates to a method for manufacturing a contact lens containing ceria particles. The method includes preparing ceria particles; preparing poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) in a form of cross-linked hydrogel; mixing the ceria particles and the monomer mixture for poly-2-hydroxyethyl methacrylate (PHEMA or poly-HEMA) with each other to form a mixture; and injecting the mixture in a mold having a contact lens shape; and performing photo-curing polymerization of the mixture. The contact lens effectively eliminates the reactive oxygen species and harmful radicals that are identified as a cause of eye diseases.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: Provided is a method of preparing a rubber composition, which includes (a) reacting a conjugated diene-based monomer with one or more of compounds in the presence of a first catalyst; (b) adding a conjugated diene-based monomer to a product of the step (a) and inducing a reaction; and (c) adding a second catalyst and a conjugated diene-based monomer to a product of the step (b) and inducing a reaction.

Abstract: According to an embodiment of the present invention, there is provided a method of preparing a rubber composition, which includes (a) synthesizing a living polymer by solution polymerization of a monomer mixture including a conjugated diene-based monomer in the presence of a first catalyst; (b) reacting some ends of the living polymer with a coupling agent; (c) reacting the remaining ends of the living polymer with an organotin halide compound to prepare an end-modified conjugated diene-based polymer solution; and (d) adding a second catalyst and a conjugated diene-based monomer to the end-modified conjugated diene-based polymer solution to induce solution polymerization.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: A semiconductor package, and a method of manufacturing thereof, comprising a contact in a plated sidewall encapsulant opening, substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

Abstract: One aspect of the present invention provides an additive composition for polymer-modified asphalt including a block copolymer having a radial structure and a copolymer of an aromatic vinyl compound of which two ends have different molecular weights and a conjugated diene compound, and a method of preparing the same. When asphalt is prepared using the additive composition for polymer-modified asphalt, properties of the existing polymer-modified asphalt may be maintained while content of sulfur may be reduced, viscosity may decrease, and thereby processability and pavement performance may be improved.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.