Patents by Inventor Jae-Hun Kim

Jae-Hun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147642
    Abstract: In a display device including unfoldable areas and a foldable area between the unfoldable areas, the display device includes: a window; a display panel under the window; a fingerprint detection sensor configured to generate signals for fingerprint recognition in a direction toward the display panel in any one of the unfoldable areas; a first support member supporting the display panel under the display panel and between the display panel and the fingerprint detection sensor; a second support member supporting the display panel under the first support member and having an opening overlapping the fingerprint detection sensor; and a reinforcing member overlapping the opening of the second support member and between the first support member and the fingerprint detection sensor, wherein the reinforcing member includes glass.
    Type: Application
    Filed: August 10, 2023
    Publication date: May 2, 2024
    Inventors: Ji Hun RYU, Woo Young KIM, Yun Ha KIM, Bon Joo KOO, Jae Young YU
  • Patent number: 11974433
    Abstract: A semiconductor memory device includes a third insulating pattern and a first insulating pattern on a substrate, the third insulating pattern and the first insulating pattern being spaced apart from each other in a first direction that is perpendicular to the substrate such that a bottom surface of the third insulating pattern and a top surface of the first insulating pattern face each other, a gate electrode between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and including a first side extending between the bottom surface of the third insulating pattern and the top surface of the first insulating pattern, and a second insulating pattern that protrudes from the first side of the gate electrode by a second width in a second direction, the second direction being different from the first direction.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: April 30, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Heon Kang, Tae Hun Kim, Jae Ryong Sim, Kwang Young Jung, Gi Yong Chung, Jee Hoon Han, Doo Hee Hwang
  • Patent number: 11973109
    Abstract: A semiconductor device is provided. The semiconductor device comprising a first fin pattern and a second fin pattern which are separated by a first isolation trench and extend in a first direction, a third fin pattern which is spaced apart from the first fin pattern in a second direction intersecting the first direction and extends in the first direction, a fourth fin pattern which is separated from the third fin pattern by a second isolation trench, a first gate structure which intersects the first fin pattern and has a portion extending along an upper surface of the first fin pattern, a second gate structure which intersects the second fin pattern and has a portion extending along an upper surface of the second fin pattern and a first element isolation structure which fills the second isolation trench and faces a short side of the first gate structure.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Hun Kim, Jae Seok Yang, Hae Wang Lee
  • Publication number: 20240132442
    Abstract: The present disclosure relates to a crystallization method of branched-chain amino acids capable of sustainably cycling ammonia, and branched-chain amino acid crystal produced by the method.
    Type: Application
    Filed: November 9, 2020
    Publication date: April 25, 2024
    Inventors: Jun Woo KIM, Shin Ae PARK, Ji Hyun SHIN, Jae Hun YU, Chang Yub OH, Min Jong KIM
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Patent number: 11961983
    Abstract: Disclosed is a battery module, which includes: a battery cell assembly having at least one battery cell; a module case configured to accommodate the battery cell assembly; and at least one injection hole provided in a bottom portion of the module case to inject a thermally conductive adhesive into the module case.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: April 16, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Soo-Youl Kim, Jae-Hun Yang, Han-Jong Yoon, Jae-Min Lee, Hae-Ryong Jeon, Young-Ho Choi
  • Publication number: 20240120243
    Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.
    Type: Application
    Filed: April 26, 2021
    Publication date: April 11, 2024
    Inventors: Jong Bae SHIN, Moo Seong KIM, Soo Min LEE, Jae Hun JEONG
  • Publication number: 20240115641
    Abstract: Disclosed are an oral film and stick jelly containing glutathione and a milk thistle extract. Provided are an oral disintegrating film, an oral mucosal adhesive film, and a stick jelly that contain glutathione, a milk thistle extract, or the like as an active ingredient, and thus are highly efficacious in improving absorption in the oral mucosa, antioxidant activity, and anti-inflammatory activity, strengthening immunity, and enhancing liver function of humans and companion animals.
    Type: Application
    Filed: February 17, 2022
    Publication date: April 11, 2024
    Applicants: ESTHER FORMULA CO., LTD., BIO360 CO., LTD
    Inventors: Esther LYUH, Kun Se KIM, Eun Soo SUH, Byoung Hag KIM, Mi Young AN, Dae Seong CHEON, Jae Hun KIM, Young Jae PARK, Byeong Hyeon KIM, Hyo Seon CHOI
  • Publication number: 20240118196
    Abstract: In the case of a gas in which several gases are mixed, a type and concentration of the gas may be incorrectly measured when measured using only an optical band-pass filter. The invention of the present application is directed to providing a technology in which a plurality of broadband band-pass filters having overlapping regions are provided to calculate a magnitude of absorption for each wavelength band for light passing through each broadband band-pass filter, thereby identifying the presence of a gas of interest and the presence of a gas other than the gas of interest.
    Type: Application
    Filed: September 8, 2023
    Publication date: April 11, 2024
    Inventors: Cheol Woo NAM, Byung Yul MOON, Eung Yul KIM, Jae Hwan KIM, Chun Ho SHIN, Kwang Hun PARK, Myun Gu CHOI, Chang Hwang CHOI, Yong Geol KIM, Jae Min JEON
  • Patent number: 11954891
    Abstract: Provided is a method of compressing an occupancy map of a three-dimensional (3D) point cloud, and more specifically, a method of compressing an occupancy map of a point cloud in which an occupancy map image of a point cloud existing in a 3D space is compressed based on a compression quality or a patch-by-patch inspection method of the occupancy map image so that compression distortion is minimized when reconstructing the compressed occupancy map image so as to remarkably improve the quality of a reconstructed occupancy map image.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
    Inventors: Eun Young Chang, Euee Seon Jang, Tian Yu Dong, Ji Hun Cha, Kyu Tae Kim, Jae Young Ahn
  • Publication number: 20240109419
    Abstract: The present disclosure relates to a DC-DC converter, a vehicle, and a control method including the same, and more particularly, to a DC-DC converter, a vehicle, and a control method including the same capable of effectively detecting and responding to an interlock failure of a connector.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 4, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Hun JEONG, Mun Soo CHUNG, Kyu Won JEONG, Tae Woo KIM, Jong Dae KIM, Beom Sik KIM, Sang Don LEE
  • Publication number: 20240114386
    Abstract: The present invention proposes a method of processing a buffer state report when a wireless communication system uses inter-eNB carrier aggregation technology. According to the present invention, a terminal may be provided with a proper amount of uplink resource allocations by notifying base stations of a buffer state.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 4, 2024
    Inventors: Jae Hyuk JANG, Soeng Hun KIM, Gert Jan VAN LIESHOUT
  • Patent number: 11949046
    Abstract: A light-emitting element includes a first semiconductor layer doped to have a first polarity, a second semiconductor layer doped to have a second polarity different from the first polarity, a light-emitting layer disposed between the first and second semiconductor layers, a shell layer formed on side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, the shell layer including a divalent metal element, and an insulating film covering an outer surface of the shell layer and surrounding the side surface of the light-emitting layer.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Se Hun Kim, Chang Hee Lee, Yun Hyuk Ko, Duk Ki Kim, Jun Woo Park, Soo Ho Lee, Jae Kook Ha, Yun Ku Jung
  • Patent number: 11948808
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: April 2, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Dong Jin Kim, Jin Han Kim, Won Chul Do, Jae Hun Bae, Won Myoung Ki, Dong Hoon Han, Do Hyung Kim, Ji Hun Lee, Jun Hwan Park, Seung Nam Son, Hyun Cho, Curtis Zwenger
  • Patent number: 11945744
    Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTD
    Inventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
  • Publication number: 20240103958
    Abstract: A method performed by a managing server includes: receiving, from an electronic device, operation data of the electronic device; identifying, by using artificial intelligence (AI), a device usage pattern of the electronic device; identifying, by using the AI, information related to a failure or an abnormal operation of the electronic device and a solution to the failure or the abnormal operation based on the device usage pattern and the operation data received from the electronic device; and transmitting, to a user terminal, the information related to the failure or the abnormal operation of the electronic device and the solution to the failure or the abnormal operation.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun LEE, Myung-Sun KIM, Ayush JAIN, Tae-Ho SWANG, Jae-Hong KIM, Hye-Jung CHO
  • Publication number: 20240107609
    Abstract: A method, performed by a user equipment (UE), of transmitting and receiving signals in a wireless communication system, according to an embodiment, includes receiving a logical channel release request from a next-generation node B (gNB), determining a logical channel to release, an operation mode of the logical channel to release, and whether a packet data convergence protocol (PDCP) layer apparatus connected to the logical channel is re-established, based on the logical channel release request, and performing PDCP data recovery based on the determination result.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Inventors: Dong gun KIM, Sang Bum KIM, Soeng Hun KIM, Alexander SAYENKO, Jae Hyuk JANG, Seung Ri JIN
  • Publication number: 20240106036
    Abstract: A pouch film laminate according to the present disclosure may include a base material layer, a gas barrier layer, and a sealant layer. The gas barrier layer may be disposed between the base material layer and the sealant layer. The gas barrier layer may include stainless steel. The pouch film laminate may have a tensile rupture strength of about 130% to about 250% of a tensile rupture strength of the gas barrier layer.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sang Hun Kim, Gyung Soo Kang, Jae Ho Lee, Hyung Kyun Yu, Ji Sun Lee
  • Publication number: 20240102859
    Abstract: The disclosure relates to an ultrathin micro-spectrometer and a method of manufacturing the same, and more particularly, relates to an ultrathin micro-spectrometer including: a lens portion including: a convex lens; and a back-reflection grating layer which is formed on a rear surface of the convex lens and on the same surface of which a reflective diffraction grating and a first planar reflector are arranged; a substrate layer which is disposed to be spaced apart from the lens portion and on which a light incidence microslit is formed; a second planar reflector which is formed on the substrate layer; and a complementary metal-oxide-semiconductor (CMOS) sensor on which light reflected by the lens portion is focused, and a method of manufacturing the same.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 28, 2024
    Inventors: Ki Hun Jeong, Jung Woo Park, Jae Hun Jeon, Gi Beom Kim
  • Publication number: 20240100340
    Abstract: Provided is a device for relieving headache and pain caused by temporomandibular joint disorders may include: a body having a neck band surroundingly worn on a user's neck, first connectors extending forwardly from both ends of the neck band by first set lengths, and second connectors extending upwardly from front ends of the first connectors by second set lengths; first low frequency electrostimulators disposed on the second connectors and coming into close contact with the temporalis muscles, when the body is worn on the user's head, to apply low frequencies to the temporalis muscles; and second low frequency electrostimulators disposed on the connected portions between the first connectors and the second connectors and coming into close contact with the masseter muscles, when the body is worn on the user's head, to apply low frequencies to the masseter muscles.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: Tae Hun KIM, Won Sik BAE, Jae Hyeong OH, Dong Jin YOU