Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Disclosed is a chemical mechanical polishing pad formed with holes, grooves or a combination thereof. The chemical mechanical polishing pad is characterized in that a plurality of concentric circles each having grooves, holes, or a combination thereof are formed at a polishing surface of the polishing pad. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with a plurality of concentric wave-shaped grooves having different radiuses while having the same shape. Each groove has a desired depth, width, and shape. The chemical mechanical polishing pad provides effects of effectively controlling a flow of slurry during a polishing process, thereby achieving a stability in the polishing process in terms of a polishing rate, and achieving an enhancement in the planarization of a wafer.

Abstract: Interconnected cells, such as gates, are partitioned into blocks, such as integrated circuits, wherein the blocks have at least one constraint, such as number of pins available, on the placement of cells therein. The cells are initially assigned to blocks at random or in accordance with a previously-determined initial partition. A quality factor, such as the total number of pins on all blocks, is determined for the initial partition and cells are moved from block to block to form a new partition. The cell moves are selected so as not to violate the constraints and in accordance with the likelihood of improving the overall quality of the partition. Such partitioning is repeated and the overall quality factor is recalculated for each new partition. When the quality factor does not improve substantially from partition to partition, the last partition for which the quality factor improved is selected as the best.