Abstract: A mitigation service may be used to mitigate a network attack in a network including a group of mitigation devices. Datagrams, intended for a customer that is subject of a network attack, may be received by at least one of the mitigation devices based on an anycast address associated with the mitigation devices. Each of the mitigation devices is addressable via the anycast address. The received datagrams may be processed to remove malicious datagrams and leave legitimate datagrams. The legitimate datagrams may be forwarded to the customer via a tunnel configured between an address associated with the customer and the anycast address associated with the mitigation devices.

Abstract: An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: A spring loaded mounting assembly secures a heat exchanger coupled to a heat source. The mounting assembly includes at least one support bracket positioned at one or more fixed locations with respect to the heat source, and a clip coupled to the support bracket and configured to maintain the heat exchanger in contact with the heat source. The mounting assembly also includes at least one bracket for securing a pump and heat rejector thereupon, wherein the heat exchanger and the pump are independently moveable with respect to one another. The heat rejector is preferably positioned above and alternatively positioned adjacent to the heat exchanger. The clip applies a downward force to the heat exchanger and consistently urges the heat exchanger in contact with the heat source irrespective of movements.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

Abstract: A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

Abstract: In an image processor, images are created, stored, manipulated and regenerated using color tinting, where color tinting applies component-to-color mapping from a color card to a plurality of component images, which are then combined to form a final image, tinted according to the content of the color card. In some instances, the color card might code one color for each of N components, in which case the final image might be the merging of each of N monochromatic component images colored by the color coded by the color card. In other instances, the color card codes for intensity levels or a texture.

Abstract: An electroosmotic pump used in a closed loop cooling system. The pump includes a fluid chamber, a pumping element, an inlet electrode, an outlet electrode, and means for providing electrical voltage to the inlet electrode and the outlet electrode to produce an electrical field therebetween. The pumping element is configured to pump fluid therethrough, and the pumping element is positioned to segment the fluid chamber into an inlet chamber including a fluid inlet port and an outlet chamber including a fluid outlet port. The size of the inlet chamber is proportional to a predetermined residence time of the inlet chamber. The inlet electrode is positioned within the inlet chamber and a predetermined distance from a first surface of the pumping element. The outlet electrode is positioned within the outlet chamber and a predetermined distance from a second surface of the pumping element.

Abstract: A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

Abstract: A spring loaded mounting assembly and method of manufacturing thereof for securing a heat exchanger coupled to a heat source, the mounting assembly comprising: at least one support bracket positioned at one or more fixed locations with respect to the heat source; and a clip coupled to the support bracket and configured to maintain the heat exchanger in contact with the heat source. The mounting assembly further comprises at least one bracket for securing a pump and heat rejector thereupon, wherein the heat exchanger and the pump are independently moveable with respect to one another. The heat rejector is preferably positioned above and alternatively positioned adjacent to the heat exchanger. The clip applies a downward force to the heat exchanger and consistently urges the heat exchanger in contact with the heat source irrespective of movements.

Abstract: An apparatus and method of circulating a heat-absorbing material within a heat exchanger is disclosed. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a plurality of channels that extend from the inlet manifold, toward a heat-exchanging plane, and turn away from the heat-exchanging plane, terminating at the outlet manifold. The plurality of channels are stacked in a plane non-parallel to the heat-exchanging plane. Each of the channels is adjacent to another, thus allowing heat radiated from a heat-generating device to be conducted to a cooling material circulating within the channels, away from the heat-generating device. Preferably, each of the channels has a U-shape or an elongated U-shape.

Abstract: A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid sealing region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.

Abstract: A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.

Abstract: A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

Abstract: A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

Abstract: An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated.

Abstract: An optical MEM device is encapsulated with a dampening gas to reduce oscillatory vibrations of movable parts during the operation of the device. Preferably, the dampening gas comprises one or more noble gases, such as neon and/or krypton with a partial pressure in a range of 50 to 100% of the total dampening gas pressure. In further embodiments, the dampening gas comprises a mixture of one or more noble gases and an inert carrier gas, such as nitrogen. Preferably, the optical MEM device is sealed within a die with a dampening gas pressure between 0.5 to 3.0 atmospheres at 20 degree Celsius. The current invention is particularly useful for reducing oscillatory vibrations of optical MEM devices having a plurality of movable ribbon structures configured to modulate light with one or more wavelengths in the near infrared (800 to 4000 nanometers) and which operate at high switching rates (4-40 Volts/nano second) and at high switching frequencies (1 kHz and greater).

Abstract: A grating light valve with a plurality of spaced and movable ribbons attached to a substrate surface is sealed within a die structure containing a dampening gas. The tops of the ribbons and the regions of the substrate between the ribbons are reflective. The ribbons move toward and away from the substrate to constructively and destructively interfere with an incident light source having a wavelength &lgr;. In accordance with the invention, the ribbons and the substrate surfaces are sealed within a die structure that contains a dampening gas. Preferably, the dampening gas is a Neon or a Krypton-based gas with a Neon partial pressure in a range of 50 to 100% of the total dampening gas pressure. The Neon-based damping gas is sealed within the die structure such that the total pressure within the sealed die is between 0.5 to 3.0 atmospheres at 20 degree Celsius.