Abstract: Powdered nickel-based alloys having substantial amounts of chromium and molybdenum are molded and sintered to form tubular filter supports. Metal oxide particulates, preferably titanium oxide, are impregnated into the interior surfaces of the tubular elements and sintered to create 0.1 micron filter membranes. Hastelloy C-22 is a preferred nickel-based alloy for forming the porous metal support, while rutile is preferred as a starting material for forming the filter membrane. The resultant porous metal/metal oxide filter elements have superior resistance to chemical attack in high chloride, low pH environments.

Abstract: Powdered nickel-based alloys having substantial amounts of chromium and molybdenum are molded and sintered to form tubular filter supports. Metal oxide particulates, preferably titanium oxide, are impregnated into the interior surfaces of the tubular elements and sintered to create 0.1 micron filter membranes. Hastelloy C-22 is a preferred nickel-based alloy for forming the porous metal support, while rutile is preferred as a starting material for forming the filter membrane. The resultant porous metal/metal oxide filter elements have superior resistance to chemical attack in high chloride, low pH environments.

Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid scaling region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.

Abstract: A method and apparatus of hermetically passivating a semiconductor device includes sealing a lid directly onto a semiconductor substrate. An active device is formed on the surface of the substrate and is surrounded by a substantially planar lid sealing region, which in turn is surrounded by bonding pads. A first layer of solderable material is formed on the lid sealing region. A lid is provided which has a second layer of solderable material in a configuration corresponding to the first layer. A solder is provided between the first layer and second layer of solderable materials. In the preferred embodiment, the solder is formed over the second layer. Heat is provided to hermetically join the lid to the semiconductor device without requiring a conventional package. Preferably the first and second layers are sandwiches of conventionally known solderable materials which can be processed using conventional semiconductor techniques.

Abstract: A system and method for generating tornadoes and other vortex phenomen in an open air, free space enviroment is disclosed. The system includes a flat surface or deck suspended above the ground, a circular hole in the center of the deck, a means for creating an updraft through the hole in the deck and fans or other air moving means for creating a swirling air flow. Preferably, the fans for swirling the air are angled approximately 45 degrees relative to the vertical axis of the updraft flow through the center hole. For swirling the air at higher elevations, as well as at ground level, a multi level fan arrangement having the layers of fans spaced relative to the deck is used. Alternatively, a single level of fans are used in conjunction with louvers or vanes for deflecting the blown air into a fan shape. In another embodiment of the present invention, tangential flow is established by using a multiplicity of tubes for returning air flow from a plenum above an updraft fan.

Abstract: A method of cementing wells to minimize gas intrusion by applying pressures on the subsurface formations substantially equal to the natural formation pressures.