Abstract: A covert tracer round has an infrared emitter of radiation mounted to its front, side or back. The radiation (which may be coherent or incoherent) is detected by a sensor that displays an image of the target and the beam. The sensor receives the beam directly if the emitter is on the back of the round and by reflection off the target or nearby objects if the emitter faces forward. The round may include a fixed or moveable collimating lens. The emitter may radiate radially from the round to signal troops or devices located along its path. The round may include sensors that gather significant information about chemicals or biological agents, about magnetic or gravitational anomalies or any other remotely detectable property and transmit that information to the sensor by modulating the emitted radiation.

Abstract: An improved cutting insert for a cutting tool is designed from a blank of a regular geometry. The blank is designed so that an even number of channels are spaced equidistant around the periphery of the blank. The channels are elliptical in shape, and are arranged in alternating directions around the face of the insert. The grooves are designed to have a 7 degree relief angle.

Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).

Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).

Abstract: A automated pilling, snag, and fuzziness inspection and grading method and apparatus for quantifying, locating, and sizing pills, snags, and/or fuzz on fabric rolls or fabric sample swatches, which includes a fulcrum about which the fabric is bent, the fulcrum defining an apex portion in the fabric where the fulcrum contacts the fabric. A moving mechanism is provided for moving a length of the fabric across the fulcrum causing the apex portion to be temporally redefined along the length of the moving fabric. An illumination mechanism is provided for projecting a light upon one side of the temporally redefined apex portion and a recording device is also provided for recording a horizon image of the temporally redefined apex portion where the horizon image being back lit by the illumination mechanism.

Abstract: An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.

Abstract: A method of making a semiconductor device (100) by attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound (108) and material is removed from the first laminate to form a mold lock (120) with the molding compound.

Abstract: A method of making a semiconductor device (100), comprising attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device.

Abstract: An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.

Abstract: A filament inspection method for detecting abnormalities in a wound yarn package includes illuminating the yarn package while sensing and recording an image of the illuminated yarn package. The method further includes evaluating the recorded image in accordance with predetermined criteria to determine thereby whether the recorded image indicates the presence of any abnormalities in the yarn package.

Abstract: An improved cutting insert for a cutting tool is designed from a blank of a regular geometry. The blank is designed so that an even number of channels are spaced equidistant around the periphery of the blank. The channels are elliptical in shape, and are arranged in alternating directions around the face of the insert. The grooves are designed to have a 7 degree relief angle.

Abstract: An automated screening system and method for cytological specimen classification in which a neural network is utilized in performance of the classification function. Also included is an automated microscope and associated image processing circuitry.

Abstract: A backscattering spectrometry method and device for identifying and quantifying impurities in a workpiece during processing and manufacturing of that workpiece. While the workpiece is implanted with an ion beam, that same ion beam backscatters resulting from collisions with known atoms and with impurities within the workpiece. Those ions backscatter along a predetermined scattering angle and are filtered using a self-supporting filter to stop the ions with a lower energy because they collided with the known atoms of the workpiece of a smaller mass. Those ions which pass through the filter have a greater energy resulting from impact with impurities having a greater mass than the known atoms of the workpiece. A detector counts the number and measures the energy of the ions which pass through the filter.