Patents by Inventor James A. Wright

James A. Wright has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10524372
    Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: December 31, 2019
    Assignee: Apple Inc.
    Inventors: James A. Wright, Guangtao Zhang, Raymund W. M. Kwok, Karl Ruben F. Larsson, Christopher S. Graham, Matthew D. Hill, Abhijeet Misra
  • Patent number: 10519529
    Abstract: An alloy includes, in weight percentage, about 20.0% to about 25.0% chromium, 0% to about 5.0% molybdenum, about 3.0% to about 15.0% cobalt, about 1.5% to about 6.0% niobium, about 1.0% to about 3.0% tantalum, about 1.0% to about 5.0% tungsten, 0% to about 1.0% aluminum, 0% to about 0.05% carbon, 0% to about 0.01% titanium, and the balance nickel and incidental elements and impurities, wherein the alloy includes L12 and D022 precipitates in a compact morphology.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: December 31, 2019
    Assignee: QUESTEK INNOVATIONS LLC
    Inventors: James A. Wright, Weiming Huang, Abhijeet Misra, Jeremy Hoishun Li, Jiadong Gong, Dana J. Frankel
  • Patent number: 10472709
    Abstract: An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: November 12, 2019
    Assignee: Apple Inc.
    Inventors: Daniel T. McDonald, James A. Wright, Wai Man Raymund Kwok
  • Patent number: 10471503
    Abstract: Provided herein are titanium alloys that can achieve a combination of high strength and high toughness or elongation, and a method to produce the alloys. By tolerating iron, oxygen, and other incidental elements and impurities, the alloys enable the use of lower quality scrap as raw materials. The alloys are castable and can form ?-phase laths in a basketweave morphology by a commercially feasible heat treatment that does not require hot-working or rapid cooling rates. The alloys comprise, by weight, about 3.0% to about 6.0% aluminum, 0% to about 1.5% tin, about 2.0% to about 4.0% vanadium, about 0.5% to about 4.5% molybdenum, about 1.0% to about 2.5% chromium, about 0.20% to about 0.55% iron, 0% to about 0.35% oxygen, 0% to about 0.007% boron, and 0% to about 0.60% other incidental elements and impurities, the balance of weight percent comprising titanium.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 12, 2019
    Assignee: Questek Innovations LLC
    Inventors: James A. Wright, Jason Sebastian, Herng-Jen Jou
  • Patent number: 10427380
    Abstract: The methods including applying a corrosion resistant alloy to a metal substrate to create a bimetal blank. The bimetal blank can undergo a variety of shaping and machining operations to form the net shape and internal structures of the part. Further, the part can undergo a finishing operation (e.g. polishing) to create the desired cosmetic appearance on the exterior surfaces and remove any surface imperfections resulting from the shaping and machining operations.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: October 1, 2019
    Assignee: Apple Inc.
    Inventors: Charles J. Kuehmann, Christopher M. Werner, Colin M. Ely, James A. Wright
  • Publication number: 20190223310
    Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Inventors: James A. Wright, Guanglao Zhang, Raymund W.M. Kwok, Karl Ruben F. Larsson, Christopher S. Graham, Matthew D. Hill, Abhijeet Misra
  • Patent number: 10351921
    Abstract: A martensitic stainless steel alloy is strengthened by copper-nucleated nitride precipitates. The alloy includes, in combination by weight percent, about 10.0 to about 12.5 Cr, about 2.0 to about 7.5 Ni, up to about 17.0 Co, about 0.6 to about 1.5 Mo, about 0.5 to about 2.3 Cu, up to about 0.6 Mn, up to about 0.4 Si, about 0.05 to about 0.15 V, up to about 0.10 N, up to about 0.035 C, up to about 0.01 W, and the balance Fe and incidental elements and impurities. The nitride precipitates may be enriched by one or more transition metals. A case hardened, corrosion resistant variant has a reduced weight percent of Ni, enabling increased use of Cr, and decreased Co.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 16, 2019
    Assignee: QuesTek Innovations LLC
    Inventors: David R. Snyder, Jiadong Gong, Jason T. Sebastian, James A. Wright, Herng-Jeng Jou, Zechariah Feinberg
  • Patent number: 10351922
    Abstract: Alloys, a process for preparing the alloys, and manufactured articles including the alloys are described herein. The alloys include, by weight, about 11.5% to about 14.5% chromium, about 0.01% to about 3.0% nickel, about 0.1% to about 1.0% copper, about 0.1% to about 0.2% carbon, about 0.01% to about 0.1% niobium, 0% to about 5% cobalt, 0% to about 3.0% molybdenum, and 0% to about 0.5% titanium, the balance essentially iron and incidental elements and impurities.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: July 16, 2019
    Assignee: QuesTek Innovations LLC
    Inventors: David R. Snyder, Jiadong Gong, Jason T. Sebastian, James A. Wright, Herng-Jeng Jou, Zechariah Feinberg
  • Publication number: 20190211432
    Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 11, 2019
    Inventors: Abhijeet Misra, James A. Wright, Herng-Jeng Jou
  • Patent number: 10327348
    Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 18, 2019
    Assignee: Apple Inc.
    Inventors: James A. Wright, Guangtao Zhang, Raymund W. M. Kwok, Karl Ruben F. Larsson, Christopher S. Graham, Matthew D. Hill, Abhijeet Misra
  • Publication number: 20190169717
    Abstract: The disclosure provides aluminum alloys with high tensile strength and appealing cosmetics and improved tensile yield strength. The aluminum alloys include 0.5 to 3.0 wt % Mg and 0.2 to 3.0 wt % Si. The alloys have a weight ratio of Mg to Si ranging from 2 to 4.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 6, 2019
    Inventors: Hoishun Li, James A. Yurko, Herng-Jeng Jou, James A. Wright
  • Publication number: 20190099982
    Abstract: The disclosure provides an aluminized composite including a base material. The aluminized composite may also include a diffusion layer disposed over the base material. The aluminized composite may further include an aluminum material disposed over the diffusion layer.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Yoshihiko Yokoyama, Naoto Matsuyuki, James A. Wright
  • Patent number: 10208371
    Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties. In some variations, the alloy can include 3.4 to 4.9 wt % Zn, 1.3 to 2.1 wt % Mg, no greater than 0.06 wt % Cu, no greater than 0.06 wt % Zr, 0.06 to 0.08 wt % Fe, no greater than 0.05 wt % Si, and the balance is aluminum and incidental impurities.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 19, 2019
    Assignee: Apple Inc.
    Inventors: Abhijeet Misra, James A. Wright, Herng-Jeng Jou
  • Publication number: 20180265958
    Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt %) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.
    Type: Application
    Filed: March 20, 2018
    Publication date: September 20, 2018
    Inventors: Hoishun Li, Ethan E. Currens, Weiming Huang, James A. Wright
  • Publication number: 20180135143
    Abstract: A martensitic stainless steel alloy is strengthened by copper-nucleated nitride precipitates. The alloy includes, in combination by weight percent, about 10.0 to about 12.5 Cr, about 2.0 to about 7.5 Ni, up to about 17.0 Co, about 0.6 to about 1.5 Mo, about 0.5 to about 2.3 Cu, up to about 0.6 Mn, up to about 0.4 Si, about 0.05 to about 0.15 V, up to about 0.10 N, up to about 0.035 C, up to about 0.01 W, and the balance Fe and incidental elements and impurities. The nitride precipitates may be enriched by one or more transition metals. A case hardened, corrosion resistant variant has a reduced weight percent of Ni, enabling increased use of Cr, and decreased Co.
    Type: Application
    Filed: November 21, 2017
    Publication date: May 17, 2018
    Inventors: David R. Snyder, Jiadong Gong, Jason T. Sebastian, James A. Wright, Herng-Jeng Jou, Zechariah Feinberg
  • Publication number: 20180105898
    Abstract: A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.
    Type: Application
    Filed: December 18, 2017
    Publication date: April 19, 2018
    Inventors: James A. Wright, Abhijeet Misra
  • Publication number: 20180103557
    Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
    Type: Application
    Filed: April 28, 2017
    Publication date: April 12, 2018
    Inventors: James A. Wright, Guangtao Zhang, Raymund W.M. Kwok, Karl Ruben F. Larsson, Christopher S. Graham, Matthew D. Hill, Abhijeet Misra
  • Publication number: 20180087173
    Abstract: Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.
    Type: Application
    Filed: April 7, 2017
    Publication date: March 29, 2018
    Inventors: Evgeniya FREYDINA, Joshua Garth ABBOTT, Alan C. LUND, Robert Daniel HILTY, Shiyun RUAN, Jason REESE, Lisa J. CHAN, James A. WRIGHT, James A. CURRAN
  • Publication number: 20180073159
    Abstract: Coatings for titanium and titanium alloy substrates are described. The coatings can include an aluminum oxide layer and, in some cases, a thin titanium oxide layer. If the coating includes a titanium oxide layer, the aluminum oxide layer can cover and protect the titanium oxide layer from abrasion and scratching. In some examples, the titanium oxide layer has a thickness sufficient to provide a color by thin-film interference, which can be visible through the overlying aluminum oxide layer. In some embodiments, the aluminum oxide layer is colorized using an anodic dye, pigment or metal colorant, which can combine with interference colors of the titanium oxide layer.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 15, 2018
    Inventors: James A. CURRAN, Herng-Jeng JOU, James A. WRIGHT
  • Patent number: 9914987
    Abstract: A martensitic stainless steel alloy is strengthened by copper-nucleated nitride precipitates. The alloy includes, in combination by weight percent, about 10.0 to about 12.5 Cr, about 2.0 to about 7.5 Ni, up to about 17.0 Co, about 0.6 to about 1.5 Mo, about 0.5 to about 2.3 Cu, up to about 0.6 Mn, up to about 0.4 Si, about 0.05 to about 0.15 V, up to about 0.10 N, up to about 0.035 C, up to about 0.01 W, and the balance Fe and incidental elements and impurities. The nitride precipitates may be enriched by one or more transition metals. A case hardened, corrosion resistant variant has a reduced weight percent of Ni, enabling increased use of Cr, and decreased Co.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: March 13, 2018
    Assignee: QuesTek Innovations LLC
    Inventors: David R. Snyder, Jiadong Gong, Jason T. Sebastian, James A. Wright, Herng-Jeng Jou, Zechariah Feinberg