Patents by Inventor James B. Smith
James B. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240007556Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: September 14, 2023Publication date: January 4, 2024Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukia, Scott A. Myers
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Patent number: 11792309Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: July 17, 2021Date of Patent: October 17, 2023Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Publication number: 20220286543Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.Type: ApplicationFiled: September 10, 2021Publication date: September 8, 2022Inventors: Owen D. Hale, Dale T. Morgan, Andrew U. Leopold, Yifan Zhao, Nicholas Merz, Daniel Jarvis, James B. Smith, Macey E. Dade, Samuel J. Pliska, Ethan R. Stobbe, Cameron Bauer, Ian A. Spraggs, Marwan Rammah, Bryan D. Keen, David A. Pakula
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Publication number: 20210344784Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: July 17, 2021Publication date: November 4, 2021Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 11073872Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components.Type: GrantFiled: March 13, 2020Date of Patent: July 27, 2021Assignee: Apple Inc.Inventors: Andrew U. Leopold, Owen D. Hale, Daniel W. Jarvis, David A. Pakula, James B. Smith, Ian A. Spraggs, Gregory N. Stephens
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Patent number: 11070655Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: January 13, 2020Date of Patent: July 20, 2021Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 11006524Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.Type: GrantFiled: January 19, 2018Date of Patent: May 11, 2021Assignee: Apple Inc.Inventors: Scott A. Myers, James B. Smith, Dale T. Morgan, Shayan Malek
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DUAL BOARD-TO-BOARD CONNECTOR BATTERY MANAGEMENT CIRCUIT MODULE UTILIZING A SWITCH-BACK SERVICE LOOP
Publication number: 20210081000Abstract: The disclosed technology relates to a dual board-to-board connector battery management circuit module utilizing a switch-back service loop for a battery pack. The management circuit module is coupled to a first and second terminal of a battery pack and includes a first board-to-board connector disposed proximal to a first end of the management circuit module; and a second board-to-board connector disposed proximal to a second end of the management circuit module. The second board-to-board connector is positioned opposite the first board-to-board connector.Type: ApplicationFiled: September 11, 2020Publication date: March 18, 2021Inventors: Depeng Wang, Andrew U. Leopold, Gregory N. Stevens, Jonathan C. Wilson, James B. Smith -
Publication number: 20210072801Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components.Type: ApplicationFiled: March 13, 2020Publication date: March 11, 2021Inventors: Andrew U. LEOPOLD, Owen D. HALE, Daniel W. JARVIS, David A. PAKULA, James B. SMITH, Ian A. SPRAGGS, Gregory N. STEPHENS
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Patent number: 10696078Abstract: This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.Type: GrantFiled: September 10, 2018Date of Patent: June 30, 2020Assignee: Apple Inc.Inventors: Jason Sloey, Simon C. Helmore, James B. Smith
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Publication number: 20200153950Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: January 13, 2020Publication date: May 14, 2020Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: 10547717Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: January 7, 2019Date of Patent: January 28, 2020Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Publication number: 20190141171Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: ApplicationFiled: January 7, 2019Publication date: May 9, 2019Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Publication number: 20190082529Abstract: This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.Type: ApplicationFiled: September 10, 2018Publication date: March 14, 2019Inventors: Jason SLOEY, Simon C. HELMORE, James B. SMITH
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Publication number: 20190082535Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.Type: ApplicationFiled: January 19, 2018Publication date: March 14, 2019Inventors: Scott A. MYERS, James B. SMITH, Dale T. MORGAN, Shayan MALEK
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Patent number: 10225964Abstract: Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.Type: GrantFiled: August 29, 2016Date of Patent: March 5, 2019Assignee: Apple Inc.Inventors: James B. Smith, Daniel W. Jarvis, David A. Pakula, Gregory N. Stephens, Nicholas G. L. Merz, Shayan Malek, Sina Bigdeli
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Patent number: 10218827Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.Type: GrantFiled: March 3, 2017Date of Patent: February 26, 2019Assignee: APPLE INC.Inventors: Matthew D. Hill, Derek C. Krass, Benjamin Shane Bustle, Lucy Elizabeth Browning, Michael Benjamin Wittenberg, James B. Smith, Ashutosh Y. Shukla, Scott A. Myers
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Patent number: D827706Type: GrantFiled: April 25, 2016Date of Patent: September 4, 2018Assignee: Xerox CorporationInventors: William T Clark, III, James B Smith, Andrew T Martin, Stephen F Skrainar
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Patent number: D850529Type: GrantFiled: May 2, 2016Date of Patent: June 4, 2019Assignee: Xerox CorporationInventors: William T Clark, III, James B Smith, Keith L Willis, Andrew T Martin, Stephen F Skrainar
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Patent number: D961594Type: GrantFiled: May 18, 2018Date of Patent: August 23, 2022Assignee: Apple Inc.Inventors: Matthew David Hill, Dale T. Morgan, James B. Smith, Ian Spraggs