Patents by Inventor James D. Cook

James D. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240110822
    Abstract: Various embodiments are directed to methods and apparatuses for determining a weight of one or more objects disposed about an area of the weight measurement device using a single force sensor to accurately measure a force generated by the one or more objects. In various embodiments, the apparatus comprises a housing, a receiving tray, a lever assembly configured to receive a weight force from the receiving tray and generate a collective lever force corresponding to the weight force, the lever assembly comprising a plurality of levers, wherein each lever of the plurality of levers being at least substantially fixed to the housing at a first lever location and configured to receive a partial weight force from the receiving tray at a second lever location, and a force sensor configured to define a fulcrum point along each of the plurality of levers.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 4, 2024
    Inventors: Bradley J. Huntzinger, James D. Cook, Bhim P. Khanal
  • Patent number: 11892340
    Abstract: Various embodiments are directed to methods and apparatuses for determining a weight of one or more objects disposed about an area of the weight measurement device using a single force sensor to accurately measure a force generated by the one or more objects. In various embodiments, the apparatus comprises a housing, a receiving tray, a lever assembly configured to receive a weight force from the receiving tray and generate a collective lever force corresponding to the weight force, the lever assembly comprising a plurality of levers, wherein each lever of the plurality of levers being at least substantially fixed to the housing at a first lever location and configured to receive a partial weight force from the receiving tray at a second lever location, and a force sensor configured to define a fulcrum point along each of the plurality of levers.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: February 6, 2024
    Assignee: Honeywell International Inc.
    Inventors: Bradley J. Huntzinger, James D. Cook, Bhim P. Khanal
  • Publication number: 20210270665
    Abstract: Various embodiments are directed to methods and apparatuses for determining a weight of one or more objects disposed about an area of the weight measurement device using a single force sensor to accurately measure a force generated by the one or more objects. In various embodiments, the apparatus comprises a housing, a receiving tray, a lever assembly configured to receive a weight force from the receiving tray and generate a collective lever force corresponding to the weight force, the lever assembly comprising a plurality of levers, wherein each lever of the plurality of levers being at least substantially fixed to the housing at a first lever location and configured to receive a partial weight force from the receiving tray at a second lever location, and a force sensor configured to define a fulcrum point along each of the plurality of levers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 2, 2021
    Inventors: Bradley J. Huntzinger, James D. Cook, Bhim P. Khanal
  • Patent number: 9995641
    Abstract: Apparatus and associated methods relate to a force sensor having flip-chip mounted force-sensing die having a force-sensing element fabricated on an unflipped top surface and an unflipped back surface being thinned so as to create a flexible diaphragm responsive to an externally applied force, wherein, when the force-sensing die is flipped and mounted, a predetermined space remains between the top surface of the force-sensing die and the mounting substrate it faces, the substrate presenting a deflection limitation for the deformation of the flexible membrane during a force event. In an illustrative embodiment, the force sensor may have a mechanical stop to precisely establish a predetermined deflection limitation. In some embodiments, the predetermined deflection limitation may advantageously limit the deflection of the flexible membrane so as not to deflect beyond a breaking point.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: June 12, 2018
    Assignee: Honeywell International Inc.
    Inventors: Richard A. Wade, James D. Cook
  • Publication number: 20160273977
    Abstract: Apparatus and associated methods relate to a force sensor having flip-chip mounted force-sensing die having a force-sensing element fabricated on an unflipped top surface and an unflipped back surface being thinned so as to create a flexible diaphragm responsive to an externally applied force, wherein, when the force-sensing die is flipped and mounted, a predetermined space remains between the top surface of the force-sensing die and the mounting substrate it faces, the substrate presenting a deflection limitation for the deformation of the flexible membrane during a force event. In an illustrative embodiment, the force sensor may have a mechanical stop to precisely establish a predetermined deflection limitation. In some embodiments, the predetermined deflection limitation may advantageously limit the deflection of the flexible membrane so as not to deflect beyond a breaking point.
    Type: Application
    Filed: October 1, 2014
    Publication date: September 22, 2016
    Inventors: Richard A. Wade, James D. Cook
  • Patent number: 8523494
    Abstract: An expansion shell assembly for mine roof bolts includes an expansion member threaded onto an associated mine roof bolt. A support device is annularly disposed around the associated roof bolt. An expansion shell is annularly disposed around the associated roof bolt between the expansion member and the support device. The expansion shell has a base ring for engaging the support device and fingers for engaging a peripheral edge of the tapered plug. The engagement between the base ring and the support device permits axial traverse movement of the support device relative to the expansion shell for tensioning the roof bolt.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: September 3, 2013
    Assignee: DSI Underground Systems, Inc.
    Inventor: James D. Cook
  • Patent number: 8327685
    Abstract: A particulate matter sensor includes a ceramic rod, a first metal layer deposited on the ceramic rod, a ceramic layer deposited on the first metal layer, and a second metal layer deposited on the ceramic layer. The first metal layer serves as a source electrode, and the second metal layer serves as a detection electrode. In another embodiment, a particulate matter sensor includes a metal rod, a ceramic sheet deposited or wrapped around the ceramic rod, and a metal layer deposited on the ceramic layer or sheet. The metal rod serves as a source electrode, and the second metal layer serves as a detection electrode.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: December 11, 2012
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Steven J. Magee
  • Publication number: 20120073267
    Abstract: A particulate matter sensor includes a ceramic rod, a first metal layer deposited on the ceramic rod, a ceramic layer deposited on the first metal layer, and a second metal layer deposited on the ceramic layer. The first metal layer serves as a source electrode, and the second metal layer serves as a detection electrode. In another embodiment, a particulate matter sensor includes a metal rod, a ceramic sheet deposited or wrapped around the ceramic rod, and a metal layer deposited on the ceramic layer or sheet. The metal rod serves as a source electrode, and the second metal layer serves as a detection electrode.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 29, 2012
    Applicant: Honeywell International Inc.
    Inventors: James D. Cook, Steven J. Magee
  • Publication number: 20100278593
    Abstract: An expansion shell assembly for mine roof bolts includes an expansion member threaded onto an associated mine roof bolt. A support device is annularly disposed around the associated roof bolt. An expansion shell is annularly disposed around the associated roof bolt between the expansion member and the support device. The expansion shell has a base ring for engaging the support device and fingers for engaging a peripheral edge of the tapered plug. The engagement between the base ring and the support device permits axial traverse movement of the support device relative to the expansion shell for tensioning the roof bolt.
    Type: Application
    Filed: May 21, 2010
    Publication date: November 4, 2010
    Inventor: James D. Cook
  • Patent number: 7730772
    Abstract: A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: June 8, 2010
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Brian J. Marsh, Mohammed A J Qasimi, Daniel Dixon, Sachin Kumar
  • Patent number: 7726184
    Abstract: The SAW sensor in a stainless steel button package having a diaphragm and mounted on a threaded port. Package can hermetically seal a sensor and RFID-antenna assemblies from media. Sensor diaphragm is exposable to media. Sensor and RFID antennas communicate electrically with SAW sensor and RFID device, respectively, for sensor measurements and identification. Antennas receive RF interrogation signal from a nearby interrogator/transceiver and send reflected RF signals back to the interrogator unit containing sensor measurement and sensor ID. TRF signal excites a SAW resonator inside the sensor and causes the SAW to resonate wherein resonant frequency changes with pressure and temperature applied to the sensor. Antennas could be printed circuit board antennas, helical antennas, loop antennas, any other commercially available off-the-shelf antennas or a combination of these.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: June 1, 2010
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Brian J. Marsh, Mohammed A J Qasimi, Daniel Dixon, Sachin Kumar
  • Patent number: 7722295
    Abstract: An expansion shell assembly for mine roof bolts includes an expansion member threaded onto an associated mine roof bolt. A support device is annularly disposed around the associated roof bolt. An expansion shell is annularly disposed around the associated roof bolt between the expansion member and the support device. The expansion shell has a base ring for engaging the support device and fingers for engaging a peripheral edge of the expansion member. The engagement between the base ring and the support device permits axial traverse movement of the support device relative to the expansion shell for tensioning the roof bolt.
    Type: Grant
    Filed: April 12, 2004
    Date of Patent: May 25, 2010
    Assignee: Met-Tech Industries, Inc.
    Inventor: James D. Cook
  • Patent number: 7651879
    Abstract: Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: January 26, 2010
    Assignee: Honeywell International Inc.
    Inventors: Cornel P. Cobianu, Ioan Pavelescu, Viorel V. Avramescu, James D. Cook, Leonard J. McNally
  • Patent number: 7576470
    Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: August 18, 2009
    Assignee: Honeywell International Inc.
    Inventors: Sachin Kumar, James D. Cook, Gary O'Brien, Mohammed A J Qasimi, Richard C. Sorenson, Brian J. Marsh, Viorel V. Avramescu
  • Publication number: 20090167503
    Abstract: The SAW sensor in a stainless steel button package having a diaphragm and mounted on a threaded port. Package can hermetically seal a sensor and RFID-antenna assemblies from media. Sensor diaphragm is exposable to media. Sensor and RFID antennas communicate electrically with SAW sensor and RFID device, respectively, for sensor measurements and identification. Antennas receive RF interrogation signal from a nearby interrogator/transceiver and send reflected RF signals back to the interrogator unit containing sensor measurement and sensor ID. TRF signal excites a SAW resonator inside the sensor and causes the SAW to resonate wherein resonant frequency changes with pressure and temperature applied to the sensor. Antennas could be printed circuit board antennas, helical antennas, loop antennas, any other commercially available off-the-shelf antennas or a combination of these.
    Type: Application
    Filed: September 26, 2008
    Publication date: July 2, 2009
    Inventors: James D. Cook, Brian J. Marsh, Mohammed A J Qasimi, Daniel Dixon, Sachin Kumar
  • Publication number: 20090165546
    Abstract: A wireless and batteryless pressure sensor apparatus comprises of a SAW sensor and an antenna mounted on a printed circuit board. Optionally, and RFID tag in used in combination with the SAW sensor. A sensor antenna and a RFID antenna can be located on the printed circuit board such that the antennas communicate electrically with the sensor and the RFID device. The sensor can be interrogated utilizing a radio frequency, which is used to excite a SAW crystal inside the sensor. The interrogation signal causes the SAW to resonate wherein a resonant frequency changes with the pressure and temperature that is applied to the sensor. An interrogator can receive a return (echo) signal representing a change in SAW sensor properties (e.g., diaphragm change). A printed circuit board can be mounted on a stainless steel port and overpackaged with standard processes for hermetically sealing the sensor, or sensor and RFID device with at least one antenna.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Inventors: James D. Cook, Brian J. Marsh, Mohammed A.J Qasimi, Daniel Dixon, Sachin Kumar
  • Publication number: 20080265711
    Abstract: A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Sachin Kumar, James D. Cook, Gary O'Brien, Mohammed AJ. Qasimi, Richard C. Sorenson, Brian J. Marsh, Viorel V. Avramescu
  • Patent number: 7395724
    Abstract: A torque sensor packaging system and method includes a torque member that includes one or more holes formed therein for receiving one or more respective fasteners associated with a sensing element. The sensing element can be connected to the torque member to the sensing element in order to transfer torque associated with the torque member to the sensing element for torque sensing operations thereof.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: July 8, 2008
    Assignee: Honeywell International Inc.
    Inventors: Scott L. Bunyer, Fred W. Hintz, Steven J. Magee, Randall J. Hasken, James Z T Liu, Gary R. O'Brien, James D. Cook, Richard M. Andrews, Stephen R. Shiffer
  • Patent number: 7391325
    Abstract: A multifunctional multichip system can operate in a passive mode by using at least one antenna to receive electromagnetic energy and using that energy to perform system functions. The system includes a sensor, an impedance matching circuit and an RFID module. The sensor produces a sensor signal containing a measurement. The RFID can produce an identification signal containing identification information. Alternatively, the RFID chip can be used in an addressing mode wherein the system only produces a signal in response to an addressing signal containing addressing information. The addressing signal is received from the electromagnetic field. In either mode, the sensor signal is coupled from the antenna into the electromagnetic field from which a receiver can obtain it. The signal can contain the identification information as well as the measurement. A matching network minimizes the effects of impedance mismatches between the system elements.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: June 24, 2008
    Assignee: Honeywell International Inc.
    Inventors: Cornel P. Cobianu, Ion Georgescu, James D. Cook, Viorel V. Avramescu
  • Patent number: D611075
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: March 2, 2010
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Brian J. Marsh, Wayne L. Ehlers, Gary W. Eisenhower, Jr.