Abstract: A cooking oil quality sensing apparatus and system includes an acoustic wave sensor composed of one or more acoustic wave transducers configured upon a piezoelectric substrate such that when the acoustic wave sensor is in contact with cooking oil, the sensor generates acoustic wave data indicative of the quality of the cooking oil. An antenna can be integrated with the acoustic wave sensor, such that the antenna receives data an external source and transmits the acoustic wave data indicative of the quality of the cooking oil to the external source. An oscillator can be integrated with the acoustic wave sensor, such that the output of the oscillator contains data indicative of the quality of the cooking oil. The acoustic wave sensor can be coated with a material that is selectively sensitive and/or reactive to one or more fatty acids associated with or contained in the cooking oil.

Abstract: An integrated circuit chip has a substrate, an acoustic wave sensor, and a trimming element. The acoustic wave sensor is formed on the substrate, the trimming element is formed on the substrate, and the trimming element is coupled to the acoustic wave sensor so as to trim the acoustic wave sensor when the trimming element is adjusted. The trimming element, for example, may be a trimming capacitor.

Abstract: A torque sensing system generally includes a torque sensor comprising a torque sensing element configured upon a substrate in association with an antenna for sending and receiving wireless signals. A plurality of electronic controlling components for controlling the torque sensor, wherein the electronic controlling components are configured upon another substrate in association with an antenna for sending and receiving the wireless signals to and from the torque sensor, such that the torque sensor is located on a rotating member in order to generate signals indicative of a torque associated with the rotating member, and wherein the signals are wirelessly transmittable from the torque the via the antenna configured upon the substrate in association with the torque sensor.

Abstract: Devices and methods for acoustically measuring temperature and pressure are disclosed. An illustrative SAW sensor can include an electrode structure that transmits and receives surface acoustic waves along a SAW delay line, a temperature sensor for measuring temperature along a first direction of the SAW delay line, and a pressure sensor for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna that wirelessly transmits and receives RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.

Abstract: A sensor system for dialysis applications includes a plurality of pressure sensors, wherein each pressure sensor can be provided as an LC type sensor, and/or an RLC type sensor. Each sensor among the plurality of pressure sensors can be inductively coupled with a respective antenna among a plurality of antennas for the wireless transmission of pressure data. A dialysis machine is generally connected to the plurality of antennas, wherein the plurality of pressure sensors monitors pressure during operation of the dialysis machine to generate pressure data that is wirelessly transmitted to at least one antenna among the plurality of antennas.

Abstract: A torque sensor system and method. An automotive engine is located opposite a torque converter, such that a shaft extends from the engine and interacts with the torque converter. A target is located between the engine and torque converter. One or more torque sensors can be integrated with one or more position sensors for detecting a position associated with the shaft, wherein the torque sensor(s) and the position sensor(s) are integrated into a single torque sensor package to thereby provide enhanced sensing of the target in association with a rotation of shaft during an actuation of the engine.

Abstract: A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.

Abstract: Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.

Abstract: A disposable pressure sensor includes a substrate and a pressure diaphragm formed upon the substrate. A sensor coil can be provided, comprising a capacitor and an inductor formed on the substrate and surrounded by the pressure diaphragm. The ferrite core is located proximate to the sensor coil, such that when the pressure diaphragm is exposed to a pressure, the diaphragm moves close to the inductor or the capacitor, thereby resulting in a change in the capacitor or the inductor and an indication of pressure. The capacitor can be implanted as an adjustable, trimmable or variable capacitor. The inductor may also be provided as an adjustable or variable inductor and can include the use of a variable capacitor and a PVDF based piezoelectric transducer. When the PVDF layer is under pressure, it can generate an electric field across the interdigital transducer and transmit a signal thereof through an antenna.

Abstract: Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.

Abstract: A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Abstract: In general, a dielectric polymer substrate provided and an antenna formed upon the dielectric polymer substrate. A piezoelectric polymer layer (e.g., a polyvinylidene fluoride (PVDF) piezoelectric film) can be formed above the dielectric polymer substrate. Additionally, an interdigital (IDT) layer can be configured upon the PVDF piezoelectric layer, thereby permitting the piezoelectric polymer layer and the IDT layer to detect pressure data and transmit the data to a receiver via the antenna.

Abstract: Disposable pressure sensor methods and systems are disclosed. A substrate can be provided, along with a capacitor and an inductor fixed to the substrate to form a pressure sensor thereof. In a variable L configuration, the inductor can be configured to comprise an inductor surface and a diaphragm, such that when the diaphragm is exposed to a pressure, the diaphragm moves close to the inductor surface, thereby resulting in an increase in the inductance and a decrease in the resonant frequency associated with the capacitor and the inductor and any associated circuitry. In a variable C configuration, the capacitor can be configured to comprise one electrode on the surface and one on the diaphragm, such that when the diaphragm is exposed to a pressure, the diaphragm moves close to the capacitor surface, thereby resulting in an increase in the capacitance and a decrease in the resonant frequency associated with the capacitor and the inductor and any associated circuitry.

Abstract: A disposable and wireless sensor system and method are disclosed. In general, a pressure diaphragm can be connected to one or more reusable Surface Acoustic Wave (SAW) probe heads, which are associated with an antenna for wirelessly receiving or transmitting signals that excite the reusable SAW probe head only when the reusable SAW head is in contact with the pressure diaphragm. Interrogation electronics can also be provided, which are associated with the reusable SAW probe head. One or more signals can be wirelessly transmitted to the interrogation electronics for exciting the reusable SAW probe head for pressure sensing applications thereof.

Abstract: A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.

Abstract: A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A flanged area or flanged portion can also be connected to the bottom portion of the cover. The flanged area provides a surface for contacting a fixture to which the sensor apparatus attaches and holding the sensor apparatus to the fixture in a manner which prevents the sensor diaphragm from contacting the fixture and inducing errors during sensor operations thereof. The cover also can include a flanged or brim-shaped portion which is connected to and surrounds the bottom portion of the cover. The flanged portion can be positioned parallel to the sensor diaphragm.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.

Abstract: A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Abstract: A pressure and temperature sensor system, the system comprising one or more microstructure temperature-sensing elements formed on a substrate within a hermetically sealed area thereof, wherein such microstructure temperature-sensing elements comprise SAW temperature-sensing elements. Additionally, one or more microstructure pressure-sensing elements can be located above a sensor diaphragm on the substrate, such that the microstructure pressure-sensing element is formed from a SAW pressure-sensing element. One or more contacts can also be provided, which assist in maintaining the hermetically sealed area and which protrude through the substrate for support and electrical interconnection of the pressure and temperature sensor system.

Abstract: An expansion shell assembly for mine roof bolts includes an expansion member threaded onto an associated mine roof bolt. A support device is annularly disposed around the associated roof bolt. An expansion shell is annularly disposed around the associated roof bolt between the expansion member and the support device. The expansion shell has a base ring for engaging the support device and fingers for engaging a peripheral edge of the tapered plug. The engagement between the base ring and the support device permits axial traverse movement of the support device relative to the expansion shell for tensioning the roof bolt.