Abstract: Examples are disclosed that relate to a wearable device configured to physically prevent a user from interacting with an identified hazard. One disclosed example provides a wearable device including a motion-restricting system configured to restrict movement of a skeletal joint when activated, a logic subsystem, and memory storing instructions executable by the logic subsystem to receive sensor data from one or more sensors, based at least on the sensor data received, determine whether the wearable device is likely to be in an unsafe state, and when the wearable device is determined likely to be in the unsafe state, send a control signal to the motion-restricting system to activate the motion-restricting system.

Abstract: Examples are disclosed that relate to integrating electronic functionality into textiles. One example provides an article including a textile, a fabric piping positioned along the textile, an electrical conductor positioned within an interior of the fabric piping, and a first electronic component and a second electronic component disposed on the article and electrically connected by the electrical conductor.

Abstract: Embroidered sensor assemblies are described that are formed on a flexible substrate, such as a suitable fabric material. The embroidered sensors can be configured as a pattern of wires that enable measurement of strain based on positional relationships between nodes formed by the pattern of wires. As a pipe or other object flexes, the positional relationships are altered and can be detected to facilitate computation of strain. Strain can be deduced at each individual node, which can then be used to create a strain profile or map for the object.

Abstract: An electrostatic slide clutch comprises first and second sheet electrodes, a dielectric layer, and a drive circuit. The dielectric layer is arranged between the first and second sheet electrodes. The drive circuit is coupled electrically to the first sheet electrode and to the second sheet electrode and configured to move a variable amount of charge bidirectionally between the first and second sheet electrodes, to influence a normal force between the first and second sheet electrodes.

Abstract: Examples are disclosed that relate to electronically functional yarns. One example provides an electronically functional yarn comprising a core, a sheath at least partially surrounding the core, and an electronic circuit formed on the core. The circuit includes three or more control lines and more than three diode-containing circuit elements controllable by the three or more control lines, each circuit element being controllable via a corresponding set of two of the three or more control lines.

Abstract: User expectations demand that keypad layout and size, as well as keypad performance and illumination remain the same or improve over time. In various implementations, the keyboards disclosed and detailed herein incorporate an array of thermoset bare die light emitting diodes in an effort to more evenly distribute light through a keyboard structure without increasing keyboard thickness, as compared to prior art designs.

Abstract: Examples are disclosed herein that relate to electronically functional textile articles. One example provides a knitted textile article comprising a first conductive thread and a second conductive thread knit into the article in such a manner as to form a conductive junction separated by a gap. The knitted textile article further comprises a knitted surface texture feature formed at a location that defines an opening over the gap, and an electronic component connecting the gap to form a circuit with the first conductive thread and the second conductive thread.

Abstract: Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

Abstract: An example magnetic actuator includes first and second flexible magnetic layers and a control circuit. The first flexible magnetic layer is configured to support a first magnetic dipole. Arranged in slidable contact with the first flexible magnetic layer, the second flexible magnetic layer is configured to support a second magnetic dipole. The control circuit is configured to controllably form at least the first magnetic dipole and thereby modify a force of interaction between the first and second flexible magnetic layers.

Abstract: An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

Abstract: Described herein is a sensor including a sensing electrode structure and a motion-responsive structure in capacitive communication with the sensing electrode structure, the sensing electrode structure and the motion-responsive structure being separated by a first dielectric layer, the motion-responsive structure comprising a liquid metal mass within a matrix in which the liquid metal mass is movable based upon movement of the sensor, and the sensing electrode structure comprising a first electrode, and a second electrode spaced from the first electrode to form a capacitor.

Abstract: A yarn adaptable to incorporation into a textile comprises a core including one or more electrically conductive traces arranged on the core and distributed over at least a portion of the length of the yarn. The yarn also comprises an electrically contactable terminal arranged at a terminus of the one or more conductive traces and a winding wrapped around the core.

Abstract: An electrochemical energy-storage cell comprises a flexible positive electrode and a flexible negative electrode including a gallium-based liquid metal dispersed on a flexible wire mesh. The electrochemical energy-storage cell also comprises a membrane having one face in contact with the flexible positive electrode and an opposing face in contact with the flexible negative electrode.

Abstract: Examples are disclosed that relate to touch sensors formed on fabrics. One example provides a touch sensor including a fabric layer, a first electrode having a conductive ink disposed on the fabric layer, a dielectric structure disposed over the first electrode, the dielectric structure including an electrode support layer and an adhesive layer bonding the electrode support layer to the fabric layer and the first electrode, and the touch sensor also including a second electrode disposed on the electrode support layer.

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

Abstract: Examples are disclosed that relate to providing haptic feedback. One example provides a haptic feedback system comprising a wearable device configured to be worn by a user, the wearable device including a fluidic channel, a fluid disposed within the fluidic channel, the fluid including an adjustable viscosity, a circuit configured to vary a field within the fluidic channel, and a controller. The controller is configured to receive a first input, and in response to receiving the first input, apply a first field within the channel via the circuit to set the adjustable viscosity of the fluid to a first viscosity, and receive a second input, and in response to receiving the second input, apply a second field within the channel via the circuit to set the adjustable viscosity of the fluid to a second viscosity.

Abstract: Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.