Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: A pressure equalization device for installation on or at an entry of an attic of a home or other building is described. The pressure equalization device can be an access panel of an attic access hatch. The access panel is a solid, generally flat panel of material such as wood or plastic. The access panel includes an aperture that passes therethrough. The aperture is covered with an air-permeable cover made from a material such as cloth or plastic mesh. The mesh is constructed to allow air to pass through the aperture between the attic and interior of the building for purposes of equalizing pressure between them. Pores of the mesh are sized so that insects, rodents, and other animals and dust and debris cannot pass through and into the interior of the building.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A pressure equalization device for installation on or at an entry of an attic of a home or other building is described. The pressure equalization device can be an access panel of an attic access hatch. The access panel is a solid, generally flat panel of material such as wood or plastic. The access panel includes an aperture that passes therethrough. The aperture is covered with an air-permeable cover made from a material such as cloth or plastic mesh. The mesh is constructed to allow air to pass through the aperture between the attic and interior of the building for purposes of equalizing pressure between them. Pores of the mesh are sized so that insects, rodents, and other animals and dust and debris cannot pass through and into the interior of the building.

Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: A detachable, self-contained robotic arm system includes: a mounting subsystem configured to releasable engage an operating platform; a robotic arm subsystem coupled to the mounting subsystem; a control subsystem coupled to the mounting subsystem and configured to effectuate movement of the robotic arm assembly; and a connectivity subsystem configured to detachably couple the detachable, self-contained robotic arm system to one or more external systems.

Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: A FET IC structure made using a back-side access process that mitigates or eliminates thermal conductivity problems. In some embodiments, electrically-isolated thermal paths are formed adjacent the FET and configured to conduct heat laterally away from the FET to generally orthogonal thermal pathways, and thence to thermal pads externally accessible at the “top” of the completed IC. In some embodiments having a thermally-conductive handle wafer, electrically-isolated thermal paths are formed adjacent a FET and configured to conduct heat laterally away from the FET. Thermal vias are formed sufficiently so as to be in thermal contact with the handle wafer and with the conventional metallization layers of the device superstructure, at least one of which is in thermal contact with the lateral thermal paths. In some embodiments, the lateral thermal paths may use dummy gates configured to conduct heat laterally away from a FET to generally orthogonal thermal pathways.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A method is provided. The method includes printing a target on a medium and defining at least one intended cutting line on the medium. The target includes at least one graphical element which defines at least one reference distance measure. The target is centered at the intended cutting line or has a defined distance to the intended cutting line.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A method is provided. The method includes printing a target on a medium and defining at least one intended cutting line on the medium. The target includes at least one graphical element which defines at least one reference distance measure. The target is centered at the intended cutting line or has a defined distance to the intended cutting line.

Abstract: An improved sample tube that includes a body portion having a longitudinal axis and a wall generally circumscribing the longitudinal axis. The body portion terminates in a distal tip having a dimple. The body portion includes at least one transparent portion (e.g., at the distal tip) that is adapted for transmitting light. The wail is configured for elastic deformation along at feast a portion of its length, including in a direction that is generally transverse to the longitudinal axis, so that it compressively and resiliently deforms and engages a wail defining an opening in a sample block of a PGR amplification instrument. The tube may be made by injection molding a polymeric material including a thermoplastic.

Abstract: A mounting device for a flat panel monitor. The mounting device comprises a front panel and a mating second rear panel for connection with one another to form a housing. At least the front panel has a plurality of mounting apertures therein for securing the housing to a desired flat panel monitor while the rear panel has a mounting mechanism which facilitates attachment of the housing to a desired support surface. An internal recess is formed between the front panel and the rear panel, when assembled with one another, and the internal recess is sized for accommodating and retaining at least one peripheral electronic device therein.

Abstract: An improved device and system for facilitating polymerase chain reaction including a light source, detector, waveguide, and filters that occupy minimal space and facilitate detection of stationary samples, reduced sample read time, and simultaneous reading of multiple light wavelengths.

Abstract: A mounting device for a flat panel monitor. The mounting device comprises a front panel and a mating second rear panel for connection with one another to form a housing. At least the front panel has a plurality of mounting apertures therein for securing the housing to a desired flat panel monitor while the rear panel has a mounting mechanism which facilitates attachment of the housing to a desired support surface. An internal recess is formed between the front panel and the rear panel, when assembled with one another, and the internal recess is sized for accommodating and retaining at least one peripheral electronic device therein.