Patents by Inventor James E. Boyle

James E. Boyle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040197974
    Abstract: A process for hydrogen annealing silicon wafers that have been cut from an ingot and polished on both sides, thereby removing crystal originated pits (COPs) in their surface. The wafers are then stacked in a tower having at least support surfaces made from virgin polysilicon, that is, polysilicon form by chemical vapor deposition, preferably from monosilane. The tower may include four virgin polysilicon legs have support teeth slotted at inclined angles along the legs and fixed at their opposed ends to bases. The wafers so supported on the virgin polysilicon towers are annealed in a hydrogen ambient at 1250° C. for 12 hours.
    Type: Application
    Filed: April 22, 2004
    Publication date: October 7, 2004
    Inventors: Raanan Y. Zehavi, James E. Boyle, Laurence D. Delaney
  • Publication number: 20040129203
    Abstract: Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.
    Type: Application
    Filed: August 15, 2003
    Publication date: July 8, 2004
    Inventors: Raanan Zehavi, James E. Boyle, Robert W. Mytton
  • Patent number: 6727191
    Abstract: A process for hydrogen annealing silicon wafers that have been cut from an ingot and polished on both sides, thereby removing crystal originated pits (COPs) in their surface. The wafers are then stacked in a tower having at least support surfaces made from virgin polysilicon, that is, polysilicon form by chemical vapor deposition, preferably from monosilane. The tower may include four virgin polysilicon legs have support teeth slotted along the legs and fixed at their opposed ends to bases. The wafers are supported at four equally distributed points at 0.707 of the wafer radius. The wafers so supported on the virgin polysilicon towers are annealed in a hydrogen ambient at 1250° C. for 12 hours.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: April 27, 2004
    Assignee: Integrated Materials, Inc.
    Inventors: Raanan Y. Zehavi, James E. Boyle, Laurence D. Delaney
  • Publication number: 20040040885
    Abstract: A silicon tower for removably supporting a plurality of silicon wafers during thermal processing. A tower includes plural silicon legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. Preferably, the teeth incline upwardly at 1-3° and have horizontal support areas polished on their ends. Preferably, the legs are machined from virgin polysilicon formed by chemical vapor deposition from silane. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts. Virgin polysilicon is preferably annealed to above 1025° C. before machining. Silicon parts may be joined by applying a spin-on glass between the parts and annealing the assembly.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 4, 2004
    Inventors: James E. Boyle, Robert L. Davis, Laurence D. Delaney, Raanan Y. Zehavi
  • Patent number: 6617225
    Abstract: A method of fabricating parts of silicon, preferably virgin polysilicon formed by chemical vapor deposition of silane, and assembling them into a complex structure, such as a silicon tower or boat for removably supporting a plurality of silicon wafers during thermal processing. The virgin polysilicon is annealed to above 1025° C. before it is machined into a predetermined shape. After machining, the silicon parts are annealed in an oxygen ambient. The machined parts are then assembled and joined together followed by another anneal of the assembled structure. A preferred embodiment of the tower includes four legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts.
    Type: Grant
    Filed: August 22, 2002
    Date of Patent: September 9, 2003
    Assignee: Integrated Materials, Inc.
    Inventors: James E. Boyle, Robert L. Davis, Laurence D. Delaney, Raanan Y. Zehavi
  • Publication number: 20030003686
    Abstract: A method of fabricating parts of silicon, preferably virgin polysilicon formed by chemical vapor deposition of silane, and assembling them into a complex structure, such as a silicon tower or boat for removably supporting a plurality of silicon wafers during thermal processing. The virgin polysilicon is annealed to above 1025° C. before it is machined into a predetermined shape. After machining, the silicon parts are annealed in an oxygen ambient. The machined parts are then assembled and joined together followed by another anneal of the assembled structure. A preferred embodiment of the tower includes four legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts.
    Type: Application
    Filed: August 22, 2002
    Publication date: January 2, 2003
    Inventors: James E. Boyle, Robert L. Davis, Laurence D. Delaney, Raanan Y. Zehavi
  • Publication number: 20020170487
    Abstract: A silicon-based wafer support tower particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. Tubular silicon members are advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.
    Type: Application
    Filed: September 26, 2001
    Publication date: November 21, 2002
    Inventors: Raanan Zehavi, James E. Boyle, Robert W. Mytton
  • Publication number: 20020170486
    Abstract: A silicon-based wafer support tower particularly useful for batch-mode thermal chemical vapor deposition. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. The surface roughness may be in the range of 250 to 2500 &mgr;m. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. Tubular silicon members are advantageously formed by extrusion from a silicon melt.
    Type: Application
    Filed: May 18, 2001
    Publication date: November 21, 2002
    Inventors: Ranaan Y. Zehavi, James E. Boyle
  • Patent number: 6455395
    Abstract: A method of fabricating the parts and assembling them into a complex structure, such as a silicon tower or boat for removably supporting a plurality of silicon wafers during thermal processing. A preferred embodiment of the tower includes four legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. The legs preferably have a rounded wedge shape with a curved front surface of small radius cut with the slots and a back surface that is either flat or curved with a substantially larger radius. Preferably, the legs are machined from virgin polysilicon formed by chemical vapor deposition from silane. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts. Virgin polysilicon is preferably annealed to above 1025° C. before machining. Silicon parts may be joined by applying a spin-on glass between the parts and annealing the assembly.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: September 24, 2002
    Assignee: Integrated Materials, Inc.
    Inventors: James E. Boyle, Robert L. Davis, Laurence D. Delaney, Raanan Y. Zehavi
  • Patent number: 6450346
    Abstract: A silicon tower or boat for removably supporting a plurality of silicon wafers during thermal processing. A preferred embodiment of the tower includes four legs secured on their ends to two bases. A plurality of slots are cut in the legs allowing slidable insertion of the wafers and support for them. The legs preferably have a rounded wedge shape with a curved front surface of small radius cut with the slots and a back surface that is either flat or curved with a substantially larger radius. Preferably, the legs are machined from virgin polysilicon formed by chemical vapor deposition from silane. The bases may be either virgin poly or monocrystalline silicon and be either integral or composed of multiple parts. Virgin polysilicon is preferably annealed to above 1025° C. before machining. Silicon parts may be joined by applying a spin-on glass between the parts and annealing the assembly. After assembly, the surface of a tower is subjected to sub-surface working.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: September 17, 2002
    Assignee: Integrated Materials, Inc.
    Inventors: James E. Boyle, Robert L. Davis, Laurence D. Delaney, Raanan Y. Zehavi
  • Publication number: 20020119641
    Abstract: A process for hydrogen annealing silicon wafers that have been cut from an ingot and polished on both sides, thereby removing crystal originated pits (COPs) in their surface. The wafers are then stacked in a tower having at least support surfaces made from virgin polysilicon, that is, polysilicon form by chemical vapor deposition, preferably from monosilane. The tower may include four virgin polysilicon legs have support teeth slotted along the legs and fixed at their opposed ends to bases. The wafers are supported at four equally distributed points at 0.707 of the wafer radius. The wafers so supported on the virgin polysilicon towers are annealed in a hydrogen ambient at 1250° C. for 12 hours.
    Type: Application
    Filed: February 26, 2001
    Publication date: August 29, 2002
    Inventors: Raanan Y. Zehavi, James E. Boyle, Laurence D. Delaney