Abstract: In accordance with an embodiment, a method of examining contents of objects comprises accelerating a plurality of electrons to a predetermined acceleration energy and colliding the accelerated electrons with a target. An object is scanned with the generated X-ray photons. First energies of X-ray photons are determined after scanning and second energies of accelerated electrons are determined after colliding with the target, and correlated. Energies of respective detected X-ray photons prior to scanning are determined based, at least in part, on the second energies of respective correlated accelerated electrons and the predetermined acceleration energy. A potential presence of suspect material is determined based, at least in part, on the first energies of respective X-ray photons after scanning and the third energies of the detected X-ray photons prior to scanning. Systems are also disclosed.

Abstract: A method of manufacturing a radiation source in one example comprises selecting at least one of a target, a collimator, and target shielding consisting essentially of at least one isotope having a neutron production threshold less than a peak acceleration energy of the source, and assembling the source including the selected material.

Abstract: In one example, a radiation source comprises a housing and an acceleration chamber within the housing, with a peak acceleration energy greater than the lowest neutron production threshold of tantalum. A source of charged particles is supported by the housing to emit charged particles into the acceleration chamber. A target is supported by the housing downstream of the acceleration chamber. The target consists essentially of at least one isotope having a neutron production threshold greater than the peak acceleration energy. No neutrons are therefore generated. The source may also comprise a collimator, target shielding, and/or housing shielding comprising at least one isotope having a neutron production threshold greater than the peak acceleration energy, reducing or eliminating neutron generation as compared to the prior art, as well. Systems comprising the source, methods of operation of the source, and methods of manufacture of the source are also disclosed.

Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

Abstract: In accordance with an embodiment, a method of examining contents of an object is disclosed comprising conducting a first examination of an object, checking for the presence of delayed neutrons if the first examination indicates that suspect material is present, and determining whether the object contains nuclear material based, at least in part, on the check. The first examination may comprise a manual examination and scanning of the object to form an image, for example. The first examination may also comprise scanning of the object at two different radiation energies, calculating a function of the energy detected at the two radiation energies, and determining whether the object at least potentially contains suspect material based, at least in part, on the comparison. Systems are also disclosed.

Abstract: The invention involves systems to channel the air available for cooling inside the chassis of the computing device to force the air into selected channels in the memory bank (i.e., between the modules rather than around the modules or some other path of least resistance). This tunneled cooling (or collimated cooling) is made possible by using a set of baffles (or apertures) placed upstream of and between the cooling air supply and the memory bank area to force air to go only through the rectangular space available between adjacent modules in the memory bank of the high speed computing machines (super computers or blade servers in these cases). In some instances, it may be desirable to include both a blower fan, for forcing cool air through the baffles and through the heat exchanger(s) aligned with openings in the baffles, and a suction fan to draw or pull air as it exits the rear of the blade server chassis.

Abstract: A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract: In one example, a radiation scanning system and method rotates a cargo conveyance after removal from a ship for proper orientation with respect to a scanning source and detector, for scanning. A movable carriage may be provided on a crane system, to rotate the cargo conveyance. A rotating flywheel on the carriage rotates in a direction opposite the direction of rotation of the cargo conveyance, to counterbalance angular momentum generated by the rotating conveyance, to avoid or minimize twisting of the carriage. Feedback is provided to control the rotation of the flywheel. Once the cargo conveyance is in the predetermined position, the conveyance is moved between the radiation source and detector for scanning by a vertically extending radiation beam.

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract: A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit bonded to at least one of the planar members over at least a portion of each of their respective surfaces; and, electrodes on the module configured to be accessible to an external socket after the frame is closed. A method for making a thin multichip module comprises the steps of: a. attaching integrated circuit chips to a flex circuit; b. bonding the flex circuit to a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed structure; and, c. folding the frame approximately 180° about the fold axis.

Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

Abstract: A socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, at least two fluid connections configured to matably engage corresponding fluid connections on the in-line module, whereby fluid may be circulated into and out of the module while maintaining electrical continuity between the pins and the contacts. Alternatively, a socket for in-line circuit modules comprises: at least one row of electrical pins configured to matably engage corresponding contacts on the in-line module; and, a fluid connection configured to matably engage a corresponding fluid connection on the in-line module, whereby fluid may be introduced into the module through the socket and vented elsewhere while maintaining electrical continuity between the pins and the contacts.

Abstract: A thin multichip module comprises: a frame comprising a recessed cavity; a flexible circuit having a plurality of integrated circuit chips disposed thereon, the flexible circuit bonded to the frame over at least a portion of the cavity; and the chips enclosed within the cavity by the flexible circuit; and, electrodes on the module configured to be accessible to an external socket after the frame is inserted in the module.

Abstract: A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.

Abstract: A radiation source is disclosed comprising a source of charged particles that travel along a path. Target material lies along the path to generate radiation upon impact by the beam. A magnet is provided to deflect the beam prior to impacting the target. The magnet may generate a time-varying magnetic field or a constant magnetic field. A constant magnetic field may be varied spatially across the beam. The magnet may be an electromagnet or a permanent magnet. In one example, deflection of the beam results in impact of the beam on the target along a plurality of axes. In another example, portions of the beam are differentially deflected. The source may thereby irradiate an object to be scanned with more uniform radiation. The charged particles may be electrons or protons and the radiation may be X-ray or gamma ray radiation, or neutrons. Scanning systems incorporating such sources, methods of generating radiation and methods of examining objects are disclosed, as well.

Abstract: A radiation source is disclosed comprising a source of charged particles that travel along a path. Target material lies along the path to generate radiation upon impact by the beam. A magnet is provided to deflect the beam prior to impacting the target. The magnet may generate a time-varying magnetic field or a constant magnetic field. A constant magnetic field may be varied spatially across the beam. The magnet may be an electromagnet or a permanent magnet. In one example, deflection of the beam results in impact of the beam on the target along a plurality of axes. In another example, portions of the beam are differentially deflected. The source may thereby irradiate an object to be scanned with more uniform radiation. The charged particles may be electrons or protons and the radiation may be X-ray or gamma ray radiation, or neutrons. Scanning systems incorporating such sources, methods of generating radiation and methods of examining objects are disclosed, as well.

Abstract: A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Card includes one or more slots for receiving PC Card modules. PC Card slot openings are located on the narrow back end of the PC Card opposite the PCMCIA adapter, or alternatively are located on the wide end of the PC Card. In the preferred embodiment, the PC Card includes an internal module connector having connectors on either side. The PC Card modules are removably inserted into one of the one or more slots and connect to the module connector contacts on the module connector within the PC Card. In one embodiment, the PC Card includes a rotating cam which is turned to connect the module connector contacts on the module connector within the PC Card to the contacts on the removable PC Card module.

Abstract: A modular and user configurable PC Card which removably receives one or more add-in modules that provide selected functionality. The user inserts and removes selected modules in the PC Card to configure the PC Card to the desired functionality. The PC Card includes one or more slots for receiving PC Card modules. PC Card slot openings are located on the narrow back end of the PC Card opposite the PCMCIA adapter, or alternatively are located on the wide end of the PC Card. In the preferred embodiment, the PC Card includes an internal module connector having connectors on either side. The PC Card modules are removably inserted into one of the one or more slots and connect to the module connector contacts on the module connector within the PC Card. In one embodiment, the PC Card includes a rotating cam which is turned to connect the module connector contacts on the module connector within the PC Card to the contacts on the removable PC Card module.

Abstract: The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened.