Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved multichip semiconductor module compatible with existing SIMM memory sockets comprising a molded module frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly or subassembly(s) comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the subassembly(s) includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate sub-assembly includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components.

Abstract: A portable device for removing and collecting dust, particularly from vehicle friction brake and clutch assemblies, comprises a base having a high efficiency filter and vacuum assembly, a transparent evacuation hood designed to surround the brake or clutch, a vacuum hose for removing contaminated air from the hood to the base, and adjustable means for disposing the hood at variable heights above the base. The filter and vacuum assembly, which may serve as a stand alone unit having application outside the automotive field, is oriented such that a disposable filter is located in a compartment upstream of the vacuum motors and may be removed from the base while the vacuum motors are running, thereby preventing dispersal of hazardous materials during the filter changing operation. Apertures provided in the hood include two gloved portals for allowing a worker's hands and arms to have unimpeded access to the brake and clutch assemblies. A highly portable embodiment includes an inflatable hood.

Abstract: A connecting apparatus for electrically connecting memory modules (RAM or ROM) to a printed circuit board (PCB) of a digital electronic computer is disclosed. The apparatus may be used for edge-wise connection of a number of single in-line memory modules (SIMM, a trademark of the present assignee) to the PCB. The apparatus includes the ability to mount multiple memory modules on a single connecting apparatus, and means for electrically selecting a data transfer with one memory module or another on the apparatus. Guide posts of different cross-sectional areas on each side of the apparatus, and longer than various contact pins protruding through the base of the apparatus are provided, so that the mounting of the apparatus on the PCB is polarized. The guide posts also allow for both through-hole and surface mounting of the apparatus. Additionally, securing pegs on the apparatus are inserted into correspondingly sized holes on the memory modules to prevent vertical movement of the memory modules when connected.

Abstract: A portable device for removing and collecting dust, particularly from vehicle friction brake and clutch assemblies, comprises a base having a high efficiency filter and vacuum assembly, a transparent evacuation hood designed to surround the brake or clutch, a vacuum hose for removing contaminated air from the hood to the base, and adjustable means for disposing the hood at variable heights above the base. The filter and vacuum assembly, which may serve as a stand alone unit having application outside the automotive field, is oriented such that a disposable filter is located in a compartment upstream of the vacuum motors and may be removed from the base while the vacuum motors are running, thereby preventing dispersal of hazardous materials during the filter changing operation. Apertures provided in the hood include two gloved portals for allowing a worker's hands and arms to have unimpeded access to the brake and clutch assemblies. A highly portable embodiment includes an inflatable hood.

Abstract: What is disclosed is a memory module to and from which multibit binary words are stored and read out. Each multibit binary word comprises a standard byte size and one or more other memory bits that may be used for purposes such as parity checking. The modules may be mounted on a printed circuit mother board from which power, control signals and binary words are applied to and taken from the module.

Abstract: What is disclosed is a memory module to and from which multibit binary words are stored and read out. Each multibit binary word comprises a standard word size and another memory bit that may be used for purposes such as parity checking. The modules may be mounted on a printed circuit mother board from which power, control signals and binary words are applied to and taken from the module.