Patents by Inventor James H. Duvall
James H. Duvall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10896828Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: June 8, 2020Date of Patent: January 19, 2021Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20200303217Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10741420Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: September 20, 2018Date of Patent: August 11, 2020Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE
Publication number: 20200200800Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall -
Patent number: 10406568Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: March 1, 2019Date of Patent: September 10, 2019Assignee: International Test Solutions, Inc.Inventors: Alan Humphrey, Jerry Broz, James H. Duvall
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Publication number: 20190201944Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: ApplicationFiled: March 1, 2019Publication date: July 4, 2019Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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Patent number: 10239099Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: November 20, 2017Date of Patent: March 26, 2019Assignee: International Test Solutions, Inc.Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
Patent number: 10195648Abstract: A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.Type: GrantFiled: July 28, 2014Date of Patent: February 5, 2019Assignee: International Test Solutions, Inc.Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall -
Publication number: 20190019694Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: September 20, 2018Publication date: January 17, 2019Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10109504Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: January 30, 2017Date of Patent: October 23, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 10002776Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: December 21, 2012Date of Patent: June 19, 2018Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Publication number: 20180071798Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: ApplicationFiled: November 20, 2017Publication date: March 15, 2018Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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Patent number: 9833818Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: GrantFiled: August 7, 2013Date of Patent: December 5, 2017Assignee: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Alan E. Humphrey, Jerry J. Broz, James H. Duvall
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Publication number: 20170136500Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: January 30, 2017Publication date: May 18, 2017Applicant: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 9595456Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: GrantFiled: August 20, 2013Date of Patent: March 14, 2017Assignee: International Test Solutions, Inc.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz
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Patent number: 9023553Abstract: A multilayered membrane for use with fuel cells and related applications. The multilayered membrane includes a carrier film, at least one layer of an undoped conductive polymer electrolyte material applied onto the carrier film, and at least one layer of a conductive polymer electrolyte material applied onto the adjacent layer of polymer electrolyte material. Each layer of conductive polymer electrolyte material is doped with a plurality of nanoparticles. Each layer of undoped electrolyte material and doped electrolyte material may be applied in an alternating configuration, or alternatively, adjacent layers of doped conductive polymer electrolyte material is employed.Type: GrantFiled: September 3, 2008Date of Patent: May 5, 2015Assignee: Chemsultants International, Inc.Inventors: Pasco R. Santurri, James H. Duvall, Denise M. Katona, Joseph T. Mausar, Berryinne Decker
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Publication number: 20140338698Abstract: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.Type: ApplicationFiled: August 7, 2013Publication date: November 20, 2014Applicant: International Test Solutions, Inc.Inventors: Alan Eugene Humphrey, Jerry J. Broz, James H. Duvall
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APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE
Publication number: 20140331421Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.Type: ApplicationFiled: July 28, 2014Publication date: November 13, 2014Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall -
Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
Patent number: 8801869Abstract: A cleaning device for cleaning pin contact elements and support hardware in a semiconductor testing apparatus that has a cleaning layer with a predetermined configuration appropriate for the particular pin contact elements and a substrate having a configuration to be introduced into the testing apparatus during the normal testing operating of the testing apparatus. The cleaning layer secured to the substrate has predetermined characteristics that cause the pad to clean debris the pin contact elements and support hardware when the pin contact elements and support hardware contact the pad during the normal operation of the testing machine.Type: GrantFiled: November 4, 2011Date of Patent: August 12, 2014Assignee: International Test Solutions, Inc.Inventors: Jerry J. Broz, Bret A. Humphrey, Alan E. Humphrey, James H. Duvall -
Publication number: 20130333128Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.Type: ApplicationFiled: August 20, 2013Publication date: December 19, 2013Applicant: INTERNATIONAL TEST SOLUTIONS, INC.Inventors: Alan E. Humphrey, James H. Duvall, Jerry Broz