Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.

Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

Abstract: A medium for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, while it is still in manual, semi-automated, and automated handling device and the electrical test equipment is disclosed so that the functionality and performance of the individual die or IC package may be electrically evaluated.

Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing equipment. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, or projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as in an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can be adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may made by a novel method of making, and it may then be used in a novel method of use in combination with chip manufacturing apparatus.

Abstract: A multilayered membrane for use with fuel cells and related applications. The multilayered membrane includes a carrier film, at least one layer of an undoped conductive polymer electrolyte material applied onto the carrier film, and at least one layer of a conductive polymer electrolyte material applied onto the adjacent layer of polymer electrolyte material. Each layer of conductive polymer electrolyte material is doped with a plurality of nanoparticles. Each layer of undoped electrolyte material and doped electrolyte material may be applied in an alternating configuration, or alternatively, adjacent layers of doped conductive polymer electrolyte material is employed.

Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.

Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.

Abstract: A flexible pressure-sensitive food grade wrap film, and a process for manufacturing the film. The film includes a substrate overcoated with a pressure-sensitive adhesive, a release overprinted on the adhesive that prevents the adhesive from clinging to the surface of an article or to itself without applying pressure, and, optionally, a release coating on the opposite side of the substrate. Once pressure is applied to the film, the film flexibility allows the adhesive to contact the surface of the article or itself and subsequently adhere to hold the film in place or to form a sealed pouch around an article. The pressure-activated contact and adhesion to an article or to itself are designed to form a tight, spill-resistant physical bond that seals liquid or solid contents in a container, or forms a sealed pouch around a solid article.

Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.

Abstract: A flexible pressure-sensitive food grade wrap film, and a process for manufacturing the film. The film includes a substrate overcoated with a pressure-sensitive adhesive, a release overprinted on the adhesive that prevents the adhesive from clinging to the surface of an article or to itself without applying pressure, and, optionally, a release coating on the opposite side of the substrate. Once pressure is applied to the film, the film flexibility allows the adhesive to contact the surface of the article or itself and subsequently adhere to hold the film in place or to form a sealed pouch around an article. The pressure-activated contact and adhesion to an article or to itself are designed to form a tight, spill-resistant physical bond that seals liquid or solid contents in a container, or forms a sealed pouch around a solid article.

Abstract: A thermal interface material (A) transfers heat from a heat source (12), such as a microprocessor, to a heat sink (14) for maintaining the microprocessor at a safe operating temperature. The interface material includes thermally conductive filler particles dispersed in a phase change material. The phase change material softens and flows at the operating temperature of the heat source, thereby providing good thermal contact with uneven surfaces of the heat source and heat sink, without excessive exudation and loss of the interface material. The phase change material includes a polymer component, such as an elastomer, and a melting point component, which adjusts the softening temperature of the phase change material to the operating temperature of the heat source.