Patents by Inventor James Hu
James Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200143269Abstract: A method for determining a travel destination from user generated content is proposed. The method includes determining a text string in the user generated content that indicates a place or an address. Further, the method includes determining a plurality of potential travel destinations based on the text string. The method additionally includes determining similarities between the plurality of potential travel destinations and a plurality of reference positions assigned to the user, and ranking the plurality of potential travel destinations based on the similarities.Type: ApplicationFiled: January 8, 2020Publication date: May 7, 2020Inventors: Yang CAO, Alvin CHIN, Michael GORELIK, James HU, Qing LI, Jilei TIAN
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Patent number: 10594657Abstract: Methods, non-transitory computer readable media, network traffic management apparatuses, and network traffic management systems that provide parameterized sub-policy evaluation for fine grain access control implemented by determining when there is a result for one of the plurality of sub-policies being evaluated for a received request for a resource during a session. The result for evaluation of the one of the plurality of sub-policies for the received request is used when the determination indicates the result is stored for the session. The one of the plurality of sub-policies is executed on the received request to obtain the result when the determination indicates the result is not stored for the session. The result for the one of the plurality of sub-policies from this execution is stored for the session.Type: GrantFiled: September 27, 2017Date of Patent: March 17, 2020Assignee: F5 Networks, Inc.Inventors: Vinod Pisharody, James Hu, Wui Chung Lie, Bipin Kumar
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Patent number: 10534353Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.Type: GrantFiled: October 3, 2013Date of Patent: January 14, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-Fa Lu, Cheng-Ting Chen, James Hu, Chung-Shi Liu
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Patent number: 10488398Abstract: A chemical impairment detection system adaptable for use in a vehicle. The impairment detection system includes an intake adapted to receive an air sample from a source and an alcohol sensor for detecting an alcohol level in the air sample. An integrated breath chamber channels the air sample from the intake to the alcohol sensor. Source evaluator means in the breath chamber measure one or more characteristics of the received air sample for validating the sample. The source evaluator means measures the air sample characteristics as the air sample flows through the breath chamber.Type: GrantFiled: December 17, 2015Date of Patent: November 26, 2019Assignee: #1 A LifeSafer, Inc.Inventors: Nicholas M. Trainor, Louis Urani, James Hu, Jeffrey Vatter, Scott A. Galvin, David Hamo, William H. Collins, James Dunn
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Patent number: 10109618Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.Type: GrantFiled: June 21, 2017Date of Patent: October 23, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: James Hu, Ming-Da Cheng, Chung-Shi Liu
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Patent number: 9879823Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.Type: GrantFiled: December 29, 2015Date of Patent: January 30, 2018Assignee: Hand Held Products, Inc.Inventors: Mark Lee Oberpriller, Robert Bruffey, Marcus Charles Phillips, James Hu
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Publication number: 20170287890Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.Type: ApplicationFiled: June 21, 2017Publication date: October 5, 2017Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: James HU, Ming-Da CHENG, Chung-Shi LIU
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Patent number: 9691745Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.Type: GrantFiled: June 26, 2013Date of Patent: June 27, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: James Hu, Ming-Da Cheng, Chung-Shi Liu
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Publication number: 20170176411Abstract: A chemical impairment detection system adaptable for use in a vehicle. The impairment detection system includes an intake adapted to receive an air sample from a source and an alcohol sensor for detecting an alcohol level in the air sample. An integrated breath chamber channels the air sample from the intake to the alcohol sensor. Source evaluator means in the breath chamber measure one or more characteristics of the received air sample for validating the sample. The source evaluator means measures the air sample characteristics as the air sample flows through the breath chamber.Type: ApplicationFiled: December 17, 2015Publication date: June 22, 2017Inventors: Nicholas M. Trainor, Louis Urani, James Hu, Jeffrey Vatter, Scott A. Galvin, David Hamo, William H. Collins, James Dunn
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Publication number: 20160186926Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.Type: ApplicationFiled: December 29, 2015Publication date: June 30, 2016Inventors: Mark Lee Oberpriller, Robert Bruffey, Marcus Charles Phillips, James Hu
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Patent number: 8989045Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.Type: GrantFiled: November 12, 2004Date of Patent: March 24, 2015Assignee: Brocade Communications Systems, Inc.Inventors: Yi Lin, Eric Andre Warmenhoven, Sundar Poudyal, James Hu
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Publication number: 20150001725Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.Type: ApplicationFiled: June 26, 2013Publication date: January 1, 2015Inventors: James HU, Ming-Da CHENG, Chung-Shi LIU
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Patent number: 8700799Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principal ports in the principal inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principal ports, adopt the merge result of the principal ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.Type: GrantFiled: November 12, 2004Date of Patent: April 15, 2014Assignee: Brocade Communications Systems, Inc.Inventors: Eric Andre Warmenhoven, Yi Lin, Sundar Poudyal, James Hu
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Publication number: 20140039661Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.Type: ApplicationFiled: October 3, 2013Publication date: February 6, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-Fa LU, Cheng-Ting CHEN, James HU, Chung-Shi LIU
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Patent number: 8571699Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.Type: GrantFiled: September 10, 2010Date of Patent: October 29, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Fa Lu, Cheng-Ting Chen, James Hu, Chung-Shi Liu
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Publication number: 20130252034Abstract: A backup power system for industrial plants using purified hydrogen in critical processes. A smart valve at a hydrogen reservoir is used to steal hydrogen and divert the hydrogen to a fuel cell array providing backup power to critical processes. Before the fuel cell array comes online, backup power is provided by a battery array that can also supply backup power as the hydrogen supply is depleted.Type: ApplicationFiled: March 21, 2012Publication date: September 26, 2013Applicant: GO2 POWER, INC.Inventors: James Hu, Sydney Kwan
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Publication number: 20120065764Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.Type: ApplicationFiled: September 10, 2010Publication date: March 15, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-FA LU, Cheng-Ting CHEN, James HU, Chung-Shi LIU
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Patent number: 8107398Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.Type: GrantFiled: August 21, 2009Date of Patent: January 31, 2012Assignee: Brocade Communications Systems, Inc.Inventors: Yi Lin, Eric Andre Warmenhoven, James Hu, Sundar Poudyal
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Publication number: 20090316606Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.Type: ApplicationFiled: August 21, 2009Publication date: December 24, 2009Applicant: BROCADE COMMINICATIONS SYSTEMS, INC.Inventors: YI LIN, ERIC ANDRE WARMENHOVEN, JAMES HU, SUNDAR POUDYAL
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Patent number: 7596100Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.Type: GrantFiled: November 12, 2004Date of Patent: September 29, 2009Assignee: Brocade Communications Systems, Inc.Inventors: Yi Lin, Eric Andre Warmenhoven, James Hu, Sundar Poudyal