Patents by Inventor James Hu

James Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200143269
    Abstract: A method for determining a travel destination from user generated content is proposed. The method includes determining a text string in the user generated content that indicates a place or an address. Further, the method includes determining a plurality of potential travel destinations based on the text string. The method additionally includes determining similarities between the plurality of potential travel destinations and a plurality of reference positions assigned to the user, and ranking the plurality of potential travel destinations based on the similarities.
    Type: Application
    Filed: January 8, 2020
    Publication date: May 7, 2020
    Inventors: Yang CAO, Alvin CHIN, Michael GORELIK, James HU, Qing LI, Jilei TIAN
  • Patent number: 10594657
    Abstract: Methods, non-transitory computer readable media, network traffic management apparatuses, and network traffic management systems that provide parameterized sub-policy evaluation for fine grain access control implemented by determining when there is a result for one of the plurality of sub-policies being evaluated for a received request for a resource during a session. The result for evaluation of the one of the plurality of sub-policies for the received request is used when the determination indicates the result is stored for the session. The one of the plurality of sub-policies is executed on the received request to obtain the result when the determination indicates the result is not stored for the session. The result for the one of the plurality of sub-policies from this execution is stored for the session.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: March 17, 2020
    Assignee: F5 Networks, Inc.
    Inventors: Vinod Pisharody, James Hu, Wui Chung Lie, Bipin Kumar
  • Patent number: 10534353
    Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Fa Lu, Cheng-Ting Chen, James Hu, Chung-Shi Liu
  • Patent number: 10488398
    Abstract: A chemical impairment detection system adaptable for use in a vehicle. The impairment detection system includes an intake adapted to receive an air sample from a source and an alcohol sensor for detecting an alcohol level in the air sample. An integrated breath chamber channels the air sample from the intake to the alcohol sensor. Source evaluator means in the breath chamber measure one or more characteristics of the received air sample for validating the sample. The source evaluator means measures the air sample characteristics as the air sample flows through the breath chamber.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: November 26, 2019
    Assignee: #1 A LifeSafer, Inc.
    Inventors: Nicholas M. Trainor, Louis Urani, James Hu, Jeffrey Vatter, Scott A. Galvin, David Hamo, William H. Collins, James Dunn
  • Patent number: 10109618
    Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: October 23, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: James Hu, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 9879823
    Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: January 30, 2018
    Assignee: Hand Held Products, Inc.
    Inventors: Mark Lee Oberpriller, Robert Bruffey, Marcus Charles Phillips, James Hu
  • Publication number: 20170287890
    Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.
    Type: Application
    Filed: June 21, 2017
    Publication date: October 5, 2017
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: James HU, Ming-Da CHENG, Chung-Shi LIU
  • Patent number: 9691745
    Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: June 27, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: James Hu, Ming-Da Cheng, Chung-Shi Liu
  • Publication number: 20170176411
    Abstract: A chemical impairment detection system adaptable for use in a vehicle. The impairment detection system includes an intake adapted to receive an air sample from a source and an alcohol sensor for detecting an alcohol level in the air sample. An integrated breath chamber channels the air sample from the intake to the alcohol sensor. Source evaluator means in the breath chamber measure one or more characteristics of the received air sample for validating the sample. The source evaluator means measures the air sample characteristics as the air sample flows through the breath chamber.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: Nicholas M. Trainor, Louis Urani, James Hu, Jeffrey Vatter, Scott A. Galvin, David Hamo, William H. Collins, James Dunn
  • Publication number: 20160186926
    Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 30, 2016
    Inventors: Mark Lee Oberpriller, Robert Bruffey, Marcus Charles Phillips, James Hu
  • Patent number: 8989045
    Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 24, 2015
    Assignee: Brocade Communications Systems, Inc.
    Inventors: Yi Lin, Eric Andre Warmenhoven, Sundar Poudyal, James Hu
  • Publication number: 20150001725
    Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 1, 2015
    Inventors: James HU, Ming-Da CHENG, Chung-Shi LIU
  • Patent number: 8700799
    Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principal ports in the principal inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principal ports, adopt the merge result of the principal ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: April 15, 2014
    Assignee: Brocade Communications Systems, Inc.
    Inventors: Eric Andre Warmenhoven, Yi Lin, Sundar Poudyal, James Hu
  • Publication number: 20140039661
    Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.
    Type: Application
    Filed: October 3, 2013
    Publication date: February 6, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Fa LU, Cheng-Ting CHEN, James HU, Chung-Shi LIU
  • Patent number: 8571699
    Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: October 29, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Fa Lu, Cheng-Ting Chen, James Hu, Chung-Shi Liu
  • Publication number: 20130252034
    Abstract: A backup power system for industrial plants using purified hydrogen in critical processes. A smart valve at a hydrogen reservoir is used to steal hydrogen and divert the hydrogen to a fuel cell array providing backup power to critical processes. Before the fuel cell array comes online, backup power is provided by a battery array that can also supply backup power as the hydrogen supply is depleted.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 26, 2013
    Applicant: GO2 POWER, INC.
    Inventors: James Hu, Sydney Kwan
  • Publication number: 20120065764
    Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 15, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-FA LU, Cheng-Ting CHEN, James HU, Chung-Shi LIU
  • Patent number: 8107398
    Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: January 31, 2012
    Assignee: Brocade Communications Systems, Inc.
    Inventors: Yi Lin, Eric Andre Warmenhoven, James Hu, Sundar Poudyal
  • Publication number: 20090316606
    Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 24, 2009
    Applicant: BROCADE COMMINICATIONS SYSTEMS, INC.
    Inventors: YI LIN, ERIC ANDRE WARMENHOVEN, JAMES HU, SUNDAR POUDYAL
  • Patent number: 7596100
    Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: September 29, 2009
    Assignee: Brocade Communications Systems, Inc.
    Inventors: Yi Lin, Eric Andre Warmenhoven, James Hu, Sundar Poudyal