Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.

Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.

Abstract: A semiconductor device package is provided. The semiconductor device package includes a first substrate and a conductive element fared on the first substrate. The conductive element has a recess away from the first substrate, and the recess has a first depth greater than a second depth from a top surface of the conductive element to a center of the conductive element semiconductor device package includes a conductive connector bonded to the conductive element, and a melting point of the conductive element is higher than a melting point of the conductive connector, and the conductive connector is filled into the recess of the conductive element.

Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.

Abstract: A chemical impairment detection system adaptable for use in a vehicle. The impairment detection system includes an intake adapted to receive an air sample from a source and an alcohol sensor for detecting an alcohol level in the air sample. An integrated breath chamber channels the air sample from the intake to the alcohol sensor. Source evaluator means in the breath chamber measure one or more characteristics of the received air sample for validating the sample. The source evaluator means measures the air sample characteristics as the air sample flows through the breath chamber.

Abstract: A method, computer readable medium and apparatus for transmitting signaling information within payload traffic. For example, the method parses a certificate received from a service provider to obtain service imprint information associated with a mobile service, inserts a service control parameter derived from the service imprint information into a packet header, and forwards the packet header within payload traffic to a policy charging and enforcing function.

Abstract: A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial layer, and placing a device die over the sacrificial layer. The Method further includes molding and planarizing the device die and the through-vias, de-bonding the carrier by removing the adhesive layer, and removing the sacrificial layer.

Abstract: A new deployment model enables a seamless migration to LTE (long term evolution)/EPC (Evolved packet core). In addition, an intelligent edge gateway (IEG) supports future distributed architecture and a converged network for service providers. Specifically, the model supports existing data services (e.g. UMTS) and the delivery of LTE services does not affect the existing data services. Moreover, a distributed architecture is employed, such that, local traffic is optimally routed at the edge and backhaul is minimized. The system can also provide support for enhanced Femto cell 3GPP access to a home network.

Abstract: A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

Abstract: A method includes forming an adhesive layer over a carrier, forming a sacrificial layer over the adhesive layer, forming through-vias over the sacrificial layer, and placing a device die over the sacrificial layer. The Method further includes molding and planarizing the device die and the through-vias, de-bonding the carrier by removing the adhesive layer, and removing the sacrificial layer.

Abstract: A reclosable strap assembly includes an elongate strap having a first end including a plurality of engaging segments. A clasp includes a frame that defines a frame opening for receiving the first end. Each of the plurality of engaging segments is sized to create an interference fit between the individual engaging segment and the frame when the individual engaging segment is inserted into the frame opening.

Abstract: A new deployment model enables a seamless migration to LTE (long term evolution)/EPC (Evolved packet core). In addition, an intelligent edge gateway (IEG) supports future distributed architecture and a converged network for service providers. Specifically, the model supports existing data services (e.g. UMTS) and the delivery of LTE services does not affect the existing data services. Moreover, a distributed architecture is employed, such that, local traffic is optimally routed at the edge and backhaul is minimized The system can also provide support for enhanced Femto cell 3GPP access to a home network.

Abstract: An exemplary content engine includes a content gateway configured to analyze and route content requests to a content server. The content server can be a cache server or a mobile content server. The cache server can be configured to receive and store cacheable web content from a controller that is configured to receive the cacheable web content from at least one cacheable web content provider, such as a web server, and route the content to the cache server. The mobile content server can be configured to receive, from the controller, and store the digital media content. The controller can be further configured to receive the digital media content from at least one external content server and route the content to the mobile content server. The content gateway can be further configured to receive non-cacheable web content from at least one non-cacheable web content provider.

Abstract: A new deployment model enables a seamless migration to LTE (long term evolution)/EPC (Evolved packet core). In addition, an intelligent edge gateway (IEG) supports future distributed architecture and a converged network for service providers. Specifically, the model supports existing data services (e.g. UMTS) and the delivery of LTE services does not affect the existing data services. Moreover, a distributed architecture is employed, such that, local traffic is optimally routed at the edge and backhaul is minimized. The system can also provide support for enhanced Femto cell 3GPP access to a home network.

Abstract: A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

Abstract: A new deployment model enables a seamless migration to LTE (long term evolution)/EPC (Evolved packet core). In addition, an intelligent edge gateway (IEG) supports future distributed architecture and a converged network for service providers. Specifically, the model supports existing data services (e.g. UMTS) and the delivery of LTE services does not affect the existing data services. Moreover, a distributed architecture is employed, such that, local traffic is optimally routed at the edge and backhaul is minimized. The system can also provide support for enhanced Femto cell 3GPP access to a home network.

Abstract: Methods, devices and systems for improved zone merge operations are disclosed. Two connected switches are arbitrated as an initiator and a receiver. The merge operation is initiated only by the initiator on an initiator/receiver inter-switch link. The initiator may initiate a merge request and the receiver may perform the computation of the difference between the old and the new zone. Either the whole configuration or only the differences are communicated between the switches. The merges may be done on a connected switch basis, not on a connected port basis. Only the principle ports in the principle inter-switch-link perform the merge operation. All the remaining ports, i.e. the non-principle ports, adopt the merge result of the principle ports. The zone information may also be cached on each switch such that merge calculations need not be performed again when a merge operation with the same configuration occurs in the future.

Abstract: A new deployment model enables a seamless migration to LTE (long term evolution)/EPC (Evolved packet core). In addition, an intelligent edge gateway (IEG) supports future distributed architecture and a converged network for service providers. Specifically, the model supports existing data services (e.g. UMTS) and the delivery of LTE services does not affect the existing data services. Moreover, a distributed architecture is employed, such that, local traffic is optimally routed at the edge and backhaul is minimized. The system can also provide support for enhanced Femto cell 3GPP access to a home network.

Abstract: Embodiments of mechanisms of a semiconductor device package and package on package (PoP) structure are provided. The semiconductor device package includes a substrate and a metal pad formed on the substrate. The semiconductor device package further includes a conductive element formed on the metal pad, and the metal pad electrically contacts the conductive element, and at least a portion of the conductive element is embedded in a molding compound, and the conductive element has a recess configured to provide an additional bonding interfacial area.

Abstract: A policy based service aware engine is provided to dynamically and/or statically provision a traffic navigation processor at a visited network according to service profiles of the home network. The service aware engine thus allows the visited network to gain full knowledge of the service to which a user subscribes, and thus, a user experience consistent with the user's home network can be obtained at the visited network. In various embodiments, the visited network's front-end-processor retrieves or receives service policies from the service aware engine of the home network, and then performs policy-based traffic navigation to intelligently handle and/or backhaul roaming traffic received by the visited network. Thus, the visited network is capable of dynamically classifying incoming roaming traffic and intelligently routing the traffic according to the service characteristics of the traffic flow for each subscriber, e.g.