Abstract: A solderless connector with multiple modes of compliance providing an initial insertion force differing from the secondary insertion force. The connector has multiple compliant members that can be independently adjusted to accommodate a wide range of circuit members. The connector allows the contact members to be arranged with a fine pitch without shorting. The multiple compliant members accommodate a wide range of thermal and vibrational effects, and can be configured to accommodate a wide range of compression distances. An electrically insulative connector housing is positioned substantially between the first and second circuit members. A resilient contact member is positioned generally within the connector housing. The contact member has resilient first and second circuit interface portions. The resilient contact member comprises a first compliant member. At least one end stop is provided for engaging with the contact member in a second mode of compliance.

Abstract: A replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The replaceable chip module includes a module housing has a plurality of device sites each capable of receiving at least one first circuit member. A first connector is located in each of the device sites. The first connector includes one or more first contact members having a first compliant member defining a first circuit interface engageable with the first circuit member, a resilient, dielectric encapsulating material defining a second compliant member surrounding a portion of the first contact member, the first and second compliant members providing a first mode of compliance, and at least one end stop positioned to engage with the first contact member in a second mode of compliance. A second connector is positioned to electrically connect the first connector to the second circuit member.