Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.

Abstract: An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

Abstract: An apparatus for depositing and aligning an amorphous film in a single step, a method of forming an aligned film on a substrate in a single step by combining the deposition and alignment of an alignment layer into a single-step using ion beam processing and an amorphous film having an aligned atomic structure prepared by a method in which an aligned film is deposited and aligned in a single step are provided. The film is deposited and aligned in a single step by bombarding a substrate with an ion beam at a designated incident angle to simultaneously (a) deposit the film onto the substrate and (b) arrange an atomic structure of the film in at least one predetermined aligned direction.

Abstract: A method and apparatus for real-time thermal characterization of a fully operating cooling device (1002). A heat source (1004) is applied to one or more areas on a cooling device (1002) to produce non-uniform heating of the cooling device. Infrared (IR) temperature imaging (1006) detects and measures the thermal distribution of the heat source (1004) on the cooling device (1002) to develop a thermal characterization of the cooling device (1002).

Abstract: A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.

Abstract: A system and method for measuring thermal distributions of an electronic device during operation is disclosed. The system includes an electronic device, a heat sink adjacent to the electronic device and an electrical-insulating layer disposed on the electronic device so as to separate the electronic device and the heat sink. The system further includes a plurality of thermal sensors located on the electrical-insulating layer, each of the plurality of thermal sensors in a different location. The plurality of thermal sensors is located within one or more thin film circuit layers disposed adjacent to the electrical insulating layer. The system further includes a module for receiving thermal information from the plurality of thermal sensors during operation of the electronic device. The system further includes a processor coupled to the module for generating a thermal distribution of the electronic device based on the thermal information received from the plurality of thermal sensors.

Abstract: A system and method for measuring the thermal distributions of an electronic device during operation is described. In an embodiment of the present invention, the system includes a duct adapted to be coupled with an electronic device and a coolant flowing through the duct so as to cool the electronic device. The duct and the coolant are at least partially transparent to photons with wavelengths between about 0.1 micron to 20 microns. The system further includes a photon detector located adjacent to the duct for detecting photons. The photon detector captures thermal information from the electronic device during operation of the electronic device, wherein the electronic device is operating under conditions for which the electronic device is designed. The system further includes a processor coupled to the photon detector for generating a thermal distribution of the electronic device based on information received from the photon detector.

Abstract: Multi-domain liquid crystal cells having twist angles less than 90 degrees, and LCDs containing such liquid crystal cells, are provided. Such liquid crystal cells are stable, particularly at zero and high fields, and provide wide viewing angles. Also provided are methods of using an adjustable particle beam in combination with a mask to generate multi-domains alignments. Such methods are useful for producing liquid crystal cells in general, and for producing the novel multi-domain low twist angle liquid crystal cells of the present invention in particular.