Patents by Inventor James Lay

James Lay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050033531
    Abstract: The system and method for adaptive flow control transmits pause off packets to network nodes after a calculated time based on switch resource usage thereby alleviating congestion is a network switching system.
    Type: Application
    Filed: January 14, 2004
    Publication date: February 10, 2005
    Inventor: Jiann-Jyh (James) Lay
  • Patent number: 6851000
    Abstract: A method of flow control management of data packets in a switch. The method has the steps of determining each time data is being written to memory in order to calculate a memory used amount; determining each time data is being freed from memory in order to calculate a memory freed amount; and calculating how much total memory is being used using the memory freed amount and the memory used amount. A comparison is made comparing the total memory being used to a first predetermined threshold. When the first predetermined threshold is reached a first threshold command is issued indicating that the first predetermined threshold has been reached.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: February 1, 2005
    Assignee: Broadcom Corporation
    Inventor: James Lai
  • Publication number: 20040143447
    Abstract: Apparatus for determining the suitability of products, e.g. consumer products, to an individual comprises storage means storing first data (4) concerning the composition of the products and storage means storing second data (5) concerning the sensitivity of an individual to products or product ingredients, a scanner (1) for scanning markings representative of the products and processing means (3) for identifying a selected product from the scanned marking and providing an indication of the suitability of the identified product to the individual.
    Type: Application
    Filed: July 23, 2003
    Publication date: July 22, 2004
    Inventor: Winston James Lay
  • Patent number: 6521485
    Abstract: A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: February 18, 2003
    Assignee: Walsin Advanced Electronics LTD
    Inventors: Spencer Su, James Lai, Lin Chien-Tsun, Captain Chen, Allen Chen, C.S. Yang, Chang Chao-Chia, Kevin Hsia
  • Publication number: 20020176357
    Abstract: A method of flow control management of data packets in a switch. The method has the steps of determining each time data is being written to memory in order to calculate a memory used amount; determining each time data is being freed from memory in order to calculate a memory freed amount; and calculating how much total memory is being used using the memory freed amount and the memory used amount. A comparison is made comparing the total memory being used to a first predetermined threshold. When the first predetermined threshold is reached a first threshold command is issued indicating that the first predetermined threshold has been reached.
    Type: Application
    Filed: March 16, 2001
    Publication date: November 28, 2002
    Applicant: Altima Communications, Inc.
    Inventor: Jiann-Jyh (James) Lay
  • Publication number: 20020094601
    Abstract: A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the lead frame and the wafer, thus providing inner electrical connection of the wafer after packaging.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Applicant: Walsin Advanced Electronics LTD
    Inventors: Spencer Su, James Lai, Lin Chien-Tsun, Captain Chen, Allen Chen, C.S. Yang, Chang Chao-Chia, Kevin Hsia
  • Publication number: 20020094683
    Abstract: A method for manufacturing a chip size package comprises the steps of: providing a chip having a plurality of bonding pads on its active surface; providing a metal board consisting of the upper layer and the lower layer, wherein, a chip carrier, corresponding to said least chip, being formed on the surface of the upper layer of the said metal board; selectively etching the upper layer of the metal board to form a plurality of redistribution conductive circuits supported by the lower layer of the metal board; securing the chip to the chip carrier of the upper layer of the metal board, and electrically connecting to the conductive circuits; providing a package body (or underfill) in between the chip and the upper layer of the metal board; and, removing the lower layer of the metal board. Thus, package manufactured by applying present invention has ability of securing more electrodes and thinner thickness.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Applicant: Walsin Advanced Electronics LTD
    Inventors: Spencer Su, James Lai, Lin Chien-Tsun, Captain Chen, Allen Chen, C.S. Yang, Chang Chao-Chia, Kevin Hsia
  • Patent number: 6215266
    Abstract: A system for low acoustic noise spindle motor commutation is disclosed. The system contains a control device that generates commutation control signals which cause spindle motor drivers to source or sink current through windings of a spindle motor. The windings create electromagnetic fields which induce rotational movement in a spindle motor rotor. Low acoustic noise snubber devices are coupled to each winding and are dynamically configurable by the control device to provide low spindle motor driver charging current upon initial application of power to the spindle motor, and reduced acoustic noise and back EMF-generated current and voltage surges at the spindle motor driver during spindle motor commutation.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: April 10, 2001
    Assignee: Seagate Technology LLC
    Inventors: Nan Ling Goh, James Lai Kein Chang, Yam Pheng Tham, Utt Heng Kan, Kah Liang Gan
  • Patent number: 6188531
    Abstract: A system, method, and device for sensing temperature during the writing of information onto magnetic media and providing a sufficient write current for that temperature is disclosed. The system comprises a head responsive to a write current for generating a magnetic flux used in writing data onto the magnetic media, a write current source coupled to the head for receiving a write signal and providing write current to the head, and a temperature responsive device coupled to the write current source that senses temperature and provides a write signal whose magnitude is dependent on temperature.
    Type: Grant
    Filed: April 30, 1998
    Date of Patent: February 13, 2001
    Assignee: Seagate Technology LLC
    Inventors: James Lai Kein Chang, Myint Ngwe, Kah Liang Gan, Beng Wee Quak