Abstract: A circuit component having one or more encapsulated circuit elements that are not disposed on a rigid support substrate and a method for manufacturing the circuit component. A semiconductor wafer is disposed on a dicing film and singulated into individual semiconductor chips. The dicing film is stretched and a protective film is placed in contact with the active surfaces of the semiconductor chips. An encapsulating material is formed over the semiconductor chips. The encapsulating material covers the semiconductor chips and the portions of the protective film between the semiconductor chips to form a unitary structure. A support film is coupled to the unitary structure and the protective film is removed. The unitary structure is singulated into individual semiconductor components. Alternatively, multichip circuit components can be manufactured that may include active circuit elements, passive circuit elements, or combinations thereof.