Patents by Inventor James Lupton Hedrick

James Lupton Hedrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5804607
    Abstract: The present invention relates to a process for forming a foamed elastomeric polymer. The process involves forming a reverse emulsion of liquid droplets in a continuous liquid phase of polymer precursor and then polymerizing the precursor to entrap uniformly distributed droplets of the liquid in pores formed in the polymer bulk. The liquid in the pores is then removed under supercritical conditions.
    Type: Grant
    Filed: October 16, 1997
    Date of Patent: September 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey Curtis Hedrick, James Lupton Hedrick, Jons Gunnar Hilborn, Yun-Hsin Liao, Robert Dennis Miller, Da-Yuan Shih
  • Patent number: 5776990
    Abstract: The present invention relates to an insulating foamed polymer having a pore size less than about 1000 .ANG. made from a copolymer comprising a matrix polymer and a thermally decomposable polymer by heating the copolymer above the decomposition temperature of the decomposable polymer.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: July 7, 1998
    Assignee: International Business Machines Corporation
    Inventors: James Lupton Hedrick, Donald Clifford Hofer, Jeffrey William Labadie, Robert Bruce Prime, Thomas Paul Russell
  • Patent number: 5773197
    Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and uncondensed precursor polymer preferably terminated with an alkoxysilyl alkyl group.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: June 30, 1998
    Assignee: International Business Machines Corporation
    Inventors: Kenneth Raymond Carter, James Lupton Hedrick, Robert Dennis Miller
  • Patent number: 5767014
    Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of a hyperbranched polymer and organic polysilica.
    Type: Grant
    Filed: October 28, 1996
    Date of Patent: June 16, 1998
    Assignee: International Business Machines Corporation
    Inventors: Craig Jon Hawker, James Lupton Hedrick, Robert Dennis Miller
  • Patent number: 5756021
    Abstract: The present invention relates to an electronic device for distributing electrical signals between electronic elements comprising a dielectric foamed thermoset polymer having a plurality of electrical circuits.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: May 26, 1998
    Assignee: International Business Machines Corporation
    Inventors: James Lupton Hedrick, Da-Yuan Shih
  • Patent number: 5726211
    Abstract: The present invention relates to a process for forming a foamed elastomeric polymer. The process involves forming a reverse emulsion of liquid droplets in a continuous liquid phase of polymer precursor and then polymerizing the precursor to entrap uniformly distributed droplets of the liquid in pores formed in the polymer bulk. The liquid in the pores is then removed under supercritical conditions.
    Type: Grant
    Filed: March 21, 1996
    Date of Patent: March 10, 1998
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey Curtis Hedrick, James Lupton Hedrick, Jons Gunnar Hilborn, Yun-Hsin Liao, Robert Dennis Miller, Da-Yuan Shih
  • Patent number: 5700844
    Abstract: The invention relates to a process for making a foamed polymer. The process involves (a) dispersing thermally degradable solid particles in polymer precursor; (b) crosslinking the polymer precursor to form a rigid, crosslinked polymer without degrading the particles; and (c) heating the polymer to degrade the particles and form the polymer foam.
    Type: Grant
    Filed: April 9, 1996
    Date of Patent: December 23, 1997
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey Curtis Hedrick, James Lupton Hedrick, Yun-Hsin Liao, Robert Dennis Miller, Da-Yuan Shih
  • Patent number: 5660921
    Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 26, 1997
    Assignee: IBM Corporation
    Inventors: Kie Yeung Ahn, James Lupton Hedrick, Jr., Jeffrey William Labadie, Kang-Wook Lee, Robert James Twieg, Alfred Viehbeck, George Frederick Walker