Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir having a first print material level, and a logic circuitry package including an interface and a logic circuit. The logic circuit may receive, via the interface, a first calibration parameter and receive, via the interface, a first request corresponding to a first sensor ID associated with a second print material level above the first print material level. The logic circuit may transmit, via the interface, a first digital value in response to the first request and receive, via the interface, a second calibration parameter less than the first calibration parameter. The logic circuit may receive, via the interface, a second request corresponding to the first sensor ID, and transmit, via the interface, a second digital value in response to the second request. The second digital value is less than the first digital value.

Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a substrate, a surface layer to contact a print liquid in the print liquid reservoir, and a layer stack including a number of metal layers disposed between the substrate and the surface layer. An array of heater elements disposed in one of the metal layers of the layer stack, and an array of thermal sensors disposed in a different one of the metal layers of the layer stack, each thermal sensor corresponding to a different heater element of the array of heater elements, and each thermal sensor to provide indication of a presence or absence of print liquid based on a sensed temperature after being heated by the corresponding heater element.

Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface including a power terminal and at least one logic circuit. The at least one logic circuit is configured to respond to communications sent to a first address via the interface and respond to communications sent to a second address via the interface. The at least one logic circuit is configured to in response to a first command sent to the first address, draw a first current on the power terminal; and in response to a hibernate command sent to the first address, respond to communications sent to the second address and draw a second current on the power terminal less than the first current.

Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and a logic circuit having a communication address to communicate with the print apparatus logic circuit. The logic circuit is configured to detect, via the interface, communications that include an other communication address. The logic circuit is configured to respond, via the interface, to a command series directed to the logic circuit that include the communication address of the logic circuit, based on the detected communications.

Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.

Abstract: A sensor circuitry package for a replaceable print apparatus component including a plurality of sensing zones, each sensing zone including a number of sensing devices, each sensing device having a respective sensing function, and an array of memory elements, each memory element corresponding to a respective one of the sensing zones. During a sensing operation, the array of memory elements to serially load a segment of select bits, each select bit having one of a select value and a non-select value, a memory element having a select value to select a number of sensing devices of the respective sensing zone to be enabled to perform its respective sensing function.

Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.

Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a number of zones. Each zone includes a number of sets of fluidic devices. Each fluidic device includes a fluid chamber and a fluid actuator disposed in the chamber. Each fluidic device also includes a sensor to sense a characteristic of the zone and an adjustment device. The adjustment device 1) delays a firing signal received from a previous zone as it passes by each set of fluidic devices and 2) adjusts the firing signal as it enters the zone based on a sensed characteristic.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die. A number of fluidic actuators are disposed in a line parallel to the fluid feed holes. A crack detector trace is routed between each of the plurality of fluid feed holes.

Abstract: Examples of an electronic device are described. In some examples, the electronic device includes a first shared line of a plurality of first contacts to respectively connect to a plurality of integrated circuits, a plurality of second lines of respective second contacts to respectively connect to the plurality of integrated circuits, and a third shared line of a plurality of third contacts to respectively connect to the plurality of integrated circuits. In some examples, the electronic device includes circuitry to determine whether one of the third contacts is connected to an integrated circuit based on a state of the first shared line and a state of one of the second lines that is associated with the one of the third contacts.

Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.

Abstract: Example implementations relate to current leakage testing of a fluid ejection die. For example, a fluid ejection die may include plurality of nozzles, each nozzle among the plurality of nozzles including a nozzle sensor and a fluid ejector. The plurality of nozzle sensors may comprise a first subset and a second subset, each nozzle sensor among the plurality of nozzle sensors of the first subset may be electrically coupled to a first control line by a respective switch among a first group of switches, and each nozzle sensor among the plurality of nozzle sensors of the second subset may be electrically coupled to a second control line by a respective switch among a second group of switches. The fluid ejection die may include a control circuit to perform a current leakage test of the plurality of nozzles using the first control line and the second control line.

Abstract: Examples of a fluidic die for thermal zone selection with a sequencer and decoders are described herein. In some examples, the fluidic die includes multiple thermal zones. Each thermal zone includes a temperature sensor, a fluidic actuator and a decoder. The fluidic die also includes shared thermal control circuitry to process an output of the temperature sensor in a selected thermal zone. The fluidic die further includes a sequencer to output a sequence state to select one thermal zone at a time for processing by the shared thermal control circuitry. The decoder of the selected thermal zone decodes the sequence state.

Abstract: Examples of a fluidic die for thermal zone selection with a circular shift register are described herein. In some examples, the fluidic die includes multiple thermal zones. Each thermal zone includes a temperature sensor and a fluidic actuator. The fluidic die also includes shared thermal control circuitry to process an output of the temperature sensor of a selected thermal zone. The fluidic die further includes a circular shift register that includes multiple memory elements. Each memory element is associated with one thermal zone. A token circulates within the circular shift register to select one thermal zone at a time for processing by the shared thermal control circuitry.

Abstract: Examples of a fluidic die for temperature sensing are described herein. In some examples, a fluidic die may include a plurality of thermal sense modules. In some examples, each of the thermal sense modules includes a diode connected between a first switch and a second switch. In some examples, the fluidic die includes a differential amplifier to output a temperature voltage signal. In some examples, a first input of the differential amplifier is connected to the first switch of each of the thermal sense modules and a second input of the differential amplifier is connected to the second switch of each of the thermal sense modules.

Abstract: An integrated circuit for a print component including a number of memory bits. The integrated circuit may include a selection circuit to select at least one memory bit of the number of memory bits and fire actuators of a fire pulse group. The integrated circuit may include a memory voltage regulator to provide a write voltage to the at least one memory bit of the number of memory bits.

Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes to eject fluid received from the plurality of fluid feed holes. The die includes logic circuitry to operate the fluidic actuators, wherein the logic circuitry is disposed on a first side of the plurality of fluid feed holes. Power circuitry to power the plurality of fluidic actuators is disposed on an opposite side of the fluid feed holes from the logic circuitry. Activation traces are disposed between each of the fluid feed holes to couple the logic circuitry to the power circuitry.

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes A number of field-effect transistors are parallel to the fluid feed holes, where each of the fluidic actuators is powered by an associated field effect transistor. Logic circuitry to actuate the plurality of field-effect transistors is disposed on the die on an opposite side of the fluid feed holes from the field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.