Patents by Inventor James Michael Gardner

James Michael Gardner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11400704
    Abstract: An integrated circuit includes thermal tracking logic, control logic, and an output interface. The thermal tracking logic determines a temperature of a fluid ejection die. The control logic defines an emulated parameter of the fluid ejection die as a function of the temperature of the fluid ejection die. The output interface outputs the emulated parameter to a printer system based on the function and the temperature of the fluid ejection die.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: August 2, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John Rossi, Eric D. Ness, James Michael Gardner, Scott A. Linn
  • Patent number: 11390072
    Abstract: A fluidic die includes a number of actuators to eject fluid from the fluidic die. The number of actuators form a number of primitives. The fluidic die includes a plurality of delays within a column of the primitives, and a processing device to control the delays through which a number of activation pulses pass. The activation pulses activate each of the actuators associated with the primitives. The activation pulses are delayed between the primitives via at least one of the delays to reduce peak power demands of the fluidic die.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: July 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A Linn, Eric Martin, Vincent C Korthuis, James Michael Gardner
  • Publication number: 20220219452
    Abstract: A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.
    Type: Application
    Filed: March 28, 2022
    Publication date: July 14, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Michael W. Cumbie
  • Patent number: 11383514
    Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die. A number of fluidic actuators are disposed in a line parallel to the fluid feed holes. A crack detector trace is routed between each of the plurality of fluid feed holes.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: July 12, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Anthony M. Fuller, Scott A. Linn
  • Patent number: 11364716
    Abstract: In an example, a logic circuitry package is configured to be addressable via a first address and at least one second address and comprises a first logic circuit. The first address may be an address for the first logic circuit, and the package may be configured such that, in response to a first command indicative of a first command time period sent to the first address, the package is accessible via at least one second address for a duration of the first command time period; and in response to a second command indicative of a second command time period sent to the first address, the first logic circuit is to, for a duration of the second command time period, disregard traffic sent to the first address.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephen D. Panshin, Jefferson P. Ward, Scott A. Linn, James Michael Gardner
  • Patent number: 11364724
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including a memory storing a reference parameter. The at least one logic circuit is configured to receive, via the interface, a first request sent to a first address to read the reference parameter; and transmit, via the interface, the reference parameter in response to the first request. The at least one logic circuit is configured to receive, via the interface, a second request sent to a second address to implement a task; and implement the task to output a digital value via the interface in response to the second request. The reference parameter corresponds to the digital value.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, David B. Novak
  • Patent number: 11364719
    Abstract: A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Michael W. Cumbie
  • Patent number: 11366913
    Abstract: In an example, a logic circuitry package is configured to communicate with a print apparatus logic circuit. The logic circuitry package may be configured to respond to communications sent to a first address and to at least one second address. The logic circuitry package may comprise a first logic circuit, wherein the first address is an address for the first logic circuit. The package may be configured such that, in response to a first command indicative of a task and a first time period sent to the first address, the package is accessible via at least one second address for a duration of the time period.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephen D. Panshin, Jefferson P. Ward, Scott A. Linn, James Michael Gardner
  • Publication number: 20220176707
    Abstract: A fluid property sensor may comprising an integrated circuit (IC) including a fluid level sensor, and/or a pressure sensor; and an external interface electrically coupled to a proximal end of the EC, wherein the pressure sensor may be configured to measure a flexure of the fluid property sensor.
    Type: Application
    Filed: April 5, 2019
    Publication date: June 9, 2022
    Inventors: Anthony D. STUDER, David N. OLSEN, Michael W. CUMBIE, Chien-Hua CHEN, James Michael GARDNER, Scott A. LINN
  • Patent number: 11351775
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first memory cells, a plurality of first storage elements, and control logic. Each first memory cell stores a customization bit. Each first storage element is coupled to a corresponding first memory cell. The control logic, in response to a reset signal, reads the customization bit stored in each first memory cell and latches each customization bit in a corresponding first storage element.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: 11351791
    Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, James William Ring, David Owen Roethig, Christopher Hans Bakker
  • Patent number: 11345145
    Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays, proximate to a number of fluid feed holes. A number of address lines are disposed proximate to a number of logic circuits on a low-voltage side of the fluid feed holes. An address decoder circuit is coupled to at least a portion of the address lines to select a fluidic actuator in a fluidic actuator array for firing. The address decoder circuit is customized to select a different address for each fluidic actuator in the fluidic actuator array. A logic circuit triggers a driver circuit located in a high-voltage side of the plurality of fluid feed holes opposite the low-voltage side, based, at least in part, on a bit value for the fluidic actuator array, the fluidic actuator selected by the address decoder circuit, and a firing signal.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Scott A. Linn, James Michael Gardner
  • Patent number: 11345159
    Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir and a sensing system including an integrated circuit configured to connect to and communicate over a digital bus. The sensing system includes at least one sensor, a digital controller, an analog to digital converter electrically coupled to the digital controller, and a memory array electrically coupled to the digital controller. The digital controller is configured to generate a clock signal for timing operations of the integrated circuit. The operations include initiating the at least one sensor based on values stored in the memory array and generating outputs of the at least one sensor via the analog to digital converter.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Scott A. Linn, James Michael Gardner
  • Patent number: 11345158
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit to transmit, via the interface, a limit parameter and a count threshold parameter. The logic circuit is to receive, via the interface, initial requests to read sensor IDs with the component connected to the apparatus and the apparatus not pneumatically actuating the component. The logic circuit is to transmit, via the interface, a resting state digital value in response to each initial request. The logic circuit is to receive, via the interface, further requests to read the sensor IDs with the component connected to the apparatus and the apparatus pneumatically actuating the component. The logic circuit is to transmit, via the interface, a further digital value in response to each further request.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Quinton B. Weaver, James Michael Gardner, David N. Olsen, Anthony D. Studer
  • Patent number: 11345157
    Abstract: A logic circuitry package for a replaceable print apparatus component comprises at least one logic circuit and an interface to communicate with a print apparatus logic circuit. The at least one logic circuit is configured to receive, via the interface, calibration parameters including an offset parameter and a sensor ID. The at least one logic circuit is configured to output, via the interface, a digital value corresponding to the sensor ID and offset based on the offset parameter.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sirena Lu, Rogelio Cicili, James Michael Gardner, Scott A. Linn
  • Patent number: 11338586
    Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 24, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony D. Studer, Quinton B. Weaver, David N. Olsen, James Michael Gardner, James William Ring, David Owen Roethig, Christopher Hans Bakker
  • Patent number: 11331909
    Abstract: Examples of a fluidic die for thermal zone selection with a circular shift register are described herein. In some examples, the fluidic die includes multiple thermal zones. Each thermal zone includes a temperature sensor and a fluidic actuator. The fluidic die also includes shared thermal control circuitry to process an output of the temperature sensor of a selected thermal zone. The fluidic die further includes a circular shift register that includes multiple memory elements. Each memory element is associated with one thermal zone. A token circulates within the circular shift register to select one thermal zone at a time for processing by the shared thermal control circuitry.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric T. Martin, James Michael Gardner
  • Patent number: 11331925
    Abstract: A sensor circuit for a replaceable print apparatus component comprises an interface to transmit signals with respect to a print apparatus logic circuit, and further comprises, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell sensor that is nominally different than the other cells.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Jefferson P. Ward, David N. Olsen, Anthony D. Studer, Michael W. Cumbie, Sirena Chi Lu
  • Patent number: 11331924
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit includes a memory storing at least one temperature calculation parameter. The at least one logic circuit is configured to receive, via the interface, a first request to read the at least one temperature calculation parameter; and transmit, via the interface, the at least one temperature calculation parameter in response to the first request. The at least one logic circuit is configured to receive, via the interface, a second request corresponding to a sensor ID; and transmit, via the interface, a digital value in response to the second request. The digital value adjusted based on the at least one temperature calculation parameter corresponds to an absolute temperature of the print apparatus component.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn
  • Patent number: 11318752
    Abstract: A logic circuitry package for a replaceable print apparatus component includes an analog sensor cell block with a plurality of sensor cells, analog control circuitry to bias and control the analog sensor cell block, an interface to communicate with a print apparatus logic circuit, a dedicated bit field that indicates whether the logic circuitry package is in a power saving mode, and at least one logic circuit. The at least one logic circuit may be configured to receive, via the interface, a request to cause the analog sensor cell block to provide sensor information for at least one sensor measurement; and selectively enable and disable power to the analog control circuitry based on the request and a value of the dedicated bit field.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn