Patents by Inventor James Phillip Young

James Phillip Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154639
    Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 9, 2024
    Inventor: James Phillip YOUNG
  • Patent number: 11817895
    Abstract: Methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, a method of manufacturing a radio-frequency device can include providing a semiconductor die including a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the semiconductor die. The method can further include mounting a filter device on the first side of the semiconductor die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in a layer on the first side of the semiconductor die and at least some of the vias coupled with the radio-frequency circuit to support an electrical connection between the radio-frequency circuit and mounting features on the second side of the semiconductor die.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: November 14, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventor: James Phillip Young
  • Patent number: 11729645
    Abstract: According to some implementations, a radio-frequency (RF) device includes a communication interface coupled to a serial bus. The RF device also includes a monitoring component coupled to the communication interface, the monitoring component configured to monitor the serial bus for first data transmitted to a first device coupled to the serial bus and configure the RF device based on the first data.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: August 15, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: David Steven Ripley, James Henry Ross, Philip John Lehtola, David Richard Pehlke, James Phillip Young, Gregory A. Blum, David Alan Brown
  • Publication number: 20220255577
    Abstract: Methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, a method of manufacturing a radio-frequency device can include providing a semiconductor die including a radio-frequency circuit, a first side and a second side, and a plurality of vias, each via configured to provide an electrical connection between the first side and the second side of the semiconductor die. The method can further include mounting a filter device on the first side of the semiconductor die, the filter device in communication with the radio-frequency circuit, the radio-frequency circuit implemented in a layer on the first side of the semiconductor die and at least some of the vias coupled with the radio-frequency circuit to support an electrical connection between the radio-frequency circuit and mounting features on the second side of the semiconductor die.
    Type: Application
    Filed: February 7, 2022
    Publication date: August 11, 2022
    Inventor: James Phillip YOUNG
  • Patent number: 11245433
    Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
    Type: Grant
    Filed: March 15, 2020
    Date of Patent: February 8, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventor: James Phillip Young
  • Publication number: 20210211909
    Abstract: According to some implementations, a radio-frequency (RF) device includes a communication interface coupled to a serial bus. The RF device also includes a monitoring component coupled to the communication interface, the monitoring component configured to monitor the serial bus for first data transmitted to a first device coupled to the serial bus and configure the RF device based on the first data.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 8, 2021
    Inventors: David Steven RIPLEY, James Henry ROSS, Philip John LEHTOLA, David Richard PEHLKE, James Phillip YOUNG, Gregory A. BLUM, David Alan BROWN
  • Patent number: 10886953
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: January 5, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jinghang Feng, Shuqi Zheng, Netsanet Gebeyehu, Ying Shi, James Phillip Young
  • Patent number: 10880764
    Abstract: According to some implementations, a radio-frequency (RF) device includes a communication interface coupled to a serial bus. The RF device also includes a monitoring component coupled to the communication interface, the monitoring component configured to monitor the serial bus for first data transmitted to a first device coupled to the serial bus and configure the RF device based on the first data.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: December 29, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: David Steven Ripley, James Henry Ross, Philip John Lehtola, David Richard Pehlke, James Phillip Young, Gregory A. Blum, David Alan Brown
  • Publication number: 20200321996
    Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
    Type: Application
    Filed: March 15, 2020
    Publication date: October 8, 2020
    Inventor: James Phillip YOUNG
  • Publication number: 20200162115
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Application
    Filed: July 16, 2019
    Publication date: May 21, 2020
    Inventors: Jinghang FENG, Shuqi ZHENG, Netsanet GEBEYEHU, Ying SHI, James Phillip YOUNG
  • Patent number: 10594355
    Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: March 17, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventor: James Phillip Young
  • Patent number: 10547305
    Abstract: A switch control circuit includes a positive voltage bias node, a voltage-regulated positive supply rail coupled to the positive voltage bias node, a charge pump coupled to a charge pump supply node, and a current source positive supply rail coupled to the charge pump supply node and configured to supply the charge pump.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: January 28, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Leo John Wilz, Jonathan Christian Crandall, David Steven Ripley, James Phillip Young
  • Patent number: 10355724
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: July 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jinghang Feng, Shuqi Zheng, Netsanet Gebeyehu, Ying Shi, James Phillip Young
  • Publication number: 20190181812
    Abstract: Aspects of this disclosure relate to systems and methods of performing dynamic impedance tuning. Certain aspects may be performed by or include a dynamic impedance matching network. The dynamic impedance matching network can determine a desired output power for a power amplifier, true power information for the power amplifier, and an output power delivered to a load by the power amplifier. In addition, the dynamic impedance matching network can determine whether the output power satisfies the true power information. Responsive to this determination, the dynamic impedance matching network may modify a load line impedance for the power amplifier using an impedance tuning network.
    Type: Application
    Filed: November 1, 2018
    Publication date: June 13, 2019
    Inventors: James Phillip Young, Joel Anthony Penticoff
  • Publication number: 20190036524
    Abstract: A switch control circuit includes a positive voltage bias node, a voltage-regulated positive supply rail coupled to the positive voltage bias node, a charge pump coupled to a charge pump supply node, and a current source positive supply rail coupled to the charge pump supply node and configured to supply the charge pump.
    Type: Application
    Filed: September 14, 2018
    Publication date: January 31, 2019
    Inventors: Leo John WILZ, Jonathan Christian CRANDALL, David Steven RIPLEY, James Phillip YOUNG
  • Patent number: 10122331
    Abstract: Aspects of this disclosure relate to systems and methods of performing dynamic impedance tuning. Certain aspects may be performed by or include a dynamic impedance matching network. The dynamic impedance matching network can determine a desired output power for a power amplifier, true power information for the power amplifier, and an output power delivered to a load by the power amplifier. In addition, the dynamic impedance matching network can determine whether the output power satisfies the true power information. Responsive to this determination, the dynamic impedance matching network may modify a load line impedance for the power amplifier using an impedance tuning network.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: November 6, 2018
    Assignee: Skyworks, Inc.
    Inventors: James Phillip Young, Joel Anthony Penticoff
  • Patent number: 10103726
    Abstract: A switch bias control circuit includes a level shifter and voltage regulator circuitry configured to receive a voltage reference signal, provide a first voltage output at a first node and provide a second voltage output at a second node, the first node and the second node being at least partially isolated from one another. coupling circuitry couples the first node to the level shifter and couples the second node to a negative voltage generator.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 16, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Leo John Wilz, Jonathan Christian Crandall, David Steven Ripley, James Phillip Young
  • Publication number: 20180227000
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 9, 2018
    Inventors: Jinghang FENG, Shuqi ZHENG, Netsanet GEBEYEHU, Ying SHI, James Phillip YOUNG
  • Patent number: 9917938
    Abstract: According to one aspect, embodiments of the invention provide a wireless device comprising an overstress indicator circuit including a sense circuit configured to monitor a parameter of the wireless device and generate a sense signal corresponding to the parameter, a detection circuit configured to receive the sense signal from the sense circuit and generate a detection signal in response to a determination that the sense signal is indicative of an overstress condition in the device, an interface circuit, and a memory circuit coupled to the detection circuit and the interface circuit and configured to store an overstress condition indication for access via the interface circuit in response to receiving the detection signal, at least one power amplifier coupled to the interface circuit, and a transceiver coupled to the at least one power amplifier and configured to produce an RF transmit signal and to receive an RF receive signal.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: March 13, 2018
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: James Phillip Young, Matthew Lee Banowetz, Leo John Wilz, Ali J. Mahmud
  • Patent number: 9882587
    Abstract: Systems, devices and methods related to multi-band power amplifier. In some embodiments, a power amplifier module includes a power amplifier having an output stage and configured to receive a signal. The power amplifier module also includes a first programmable harmonic termination circuit in electrical communication with the output stage of the power amplifier. The first programmable harmonic termination circuit includes a first plurality of capacitors and a first plurality of switches, with at least one of the first plurality of capacitors being in electrical communication with at least one of the first plurality of switches. The power amplifier module further includes a controller configured to modify a configuration of the first plurality of switches of the first programmable harmonic termination circuit based at least in part on a second harmonic frequency of the signal.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: January 30, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jinghang Feng, Shuqi Zheng, Netsanet Gebeyehu, Ying Shi, James Phillip Young